IP Library › Granted Patent US 11,667,825
Granted Patent B2
US 11,667,825 · App. 16/961,882 · Granted Jun 6, 2023

Thermally conductive sheet and method for producing the same

Inventor: Hitoshi Shibuya (Aichi, JP)
Assignee: Fuji Polymer Industries Co., Ltd.
C09K5/14C08J5/18C08K3/22C08K7/18C08K9/06C08J2383/04C08K2003/2227C08K2201/001C08K2201/005H01L23/3737H01L33/641
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Quick Facts
Patent No.
US 11,667,825
App. No.
16/961,882
Granted
Jun 6, 2023
Kind
B2
Abstract

A thermally conductive sheet contains a matrix resin and thermally conductive particles. The content of the thermally conductive particles is 200 parts by volume or more with respect to 100 parts by volume of the matrix resin component. A polymer viscosity of the matrix resin component after a crosslinking reaction in the absence of the thermally conductive particles is 500 Pa·s or less at 25° C. A thermal conductivity of the thermally conductive sheet is 2.0 W/m·K or more. When the thermally conductive sheet with an initial thickness of 1.5 mm is compressed at a compression rate of 5.0 mm/min to measure a 50% compressive load value, the maximum load value is 100 kPa or more and the load value after 1 minute is more than 0 kPa and 100 kPa or less. With this configuration, the thermally conductive sheet has a high thermal conductivity, a low steady load value, and flexibility.

Claims (35)

1. A thermally conductive sheet comprising:

a matrix resin; and

thermally conductive particles,

wherein the thermally conductive particles consist of alumina particles,

a content of the alumina particles is 400 to 3000 parts by mass with respect to 100 parts by mass of the matrix resin component,

the alumina particles with an average particle size of 30 to 100 μm are 50 vol % or more and the alumina particles with an average particle size of less than 30 μm are 33 to 50 vol % with respect to 100 vol % of the total amount of the alumina particles,

the alumina particles with an average particle size of 30 to 100 μm are spherical in shape,

the alumina particles with an average particle size of less than 30 μm are irregular in shape,

the matrix resin in the thermally conductive sheet is cross-linked,

a polymer viscosity of the matrix resin component after a crosslinking reaction in the absence of the alumina particles is 500 Pa·s or less at 25° C.,

a thermal conductivity of the thermally conductive sheet is 2.0 W/m·K or more, and

when the thermally conductive sheet with an initial thickness of 1.5 mm is compressed at a compression rate of 5.0 mm/min to measure a 50% compressive load value, a maximum load value is 100 kPa or more and a load value after 1 minute is more than 0 kPa and 100 kPa or less.

2. The thermally conductive sheet according to claim 1 , wherein the matrix resin component is a silicone polymer.

3. The thermally conductive sheet according to claim 1 , wherein the matrix resin component is an addition curing type silicone polymer.

4. The thermally conductive sheet according to claim 1 , wherein the polymer viscosity of the matrix resin component after the crosslinking reaction in the absence of the alumina particles is 1 to 150 Pa·s.

5. The thermally conductive sheet according to claim 1 , wherein the alumina particles are surface treated with a silane compound, a titanate compound, an aluminate compound, or partial hydrolysates thereof.

6. A method for producing a thermally conductive sheet, comprising a matrix resin and thermally conductive particles, the method comprising:

forming a compound with the following composition into a sheet; and

heat-curing the sheet:

(A) 100 parts by volume of a base polymer component that is a linear organopolysiloxane having an average of two or more alkenyl groups per molecule, in which the alkenyl groups are bonded to silicon atoms at both ends of a molecular chain;

(B) a crosslinking component that is an organohydrogenpolysiloxane having an average of two or more hydrogen atoms bonded to silicon atoms per molecule, in which the number of moles of the organohydrogenpolysiloxane is less than 3 moles with respect to 1 mole of the alkenyl groups bonded to the silicon atoms in the component A;

(C) a catalyst component at a concentration of 0.01 to 1000 ppm based on a weight of metal atoms with respect to the component A; and

(D) 400 to 3000 parts by mass of thermally conductive particles with respect to 100 parts by mass of the component A,

wherein the thermally conductive particles consist of alumina particles,

the alumina particles with an average particle size of 30 to 100 μm are 50 vol % or more and the alumina particles with an average particle size of less than 30 μm are 33 to 50 vol % with respect to 100 vol % of the total amount of the alumina particles,

the alumina particles with an average particle size of 30 to 100 μm are spherical in shape,

the alumina particles with an average particle size of less than 30 μm are irregular in shape,

the matrix resin in the thermally conductive sheet is cross-linked,

a polymer viscosity of the matrix resin component after a crosslinking reaction in the absence of the alumina particles is 500 Pa·s or less at 25° C.,

a thermal conductivity of the thermally conductive sheet is 2.0 W/m·K or more, and

when the thermally conductive sheet with an initial thickness of 1.5 mm is compressed at a compression rate of 5.0 mm/min to measure a 50% compressive load value, a maximum load value is 100 kPa or more and a load value after 1 minute is more than 0 kPa and 100 kPa or less.

7. The method according to claim 6 , wherein the heat curing conditions of the sheet are that a temperature is 90 to 120° C. and a time is 5 to 180 minutes.

8. The method according to claim 6 , wherein the matrix resin component is an addition curing type silicone polymer.

9. The method according to claim 6 , wherein the polymer viscosity of the matrix resin component after the crosslinking reaction in the absence of the alumina particles is 1 to 150 Pa·s.

10. The method according to claim 6 , wherein the alumina particles are surface treated with a silane compound, a titanate compound, an aluminate compound, or partial hydrolysates thereof.

Assignments (2)
CHANGE OF ADDRESS Recorded Feb 6, 2023
From: FUJI POLYMER INDUSTRIES CO., LTD.
To: FUJI POLYMER INDUSTRIES CO., LTD.
Reel/Frame 062655/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2020
From: SHIBUYA, HITOSHI
To: FUJI POLYMER INDUSTRIES CO., LTD.
Reel/Frame 053201/0329 →
Priority Claims (1)
JP JP2019-041943 · Mar 7, 2019 · national
Continuity (1)
Related Publication 20210214600A1 · Jul 15, 2021