Display device and manufacturing method thereof, electronic device

1. A display device, comprising:

a silicon-based organic light-emitting display panel comprising a silicon substrate, a first electrode of a display component, an organic light-emitting layer, and a second electrode of the display component, which are stacked sequentially;

a heat dissipation film layer at a non-display side of the silicon-based organic light-emitting display panel; and

a flexible circuit board which is at least partially at a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel, and is electrically connected to the silicon-based organic light-emitting display panel,

wherein the silicon substrate is integrated with a gate drive circuit, a data drive circuit, and a pixel circuit, and the flexible circuit board is configured to transmit electrical signals to the gate drive circuit, the data drive circuit, and the second electrode of the display component, and

wherein the flexible circuit board is provided with at least one through-hole, and an orthographic projection of the at least one through-hole on a plane parallel to the silicon-based organic light-emitting display panel at least partially overlaps an orthographic projection of the heat dissipation film layer on the plane parallel to the silicon-based organic light-emitting display panel.

2. The display device according to claim 1 , wherein the orthographic projection of the least one through-hole on the plane parallel to the silicon-based organic light-emitting display panel is within the orthographic projection of the heat dissipation film layer on the plane parallel to the silicon-based organic light-emitting display panel.

3. The display device according to claim 1 , wherein the silicon substrate comprises a display area and a periphery area which surrounds the display area, and the display component is in the display area; and

the flexible circuit board is connected to the periphery area of the silicon substrate, and is bended along an edge of the silicon substrate, so as to allow at least part of the flexible circuit board is at the side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel.

4. The display device according to claim 3 , wherein an orthographic projection of the heat dissipation film layer on a plane parallel to the silicon-based organic light-emitting display panel at least partially overlaps an orthographic projection of the display area on the plane parallel to the silicon-based organic light-emitting display panel; and

the orthographic projection of the heat dissipation film layer on the plane parallel to the silicon-based organic light-emitting display panel is within an orthographic projection of the silicon substrate on the plane parallel to the silicon-based organic light-emitting display panel.

5. The display device according to claim 1 , wherein an orthographic projection of the heat dissipation film layer on a plane parallel to the silicon-based organic light-emitting display panel is within an orthographic projection of the silicon-based organic light-emitting display panel on the plane parallel to the silicon-based organic light-emitting display panel.

6. The display device according to claim 1 , wherein the heat dissipation film layer comprises:

a first adhesive film layer adhered onto the flexible circuit board; and

a first heat dissipation film layer between the first adhesive film layer and the silicon substrate.

7. The display device according to claim 6 , wherein the heat dissipation film layer further comprises: a second heat dissipation film layer between the first heat dissipation film layer and the silicon substrate.

8. The display device according to claim 7 , wherein a material of the second heat dissipation film layer comprises graphite or graphene.

9. The display device according to claim 6 , wherein the heat dissipation film layer further comprises: a second adhesive film layer which is at a side of the first heat dissipation film layer closer to the silicon substrate, and is adhered onto the silicon-based organic light-emitting display panel.

10. The display device according to claim 9 , wherein a material of the first adhesive film layer and a material of the second adhesive film layer comprise an acrylic pressure-sensitive film.

11. The display device according to claim 1 , wherein a material of the first heat dissipation film layer is a metal.

12. The display device according to claim 11 , wherein the metal comprises copper, copper alloy, silver, silver alloy, aluminum or aluminum alloy.

13. The display device according to claim 1 , wherein the silicon-based organic light-emitting display panel further comprises:

a first film encapsulation layer and a second film encapsulation layer, which are sequentially provided at a side of the second electrode of the display component away from the organic light-emitting layer;

a color film layer between the first film encapsulation layer and the second film encapsulation layer; and

a cover plate at a side of the second film encapsulation layer away from the color film layer.

14. The display device according to claim 1 , further comprising a drive circuit, wherein the drive circuit is connected to the flexible circuit board, and is configured to provide drive signals to the silicon-based organic light-emitting display panel.

15. An electronic device, comprising the display device according to claim 1 , wherein the electronic device is a virtual reality device or an augmented reality device.

16. A manufacturing method of a display device, comprising:

providing a silicon-based organic light-emitting display panel;

forming a heat dissipation film layer at a non-display side of the silicon-based organic light-emitting display panel;

connecting a flexible circuit board to the silicon-based organic light-emitting display panel, and allowing at least part of the flexible circuit board to be at a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel; and

forming at least one through-hole in the flexible circuit board, wherein an orthographic projection of the least one through-hole on a plane parallel to the silicon-based organic light-emitting display panel at least partially overlaps an orthographic projection of the heat dissipation film layer on the plane parallel to the silicon-based organic light-emitting display panel.

17. The manufacturing method of the display device according to claim 16 , wherein connecting the flexible circuit board to the silicon-based organic light-emitting display panel, and allowing at least part of the flexible circuit board to be at the side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel comprises:

connecting the flexible circuit board to a display side of the silicon-based organic light-emitting display panel, and bending the flexible circuit board along an edge of the silicon-based organic light-emitting display panel, so as to allow at least part of the flexible circuit board to be at the side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel.

18. The manufacturing method of the display device according to claim 16 , wherein forming the heat dissipation film layer at the non-display side of the silicon-based organic light-emitting display panel, comprises:

forming a first adhesive film layer;

forming a first heat dissipation film layer on the first adhesive film layer by an evaporation process; and

forming a second heat dissipation film layer on the first heat dissipation film layer by an evaporation process.