Granted Patent B2

US 12,224,388 · App. 16/967,759 · Granted Feb 11, 2025

Inventors: Oliver Gyenge (Berlin, DE); Rachid Abdallah (Berlin, DE); Simon Maus (Berlin, DE); Ulli Hansen (Berlin, DE)

Assignee: MSG LITHOGLAS GMBH

H01L33/60H01L31/0203H01L31/02327H01L33/486H01S5/02216H01S5/02255H01S5/02345H01S5/0237H01L24/32H01L24/48H01L24/73H01L31/02005H01L33/62H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2933/0058

Abstract

Claims (19)

1. A component arrangement, comprising:

a carrier substrate;

a spacer which is arranged on the carrier substrate so as to surround an installation space and has an outlet opening on a side facing away from the carrier substrate;

an optical component arranged in the installation space;

a contact connection which electrically conductively connects the optical component to external contacts arranged outside the installation space;

a cover substrate which is arranged on the spacer and with which the outlet opening is covered in a light-permeable manner; and

a light-reflecting surface which is formed on an anisotropically etched silicon component and is arranged in the installation space as an inclined surface at an angle of approximately 45° relative to a surface of the carrier substrate facing the installation space, in such a way that light radiated in a horizontal direction onto the light-reflecting surface can be radiated out in a vertical direction through the opening and the cover substrate, and vice versa, wherein the spacer is formed from the anisotropically etched silicon component;

wherein the outlet opening has, in plan view, an opening with a trapezoidal shape;

wherein the anisotropically etched silicon component, in a plan view, has a lower opening with a trapezoidal shape and an upper opening with a trapezoidal shape that is limited in one direction of its extent.

2. The component arrangement according to claim 1 , wherein the cover substrate at least partially fills the installation space.

3. The component arrangement according to claim 1 , wherein the light-reflecting surface has a surface-side mirror coating.

4. The component arrangement according to claim 1 , wherein the optical component has a lateral optical outlet/inlet, through which light can exit or enter in the horizontal direction.

5. The component arrangement according to claim 1 , wherein the optical component is arranged on a submount which is arranged on the carrier substrate.

6. The component arrangement according to claim 1 , wherein a first wall surface of the spacer, which faces the installation space and is arranged outside a region with the light-reflecting surface, is inclined relative to the vertical direction at a first angle different from 45°.

7. The component arrangement according to claim 6 , wherein a second wall surface of the spacer, which is different from the first wall surface, faces the installation space and is arranged outside the region with the light-reflecting surface, is inclined relative to the vertical direction at a second angle different from 45°, which is different from the first angle.

8. A method, comprising:

producing the anisotropically etched silicon component from a silicon single crystal by anisotropic etching, wherein the silicon single crystal is inclined by approximately 9.7° to the 100 crystal orientation, such that a 111 crystal plane with a slope of approximately 45° is formed, and, in plan view, the opening with a trapezoidal shape is formed; and

producing the component arrangement according to claim 1 using the anisotropically etched silicon component, wherein the light-reflecting surface is formed in the component arrangement with the 111 crystal plane with the slope of approximately 45 °.

9. A method for producing a package according to claim 8 , wherein the package is produced by means of wafer-level packaging.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (19)