Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux

1. A flux for soldering consisting of:

a total amount of 1 wt % or more and 40 wt % or less of a dimer acid, a trimer acid, or a combination thereof;

30 wt % or more and 99 wt % or less of a rosin;

0 wt % or more and 13 wt % or less of a solvent;

0 wt % or more and 4 wt % or less of an organic acid;

0 wt % or more and 2 wt % or less of an amine;

0 wt % or more and 5 wt % or less of an organic halogen compound;

0 wt % or more and 1 wt % or less of an amine hydrohalide salt;

0 wt % or more and 3 wt % or less of an antifoaming agent;

0 wt % or more and 5 wt % or less of a silicone oil;

0 wt % or more and 10 wt % or less of an organophosphorus compound; and

0 wt % or more and 40 wt % or less of an additional resin,

wherein the dimer acid is selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid which is a reaction product of oleic acid and linoleic acid, and a combination thereof,

the trimer acid is selected from a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid which is a reaction product of oleic acid and linoleic acid, and a combination thereof,

the additional resin is selected from the group consisting of: a terpene resin, a modified terpene resin, a terpene phenol resin, a modified terpene phenolic resin, a xylene resin, a modified xylene resin, polyvinyl acetate, polyvinyl alcohol, polyethylene polyvinyl acetate copolymer, and combinations thereof, and

the solvent is selected from the group consisting of: water, butyl stearate, 2-ethylhexyl stearate, isotridecyl stearate, methyl oleate, isobutyl oleate, coconut fatty acid methyl, methyl laurate, isopropyl myristate, isopropyl palmitate, 2-ethylhexyl palmitate, octyldodecyl myristate, ethanol, mixed solvent obtained by adding methanol and/or isopropyl alcohol to ethanol, isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1,5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,3-dimethyl-2,3-butanediol, 1,1,1-tris(hydroxymethyl)ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2′-oxybis(methylene)bis(2-ethyl-1,3-propanediol), 2,2-bis(hydroxymethyl)-1,3-propanediol, 1,2,6-trihydroxyhexane, bis[2,2,2-tris(hydroxymethyl)ethyl]ether, 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, erythritol, threitol, guaiacol glycerol ether, 3,6-dimethyl-4-octyne-3,6-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol, hexyldiglycol, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether, and combinations thereof.

2. A resin flux cored solder, wherein

a linear solder is filled with the flux for soldering according to claim 1 .

3. A flux coated solder, wherein

a solder is coated with the flux for soldering according to claim 1 .