IP Library › Granted Patent US 11,387,272
Granted Patent B2
US 11,387,272 · App. 16/960,540 · Granted Jul 12, 2022

Semiconductor device and electronic apparatus

Inventor: Taro Sugizaki (Kanagawa, JP)
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
H01L27/1462H01L27/1464H01L27/14621H01L27/14623H01L27/14627H01L27/14636H01L27/14645
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Quick Facts
Patent No.
US 11,387,272
App. No.
16/960,540
Granted
Jul 12, 2022
Kind
B2
Abstract

The present technology relates to a semiconductor device and an electronic apparatus that are capable of improving the characteristics of a semiconductor device or an electronic apparatus that includes a pixel having a metallic filter and a pixel not having the metallic filter. A semiconductor device includes: a pixel unit in which a first pixel including a metallic filter and a second pixel not including the metallic filter are disposed adjacent to each other; and a reflected light reduction unit that reduces reflected light on a sidewall of the metallic filter at a boundary portion between the first pixel and the second pixel. The present technology can be applied to an image sensor that includes a narrowband pixel including a plasmon filter and a normal pixel including a color filter, for example.

Claims (42)

1. A semiconductor device comprising:

a pixel unit in which a first pixel including a metallic filter and a second pixel not including the metallic filter are disposed adjacent to each other; and

a reflected light reduction unit that reduces reflected light on a sidewall of the metallic filter at a boundary portion between the first pixel and the second pixel.

2. The semiconductor device according to claim 1 , wherein

the reflected light reduction unit is disposed at a position closer to a light incident surface of the semiconductor device than the metallic filter, and includes a light absorber that overlaps at least one of the first pixel or the second pixel adjacent to the boundary portion.

3. The semiconductor device according to claim 2 , wherein

the second pixel includes a non-metallic filter, and

the light absorber is disposed at a position closer to the light incident surface of the semiconductor device than the metallic filter and the non-metallic filter.

4. The semiconductor device according to claim 3 , wherein

the non-metallic filter is disposed at a position closer to the light incident surface of the semiconductor device than the metallic filter.

5. The semiconductor device according to claim 2 , wherein

the light absorber includes a black filter.

6. The semiconductor device according to claim 2 , wherein

the light absorber includes an optical filter in which a red filter and a blue filter are stacked.

7. The semiconductor device according to claim 2 , wherein

an angle between a plane and the sidewall is not smaller than a maximum incident angle of light incident on the sidewall, the plane connecting a side of a face of the light absorber that is on the opposite side from a light incident surface of the light absorber and is located on a side of the second pixel, to a side of the sidewall that is on the opposite side from a light incident surface of the metallic filter.

8. The semiconductor device according to claim 1 , wherein

the reflected light reduction unit includes a light absorber that covers at least part of the sidewall.

9. The semiconductor device according to claim 8 , wherein

the light absorber includes a black filter.

10. The semiconductor device according to claim 8 , wherein

the light absorber includes an optical filter in which a red filter and a blue filter are stacked.

11. The semiconductor device according to claim 1 , wherein

the reflected light reduction unit includes a low-reflection film that has a lower reflectance than a metal forming the metallic filter and covers at least part of the sidewall.

12. The semiconductor device according to claim 1 , wherein

the reflected light reduction unit includes the sidewall that is inclined so as to move away from the boundary portion in a direction of the first pixel as a distance from a light incident surface of the metallic filter increases.

13. The semiconductor device according to claim 12 , wherein

an inclination angle of the sidewall with respect to the light incident surface of the metallic filter is not greater than (90°−the maximum incident angle of light incident on the sidewall).

14. The semiconductor device according to claim 1 , wherein

an antireflective film that surrounds at least part of a periphery of the first pixel and reduces reflected light is formed on a light incident surface of the metallic filter.

15. The semiconductor device according to claim 14 , wherein

the antireflective film includes a black filter.

16. The semiconductor device according to claim 1 , wherein

the metallic filter includes a plasmon filter.

17. The semiconductor device according to claim 1 , wherein

the metallic filter includes a Fabry-Perot.

18. An electronic apparatus comprising:

a semiconductor device; and

a signal processing unit that processes a signal output from the semiconductor device,

wherein the semiconductor device includes:

a pixel unit in which a first pixel including a metallic filter and a second pixel not including the metallic filter are disposed adjacent to each other; and

a reflected light reduction unit that reduces reflected light on a sidewall of the metallic filter at a boundary portion between the first pixel and the second pixel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 19, 2021
From: SUGIZAKI, TARO
To: SONY CORPORATION
Reel/Frame 056048/0447 →
Priority Claims (1)
JP JP2018-008111 · Jan 22, 2018 · national
Continuity (1)
Related Publication 20210066356A1 · Mar 4, 2021
Cited By (1)
US 12,453,192