Lead frame for a package for a semiconductor device, semiconductor device and process for manufacturing a semiconductor device
A lead frame for an integrated electronic device includes a die pad made of a first metallic material. A top coating layer formed by a second metallic material is arranged on a top surface of the die pad. The second metallic material has an oxidation rate lower than the first metallic material. The top coating layer leaves exposed a number of corner portions of the top surface of the die pad. A subsequent heating operation, for example occurring in connection with wirebonding, causes an oxidized layer to form on the corner portions of the top surface of the die pad at a position in contact with the top coating layer.
1. A lead frame for an integrated electronic device, comprising:
a die pad made of a first metallic material and including a top surface; and
a top coating layer made of a second metallic material and arranged in contact with the top surface, wherein the second metallic material has an oxidation rate lower than an oxidation rate of the first metallic material;
wherein said top coating layer covers all of the top surface except for corner portions of the top surface of the die pad that are not covered by said top coating layer and which are separate from each another; and
an oxidized coating covering the top surface of the die pad at the corner portions that are not covered by said top coating layer, wherein the oxidized coating is laterally in contact with the top coating layer.
2. The lead frame according to claim 1 , wherein the die pad includes a number of edges at locations where sides of the die pad intersect; and wherein each edge is perpendicular to a corresponding corner portion with which it is in direct contact.
3. The lead frame according to claim 1 , wherein each corner portion has a squared shape.
4. The lead frame according to claim 1 , wherein the die pad is supported by a main body, and wherein the die pad and main body form a single piece.
5. The lead frame according to claim 1 , further comprising a plurality of pads having top surfaces coated by coating regions made of the second metallic material.
6. The lead frame according to claim 5 , wherein the die pad and plurality of pads are supported by a main body, and wherein the die pad, plurality of pads and main body form a single piece.
7. A lead frame, comprising:
a die pad made of a first metallic material and including a top surface; and
a top coating layer made of a second metallic material and arranged in contact with the top surface, wherein the second metallic material has an oxidation rate lower than an oxidation rate of the first metallic material;
wherein said top coating layer covers all of the top surface except for corner portions of the top surface of the die pad that are not covered by said top coating layer and which are separate from each another;
a ground ring laterally surrounding the die pad and including a top surface, wherein the ground ring has a shape of a squared frame; and
an additional top coating layer made of the second metallic material and arranged in contact with the top surface of the ground ring; and
wherein corner portions of the top surface of the ground ring are not covered by said additional top coating layer.
8. The lead frame according to claim 7 , wherein the die pad and the ground ring are supported by a main body, and wherein the die pad, ground ring and main body form a single piece.
9. The lead frame according to claim 7 , further comprising an oxidized coating covering the top surface of the die pad at the corner portions that are not covered by said top coating layer and covering the top surface of the ground ring at the corner portions that are not covered by said additional top coating layer, wherein the oxidized coating is laterally in contact with the top coating layer and is laterally in contact with the additional top coating layer.
10. The lead frame according to claim 7 , wherein the die pad includes a number of edges at locations where sides of the die pad intersect; and wherein each edge is perpendicular to a corresponding corner portion with which it is in direct contact.
11. The lead frame according to claim 7 , wherein each corner portion has a squared shape.
12. The lead frame according to claim 7 , wherein the die pad is supported by a main body, and wherein the die pad and main body form a single piece.
13. The lead frame according to claim 7 , further comprising a plurality of pads having top surfaces coated by coating regions made of the second metallic material.
14. The lead frame according to claim 13 , wherein the die pad and plurality of pads are supported by a main body, and wherein the die pad, plurality of pads and main body form a single piece.
15. The lead frame according to claim 7 , further comprising an oxidized coating covering the top surface of the die pad at the corner portions that are not covered by said top coating layer, wherein the oxidized coating is laterally in contact with the top coating layer.
16. A lead frame, comprising:
a die pad made of a first metallic material and including a top surface; and
a top coating layer made of a second metallic material and arranged in contact with the top surface, wherein the second metallic material has an oxidation rate lower than an oxidation rate of the first metallic material;
wherein said top coating layer covers all of the top surface except for corner portions of the top surface of the die pad that are not covered by said top coating layer and which are separate from each another;
an inner frame which laterally surrounds the die pad;
an outer frame which laterally surrounds the inner frame;
a plurality of tie bars interposed between the outer frame and the inner frame; and
a further top coating layer made of the second metallic material and arranged in contact with top surfaces of the inner frame and outer frame;
wherein portions of the inner frame at locations where the inner frame is connected with the tie bars are not covered by said further top coating layer.
17. The lead frame according to claim 16 , wherein top surfaces of the tie bars are not covered by said further top coating layer.
18. The lead frame according to claim 16 , wherein the inner frame and the outer frame have different heights, and wherein each tie bar includes a corresponding slanted portion to transition between said different heights.
19. The lead frame according to claim 16 , further comprising:
a bottom coating structure extending under the die pad and the inner frame; and
an outer bottom coating region extending under the outer frame; and
wherein portions of a bottom surface of the inner frame at locations where the inner frame is connected with the tie bars are not covered by said outer bottom coating region.
20. The lead frame according to claim 16 , further comprising an oxidized coating covering the top surface of the die pad at the corner portions that are not covered by said top coating layer and covering the portions of the inner frame that are not covered by said further top coating layer, wherein the oxidized coating is laterally in contact with the top coating layer and is laterally in contact with the further top coating layer.
21. The lead frame according to claim 16 , wherein the die pad includes a number of edges at locations where sides of the die pad intersect; and wherein each edge is perpendicular to a corresponding corner portion with which it is in direct contact.
22. The lead frame according to claim 16 , wherein each corner portion has a squared shape.
23. The lead frame according to claim 16 , wherein the die pad is supported by a main body, and wherein the die pad and main body form a single piece.
24. The lead frame according to claim 16 , further comprising a plurality of pads having top surfaces coated by coating regions made of the second metallic material.
25. The lead frame according to claim 24 , wherein the die pad and plurality of pads are supported by a main body, and wherein the die pad, plurality of pads and main body form a single piece.
26. The lead frame according to claim 16 , further comprising an oxidized coating covering the top surface of the die pad at the corner portions that are not covered by said top coating layer, wherein the oxidized coating is laterally in contact with the top coating layer.