Heating device for carrying out temperature-dependent tests on electronic components arranged in a socket

1. A heating assembly ( 10 , 15 ) for generating heat and carrying out temperature-dependent tests on an electronic component ( 3 , 200 ) of BGA type when arranged, in use, inside a socket ( 2 ) comprising an array of electric contacts engaging with the array of electric contacts of the electronic component, the heating assembly ( 10 , 15 ) comprising:

a heating device ( 10 ) electrically conductive in such a manner as to allow passage of electrical current to produce heat;

characterized in that the heating assembly further comprises:

a covering ( 15 ) of a thermally insulating material for limiting heat dispersion and suitable for containing said heating device ( 10 ) inside, the covering generally being box-shaped providing lateral walls ( 15 L) and a lower wall ( 15 I) in such a manner as to form a thermally insulated housing for the heating device and having, at the opposite side to said lower wall ( 15 I), at least one opening for allowing heat diffusion outwards of the covering;

fastening means for fastening said covering ( 15 ) to a support surface ( 5 B) outside the socket, said fastening means being arranged in such a manner that, in use, the opening faces said support surface ( 5 B) as the covering is fastened to said support surface.

2. A heating assembly ( 10 , 15 ), according to claim 1 , wherein said lateral walls ( 15 L) and said lower wall ( 15 I) are substantially lacking openings.

3. A heating device ( 10 , 15 ), according to claim 1 , wherein said fastening means are of a removable type in such a manner that said heating assembly ( 10 , 15 ) can be applied to said support surface ( 5 B) in a removable manner.

4. A heating assembly ( 10 , 15 ), according to claim 1 , wherein said passage is in form of at least one opening realized in the covering.

5. A heating assembly ( 10 , 15 ), according to claim 1 , wherein a layer of thermally conductive material applied in correspondence of said opening of the covering is further comprised in order to facilitate heat transfer.

6. A heating assembly ( 10 , 15 ), according to claim 5 , wherein said layer of thermally conductive material is arranged in correspondence of a surface of the heating device ( 10 ) in such a manner as to obstruct at least in part said opening for passage of heat such that said layer is interposed between the support surface ( 5 B), to which is applied the heating assembly in use, and the surface of the heating device ( 10 ) which faces said passage of heat.

7. A heating assembly ( 10 , 15 ), according to claim 1 , wherein said heating assembly ( 10 ) is in the form of a multi-layer.

8. A heating assembly ( 10 , 15 ), according to claim 7 , wherein the multi-layer comprises one or more layers of electrically conductive material and wherein a layer of electrically conductive material ( 25 ) is insulated from a further layer of electrically conductive material ( 25 ) by means of interposition of a layer of insulating material ( 30 ), at least one or more of said layers of electrically conductive material comprising a resistance ( 33 ) for the passage of electrical current.

9. A heating assembly ( 10 , 15 ), according to claim 8 , wherein said resistance ( 33 ) is in the form of an incision obtained directly on the layer of electrically conductive material ( 25 ).

10. A heating assembly ( 10 , 15 ), according to claim 1 , wherein the covering ( 15 ) is made at least in part of thermally insulating materials, such as: Plastic; Teflon plastic; PEEK; Aerogel; Silicone foam.

11. A printed circuit board ( 5 ) comprising:

an upper surface ( 5 A) equipped with an array of contacts on which a socket can be arranged and connected for testing an electronic component ( 3 ) of BGA type;

a lower surface ( 5 B), characterized in that the printed circuit board ( 5 ) comprises a heating assembly ( 10 , 15 ) according to claim 1 applied in a fixed or removable manner.

12. A printed circuit board ( 5 ), according to claim 11 , wherein said heating assembly is applied in correspondence of the lower surface ( 5 B), substantially inside an area delimiting the housing of said array of electrical contacts.

13. A method for carrying out temperature-dependent tests on an electronic component ( 3 , 200 ) of BGA type equipped with an array of contacts, the method comprising the steps of:

arrangement of the electronic component ( 3 , 200 ) of BGA type inside a socket ( 2 ) comprising an array of electric contacts engaged with the array of electric contacts of the electronic component;

arrangement of a heating assembly comprising:

an electrically conductive heating device ( 10 ), preferably multi-layer, in such a manner as to allow passage of electrical current to produce heat;

a covering ( 15 ) of a thermally insulating material for limiting heat dispersion, the covering generally being box-shaped and providing lateral walls ( 15 L) and a lower wall ( 151 ), said lateral walls being preferably substantially lacking openings, in such a manner as to form a thermally insulated housing for the heating device and having, at the opposite side to said lower wall ( 151 ), at least one opening for allowing heat diffusion outwards of the covering;

the heating device being arranged inside said covering ( 15 );

fastening of the said heating assembly, formed by the covering in which the said heating device is arranged, outside the socket in such a manner that the opening for passage of heat faces the socket;

activation in such a manner that the heating device electrically powered produces heat that radiates towards the electronic component to be tested arranged inside the socket.

14. A method, according to claim 13 , wherein said heating assembly is applied below a cradle ( 2 A) into which the electronic component to be tested is arranged.

15. A method, according to claim 13 , wherein the socket is connected to a printed circuit board ( 5 ) in such a manner that the array of contacts of the socket is to engaged with the arrays of contacts of the said printed circuit board ( 5 ) and with the heating assembly which is fastened to the said printed circuit board ( 5 ) in correspondence of a side ( 5 B) opposed to that one of connection between the socket and the printed circuit board.

16. A method, according to claim 13 , wherein the fastening of the heating assembly occurs by means of fastening screws or removable systems of in general.

17. A method, according to claim 13 , wherein an application is provided of a layer of thermally conductive material interposed between a lower surface ( 5 B) and the opening for the passage of heat of said heating assembly ( 10 ).