IP Library Granted Patent US 11,674,063
Granted Patent B2
US 11,674,063 · App. 16/956,803 · Granted Jun 13, 2023

Epoxy resin adhesive compositions

Inventors: Felix Koch (Horgen, CH); Andreas Lutz (Horgen, CH); Beda Steiner (Horgen, CH); Cathy Grossnickel (Horgen, CH); Jeannine Flueckiger (Horgen, CH)
Assignee: DDP Specialty Electronic Materials US, LLC
C09J163/00C08K3/22C08K2003/2296C08K2201/005C08K2201/011
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Quick Facts
Patent No.
US 11,674,063
App. No.
16/956,803
Granted
Jun 13, 2023
Kind
B2
Abstract

Disclosed are one-component epoxy resin adhesive compositions which include (a) one or more non-rubber-modified epoxy resins; (b) one or more latent epoxy curing agents; (c) one or more toughening agents; and (d) zinc oxide nanoparticles. The one-component epoxy resin adhesive compositions exhibit improved toughness of the adhesive as measured by its lap shear strength as well as improved environmental stability, i.e., corrosion protection, by addition of the zinc oxide nanoparticles when applied to metal substrates.

Claims (33)

1. A one-component epoxy resin adhesive composition comprising:

(a) one or more non-rubber-modified epoxy resins;

(b) one or more latent epoxy curing agents, wherein the one or more latent epoxy curing agents comprises a dicyanamide and one or more urea compounds having one or more urea groups and a molecular weight per urea group of up to 250;

(c) one or more toughening agents; and

(d) 0.1 to 5 wt % zinc oxide nanoparticles, wherein the zinc oxide nanoparticles have an average particle size from 10 nm to 100 nm.

2. The one-component epoxy resin adhesive composition according to claim 1 , wherein the one or more non-rubber-modified epoxy resins comprise one or more liquid non-rubber-modified epoxy resins.

3. The one-component epoxy resin adhesive composition according to claim 2 , wherein the one or more liquid non-rubber-modified epoxy resins have an epoxy equivalent weight of from 150 to 299 g/mol.

4. The one-component epoxy resin adhesive composition according to claim 1 , wherein the one or more non-rubber-modified epoxy resins comprise at least 60% by weight of a liquid diglycidyl ether of a polyhydric phenol having an epoxy equivalent weight of from 150 to 299 g/mol.

5. The one-component epoxy resin adhesive composition according to claim 1 , wherein the one or more urea compounds comprise at least one of isophorone bis(dimethyl urea), 2,4′- and/or 4,4′-methylene bis(phenyl dimethyl urea) and 2,4- and/or 2,6-toluene bis(dimethyl urea).

6. The one-component epoxy resin adhesive composition according to claim 1 , wherein the one or more toughening agents comprise a reactive elastomeric toughener having capped isocyanate groups, wherein the reactive elastomeric toughener comprises a chain-extended and then isocyanate-capped mixture of (i) a 1000 to 10,000 number average molecular weight isocyanate-terminated polyether and (ii) a 1000 to 10,000 number average molecular weight isocyanate-terminated diene polymer.

7. The one-component epoxy resin adhesive composition according to claim 1 , comprising

(a) at least 20 weight percent, based on the total weight of the adhesive composition, of the one or more non-rubber-modified epoxy resins;

(b) the one or more latent epoxy curing agents in an amount sufficient to cure the adhesive composition;

(c) 0.5 to 40 weight percent, based on the total weight of the adhesive composition, of the one or more toughening agents; and

(d) 0.1 to 5 weight percent, based on the total weight of the adhesive composition, of the zinc oxide nanoparticles.

8. The one-component epoxy resin adhesive composition according to claim 1 , further comprising a core shell rubber.

9. A method comprising:

(a) applying a one-component epoxy resin adhesive composition to at least a portion of a one substrate, wherein the one-component epoxy resin adhesive composition comprises:

(i) one or more non-rubber-modified epoxy resins;

(ii) one or more latent epoxy curing agents, wherein the one or more latent epoxy curing agents comprises a dicyanamide and one or more urea compounds having one or more urea groups and a molecular weight per urea group of up to 250;

(iii) one or more toughening agents; and

(iv) 0.1 to 5 wt % zinc oxide nanoparticles, wherein the zinc oxide nanoparticles have an average particle size of from 10 nm to 100 nm,

(b) contacting a second substrate with the first substrate; and

(c) curing the one-component epoxy resin adhesive composition to form an adhesive bond between the first and second substrates.

10. The method according to claim 9 , wherein the one or more non-rubber-modified epoxy resins comprise one or more liquid non-rubber-modified epoxy resins.

11. The method according to claim 10 , wherein the one or more liquid non-rubber-modified epoxy resins have an epoxy equivalent weight of from 150 to 299 g/mol.

12. The method according to claim 9 , wherein the one or more toughening agents comprises a reactive elastomeric toughener having capped isocyanate groups, which reactive elastomeric toughener includes a chain-extended and then isocyanate-capped mixture of (i) a 1000 to 10,000 number average molecular weight isocyanate-terminated polyether and (ii) a 1000 to 10,000 number average molecular weight isocyanate-terminated diene polymer.

13. The method according to claim 9 , wherein the one-component epoxy resin adhesive composition comprises

(a) at least 20 weight percent, based on the total weight of the adhesive composition, of the one or more non-rubber-modified epoxy resins;

(b) the one or more latent epoxy curing agents in an amount sufficient to cure the adhesive composition;

(c) 0.5 to 40 weight percent, based on the total weight of the adhesive composition, of the one or more toughening agents; and

(d) 0.1 to 5 weight percent, based on the total weight of the adhesive composition, of the zinc oxide nanoparticles.

14. The method according to claim 9 , wherein the first substrate is a metal substrate and the second substrate is a metal substrate having a zinc-containing layer thereon.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2021
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 055763/0597 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2021
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 056351/0195 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2021
From: KOCH, FELIX; LUTZ, ANDREAS; STEINER, BEDA; GROSSNICKEL, CATHY; FLUECKIGER, JEANNINE
To: DOW EUROPE GMBH
Reel/Frame 055409/0060 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2021
From: DOW EUROPE GMBH
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 055409/0104 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2021
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
Reel/Frame 055409/0330 →
CHANGE OF NAME Recorded Feb 25, 2021
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 055409/0744 →
Continuity (2)
Provisional Application 62614660 · Jan 8, 2018
Related Publication 20210062054A1 · Mar 4, 2021