IP Library › Granted Patent US 11,454,489
Granted Patent B2
US 11,454,489 · App. 16/963,297 · Granted Sep 27, 2022

Sensor module with reduced size

Inventors: Toshiaki Asakawa (Shizuoka, JP); Shigeyuki Adachi (Shizuoka, JP)
Assignee: MINEBEA MITSUMI Inc.
G01B7/18C22C38/40G01L1/2293
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,454,489
App. No.
16/963,297
Granted
Sep 27, 2022
Kind
B2
Abstract

A sensor module includes a substrate; a resistor formed of a-film containing Cr, CrN, and Cr2N, on one surface of the substrate; an electronic component mounted on the one surface of the substrate, to be electrically connected to the resistor; and a power source mounted on the one surface of the substrate or on another surface of the substrate, to be electrically connected to the electronic component, to supply power to the electronic component.

Claims (36)

1. A sensor module comprising:

a substrate;

a resistor formed of a film containing, Cr, CrN, and Cr2N, on one surface of the substrate;

an electronic component mounted on the one surface of the substrate, to be electrically connected to the resistor; and

a power source mounted on the one surface of the substrate or on another surface of the substrate, to be electrically connected to the electronic component, to supply power to the electronic component.

2. The sensor module as claimed in claim 1 , wherein the power source is directly arranged on the one surface of the substrate.

3. The sensor module as claimed in claim 1 , further comprising:

an insulating resin layer on the one surface of the substrate, to cover the resistor and the electronic component,

wherein the power source is arranged on a surface on an opposite side with respect to the substrate of the insulating resin layer.

4. The sensor module as claimed in claim 1 , wherein the power source is directly arranged on said another surface of the substrate.

5. The sensor module as claimed in claim 1 , further comprising:

a strain generator secured to said another surface of the substrate via an adhesive layer,

wherein the power source is arranged on a surface on an opposite side with respect to the adhesive layer of the strain generator.

6. The sensor module as claimed in claim 1 , wherein the power source is a solar battery.

7. The sensor module as claimed in claim 6 , wherein a protective layer is provided on a light-receiving surface of the solar battery.

8. The sensor module as claimed in claim 1 , further comprising:

multiple instances of the resistor electrically connected to the electronic component, on the substrate.

9. The sensor module as claimed in claim 1 , wherein the substrate is made of resin.

10. The sensor module as claimed in claim 9 , further comprising:

a functional layer formed of a metal, alloy, or metal compound, directly on the one surface of the substrate,

wherein the resistor is formed on one surface of the functional layer.

11. The sensor module as claimed in claim 10 , wherein the functional layer includes

a function of promoting crystal growth of the resistor,

a function of preventing oxidation of the resistor,

a function of controlling movement of oxygen and moisture contained in the substrate toward the resistor, and/or

a function of improving adhesion between the substrate and the resistor.

12. A sensor module comprising:

a substrate;

a resistor formed of a material containing at least one of chromium and nickel, on one surface of the substrate;

an electronic component mounted on the one surface of the substrate, to be electrically connected to the resistor; and

a power source mounted on the one surface of the substrate or on another surface of the substrate, to be electrically connected to the electronic component, to supply power to the electronic component,

wherein the power source is arranged on a side opposite to the electronic component with an insulating layer sandwiched in-between, and

wherein the electronic component is electrically connected to the power source via a wiring pattern provided on a side surface of the insulating layer.

13. The sensor module as claimed in claim 12 , wherein the insulating layer corresponds to the substrate.

14. The sensor module as claimed in claim 12 , wherein the insulating layer is an insulating resin layer covering the electronic component.

15. The sensor module as claimed in claim 12 , wherein the resistor is formed of a film containing, Cr, CrN, and Cr2N.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2022
From: ASAKAWA, TOSHIAKI; ADACHI, SHIGEYUKI
To: MINEBEA MITSUMI INC.
Reel/Frame 060863/0020 →
Priority Claims (1)
JP JP2018-008379 · Jan 22, 2018 · national
Continuity (1)
Related Publication 20210055095A1 · Feb 25, 2021