Driver board assemblies and methods of forming the same

1. A method of manufacturing a driver board assembly, the method comprising:

encapsulating one or more power device assemblies within a first layer of a printed circuit board (PCB) such that the first layer surrounds the one or more power device assemblies;

forming a first portion of one or more cooling channels within a surface of the first layer such that the one or more cooling channels extend proximate to the one or more power device assemblies;

forming a second portion of the one or more cooling channels within a surface of a second layer of the PCB;

forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels; and

bonding the second layer and the first layer such that the first portion and the second portion are aligned to define and to enclose the one or more cooling channels between the first layer and the second layer.

2. The method of claim 1 , further comprising arranging the one or more power devices assemblies in an inverter topology.

3. The method of claim 1 , further comprising:

forming an inlet channel within at least one of the surface of the first layer and a surface of the second layer, the inlet channel comprising an inlet port configured to fluidly couple the one or more cooling channels to a coolant source; and

forming an outlet channel within at least one of the surface of the first layer and the surface of the second layer, the outlet channel comprising an outlet port for removal of coolant from the one or more cooling channels.

4. The method of claim 3 , wherein:

the inlet channel comprises a first inlet channel portion formed within the first layer and a second inlet channel portion formed within the second layer, and the first inlet channel portion and the second inlet channel portion;

the outlet channel comprises a first outlet channel portion formed within the first layer and a second outlet channel portion formed within the second layer; and

bonding of the first layer to the second layer combines a volume of the first inlet channel portion with the second inlet channel portion and combines a volume of the first outlet channel portion and the second outlet channel portion.

5. The method of claim 3 , wherein forming the one or more cooling channels comprises forming one or more lateral channels extending between and fluidly coupled to the inlet channel and the outlet channel.

6. The method of claim 1 , further comprising:

forming the one or more power device assemblies by:

embedding a power device within a first conductive substrate comprising a recess configured to receive the power device;

bonding an insulation layer to the first conductive substrate; and

bonding a second conductive substrate to the first conductive substrate such that the insulation layer electrically insulates the first conductive substrate from the second conductive substrate.

7. A driver board assembly, comprising:

a first layer of a PCB;

one or more power device assemblies embedded within the first layer, the first layer encapsulating the one or more power device assemblies, the first layer surrounds the one or more power device assemblies;

one or more cooling channels formed within a surface of the first layer such that the one or more cooling channels extend proximate to the one or more power device assemblies;

a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels; and

a second layer of the PCB bonded to the first layer to enclose the one or more cooling channels between the first layer and the second layer,

wherein each of the one or more cooling channels is at least partially formed in each of the first layer and the second layer.

8. The driver board assembly of claim 7 , wherein the one or more power device assemblies comprise a plurality of power device assemblies arranged in an inverter topology.

9. The driver board assembly of claim 7 , further comprising:

an inlet channel comprising an inlet port fluidly coupled to the one or more cooling channels, the inlet channel configured to fluidly couple the one or more cooling channels to a coolant source; and

an outlet channel comprising an outlet port fluidly coupled to the one or more cooling channels and configured to facilitate removal of coolant from the one or more cooling channels.

10. The driver board assembly of claim 9 , wherein each of the inlet channel and the outlet channel are at least partially formed in each of the first layer and the second layer.

11. The driver board assembly of claim 7 , wherein the plurality of thermally conductive vias extend through a channel wall, the channel wall separates each of the one or more cooling channels.

12. The driver board assembly of claim 7 , wherein each of the one or more power device assemblies comprise:

a first conductive substrate comprising a recess;

a power device positioned within the recess;

an insulation layer bonded to the first conductive substrate; and

a second conductive substrate bonded to the first conductive substrate such that the insulation layer electrically insulates the first conductive substrate from the second conductive substrate.

13. A driver board assembly, comprising:

a first layer of a PCB;

one or more power device assemblies embedded within the first layer, the first layer encapsulating the one or more power device assemblies, the first layer surrounds the one or more power device assemblies;

one or more cooling channels formed within a surface of the first layer such that the one or more cooling channels extend proximate to the one or more power device assemblies; and

a second layer of the PCB bonded to the first layer to enclose the one or more cooling channels between the first layer and the second layer,

wherein each of the one or more cooling channels is at least partially formed in each of the first layer and the second layer.

14. The driver board assembly of claim 13 , wherein the one or more cooling channels are spaced from the one or more power device assemblies via an insulation layer having a thickness of about 100 μm or less.

15. The driver board assembly of claim 13 , further comprising:

the one or more power device assemblies comprising a plurality of power device assemblies;

a first pair of the plurality of power device assemblies; and

a second pair of the plurality of power device assemblies, wherein the one or more cooling channels comprise:

a first lateral channel extending beneath the first pair of power device assemblies; and

a second lateral channel extending beneath the second pair of power device assemblies.

16. The driver board assembly of claim 13 , wherein the one or more power device assemblies comprise a plurality of power device assemblies arranged in an inverter topology.

17. The driver board assembly of claim 13 , further comprising:

an inlet channel comprising an inlet port fluidly coupled to the one or more cooling channels, the inlet channel configured to fluidly couple the one or more cooling channels to a coolant source; and

an outlet channel comprising an outlet port fluidly coupled to the one or more cooling channels, and configured to facilitate removal of coolant from the one or more cooling channels.

18. The driver board assembly of claim 17 , wherein each of the inlet channel and the outlet channel are at least partially formed in each of the first layer and the second layer.

19. The method of claim 1 , further comprising forming a conductive pathway electrically coupled to the one or more power devices.

20. The method of claim 1 , wherein encapsulating one or more power device assemblies within the first layer comprises forming the first layer in contact with the one or more power device assemblies.