Display backplane and method of manufacturing the same, display device

1. A display backplane having a plurality of sub-pixel regions, comprising:

a base;

a plurality of driving electrodes disposed above the base, at least two of the plurality of driving electrodes being located in one of the plurality of sub-pixel regions;

a connection structure disposed on at least one of the plurality of driving electrodes, an orthographic projection of the connection structure on the base being within an orthographic projection of a corresponding driving electrode on the base; and

at least one driving transistor located in one of the plurality of sub-pixel regions and disposed on the base;

wherein the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode,

wherein the at least two driving electrodes are located on a side of a corresponding driving transistor facing away from the base, and

wherein one of every two driving electrodes in a same sub-pixel region is electrically connected to a corresponding driving transistor.

2. The display backplane according to claim 1 , wherein the first included angle is within a range from 85° to 95° , inclusive.

3. The display backplane according to claim 1 , wherein the connection structure further includes a bottom portion connected to the at least one conductive portion, and the bottom portion is directly in contact with the corresponding driving electrode.

4. The display backplane according to claim 3 , wherein the at least one conductive portion and the bottom portion in a same connection structure are an integrated structure.

5. The display backplane according to claim 3 , wherein the at least one conductive portion includes a plurality of conductive portions, and the plurality of conductive portions are arranged at intervals around a contour of the bottom portion.

6. The display backplane according to claim 1 , wherein an orthographic projection of the at least one conductive portion on the base is in a closed shape.

7. The display backplane according to claim 6 , wherein the at least one conductive portion has a tubular structure.

8. The display backplane according to claim 1 , wherein the at least one conductive portion has a tubular structure with a side wall, the side wall includes at least one crack, and the at least one crack extends to a surface of an end wall on a side of the tubular structure away from the driving electrode.

9. The display backplane according to claim 1 , wherein a hardness of the at least one conductive portion is greater than a hardness of the corresponding driving electrode.

10. The display backplane according to claim 9 , wherein a material of the at least one conductive portion includes tungsten, titanium or molybdenum.

11. The display backplane according to claim 1 , further comprising a conductive plating layer disposed on the at least one conductive portion in each connection structure.

12. A method of manufacturing a display backplane having a plurality of sub-pixel regions, comprising:

providing a base;

forming a plurality of driving electrodes above the base, at least two of the plurality of driving electrodes being located in one of the plurality of sub-pixel regions;

forming a connection structure on at least one of the plurality of driving electrodes, an orthographic projection of the connection structure on the base being within an orthographic projection of a corresponding driving electrode on the base, and the connection structure including at least one conductive portion disposed at a first included angle with the corresponding driving electrode; and

forming at least one driving transistor located in one of the plurality of sub-pixel regions and disposed on the base, the at least two driving electrodes being located on a side of a corresponding driving transistor facing away from the base, and one of every two driving electrodes in a same sub-pixel region being electrically connected to a corresponding driving transistor.

13. The method of manufacturing the display backplane according to claim 12 , wherein forming the connection structure on at least one of the plurality of driving electrodes, includes:

forming a first target layer and a second target layer in a stack on a side of at least one of the plurality of driving electrodes facing away from the base, and a hardness of the second target layer being greater than a hardness of the first target layer;

forming at least one through hole penetrating through the second target layer and the first target layer, the at least one through hole being located in a region where the at least one of the plurality of driving electrodes is located, and the at least one through hole being in a one-to-one correspondence with the at least one driving electrode;

depositing a first metal film, and a portion of the first metal film in each through hole of the at least one through hole being electrically connected to a corresponding driving electrode;

patterning the first metal film to retain the portion of the first metal film in each through hole; and

removing the second target layer and the first target layer to form the connection structure.

14. The method of manufacturing the display backplane according to claim 13 , wherein after the first metal film is deposited and before the first metal film is patterned, the method of manufacturing the display backplane further comprises:

forming a photoresist on the portion of the first metal film in each through hole by a coating process;

patterning the first metal film, further includes: patterning the first metal film by chemical mechanical polishing; and

removing the second target layer and the first target layer to form the connection structure, further includes:

removing the second target layer, the first target layer and the photoresist to form the connection structure.

15. The method of manufacturing the display backplane according to claim 13 , wherein after the first metal film is deposited and before the first metal film is patterned, the method of manufacturing the display backplane further comprises:

forming a photoresist by a coating process, and the photoresist at least covering the portion of the first metal film in each through hole; and

patterning the photoresist to retain a portion of the photoresist in each through hole, wherein taking a surface of the base as a reference plane, a surface of the patterned photoresist facing away from the base is not lower than a surface of the first metal film facing away from the base, and a dimension of an orthographic projection of the portion of the patterned photoresist in each through hole on the base is same as or approximately same as an aperture of a corresponding through hole; and

removing the second target layer and the first target layer to form the connection structure, further includes:

removing the second target layer, the first target layer and the patterned photoresist to form the connection structure.

16. The method of manufacturing the display backplane according to claim 13 , wherein

a material of the first target layer is an organic insulating material;

or, a material of the second target layer is one of an inorganic insulating material and a metal material;

or, a material of the first target layer is an organic insulating material, and a material of the second target layer is one of an inorganic insulating material and a metal material.

17. A display device, comprising:

the display backplane according to claim 1 ; and

a micro light-emitting diode electrically connected to every two connection structures in the display backplane correspondingly.