Flip-chip film
View Patent ↗A flip-chip film includes a substrate and a plurality of flip-chip film units. The plurality of flip-chip film units are disposed on the substrate, and each of the flip-chip film units includes a plurality of first metal traces arranged at intervals. A punch cut is defined between the first metal traces of two adjacent flip-chip film units.
1. A flip-chip film, comprising:
a substrate;
a plurality of flip-chip film units, wherein the plurality of flip-chip film units are disposed on the substrate, and each of the flip-chip film units comprises a plurality of first metal traces arranged at intervals; and
a punch cut defined between the first metal traces of two adjacent flip-chip film units, wherein a plurality of punch cuts are connected with each other and arranged side by side, and the substrate is a flexible substrate;
wherein a cutting line is defined on the substrate corresponding to a portion of the punch cut, the cutting line is perpendicular to an extending direction of the first metal trace; and
wherein in a direction parallel to the extending direction of the first metal trace, distances from the cutting line to the first metal traces of the two adjacent flip-chip film units are equal.
2. The flip-chip film according to claim 1 , wherein each of the flip-chip film units further comprises at least two second metal traces, the second metal traces and the first metal traces are disposed side by side, and at least one of the first metal traces is disposed between two adjacent second metal traces in each of the flip-chip film units; and
wherein the second metal traces between the two adjacent flip-chip film units are correspondingly connected one to one.
3. The flip-chip film according to claim 2 , wherein the first metal traces and the second metal traces are alternately disposed in each of the flip-chip film units.
4. The flip-chip film according to claim 2 , wherein the plurality of first metal traces are disposed between the two adjacent second metal traces in each of the flip-chip film units.
5. The flip-chip film according to claim 1 , wherein each of the flip-chip film units further comprises a second metal trace, the second metal trace and the first metal trace are disposed side by side, and a plurality of second metal traces are correspondingly connected to each other between the two adjacent flip-chip film units.
6. The flip-chip film according to claim 1 , wherein a length of the punch cut ranges from 250 microns to 400 microns in an extending direction of the first metal trace.
7. The flip-chip film according to claim 1 , wherein each of the flip-chip film units further comprises a driving chip, a plurality of connection terminals are disposed on the driving chip, and the plurality of connection terminals are correspondingly and electrically connected to each end of the first metal traces.
8. A flip-chip film, comprising:
a substrate;
a plurality of flip-chip film units, wherein the plurality of flip-chip film units are disposed on the substrate, and each of the flip-chip film units comprises a plurality of first metal traces arranged at intervals; and
a punch cut defined between the first metal traces of two adjacent flip-chip film units;
wherein a cutting line is defined on the substrate corresponding to a portion of the punch cut, the cutting line is perpendicular to an extending direction of the first metal trace; and
wherein in a direction parallel to the extending direction of the first metal trace, distances from the cutting line to the first metal traces of the two adjacent flip-chip film units are equal.
9. The flip-chip film according to claim 8 , wherein a plurality of punch cuts are connected with each other and arranged side by side.
10. The flip-chip film according to claim 8 , wherein each of the flip-chip film units further comprises at least two second metal traces, the second metal traces and the first metal traces are disposed side by side, and at least one of the first metal traces is disposed between two adjacent second metal traces in each of the flip-chip film units; and
wherein the second metal traces between the two adjacent flip-chip film units are correspondingly connected one to one.
11. The flip-chip film according to claim 10 , wherein the first metal traces and the second metal traces are alternately disposed in each of the flip-chip film units.
12. The flip-chip film according to claim 10 , wherein the plurality of first metal traces are disposed between the two adjacent second metal traces in each of the flip-chip film units.
13. The flip-chip film according to claim 8 , wherein each of the flip-chip film units further comprises a second metal trace, the second metal trace and the first metal trace are disposed side by side, and a plurality of second metal traces are correspondingly connected to each other between the two adjacent flip-chip film units.
14. The flip-chip film according to claim 8 , wherein a length of the punch cut ranges from 250 microns to 400 microns in an extending direction of the first metal trace.
15. The flip-chip film according to claim 8 , wherein each of the flip-chip film units further comprises a driving chip, a plurality of connection terminals are disposed on the driving chip, and the plurality of connection terminals are correspondingly and electrically connected to each end of the first metal traces.
16. The flip-chip film according to claim 8 , wherein the substrate is a flexible substrate.