Assembly for optical to electrical power conversion
An assembly for optical to electrical power conversion including a photodiode assembly having a substrate layer and an internal side, an antireflective layer, a heterojunction buffer layer adjacent the internal side; an active area positioned adjacent the heterojunction buffer layer, a plurality of n+ electrode regions and p+ electrode regions positioned adjacent the active area, and back-contacts configured to align with the n+ and p+ electrode regions. The active area converts photons from incoming light into liberated electron hole pairs. The heterojunction buffer layer prevents electrons and holes of the liberated electron hole pairs from moving toward the substrate layer. The plurality of electrode regions are configured in an alternating pattern with gaps between each n+ and p+ electrode region. The electrode regions receive and generate electrical current from migration of the electrons and the holes, provide electrical pathways for the electrical current, and provide thermal pathways to dissipate heat.
1. An assembly for optical to electrical power conversion, comprising:
a photodiode assembly; comprising:
a substrate layer having a light exposed side and an internal side;
an antireflective layer adjacent the light exposed side and configured to prevent incoming light from reflecting off of a surface of the light exposed side;
a heterojunction buffer layer positioned adjacent the internal side;
an active area positioned adjacent the heterojunction buffer layer and configured to convert photons from the incoming light into liberated electron hole pairs, wherein the heterojunction buffer layer is configured to prevent electrons and holes of the liberated electron hole pairs from moving toward the substrate layer; and
a plurality of n+ electrode regions and p+ electrode regions positioned adjacent the active area and configured in an alternating pattern with gaps between each n+ electrode region and each p+ electrode region and further configured to receive and generate electrical current from migration of the electrons and the holes, to provide electrical pathways for the electrical current and to provide thermal pathways, the alternating pattern including a series of pie shaped sections, each pie shaped section having a narrow end adjacent a central area of the n+ electrode regions and the p+ electrode regions, each pie shaped section formed of interleaved rows of the n+ electrode regions and rows of the p+ electrode regions;
an anode back-contact configured to align with a portion of the alternating pattern corresponding to the rows of the n+ electrode regions; and
a cathode back-contact configured to align with a portion of the alternating pattern corresponding to the rows of the p+ electrode regions.
2. The assembly as recited in claim 1 , wherein the active area is a lightly doped InGaAs layer.
3. The assembly as recited in claim 1 , wherein the photodiode has a circular shape, and wherein each of the interleaved rows of the n+ electrode regions and rows of the p+ electrode regions are curved and configured to conform to the circular shape of the photodiode.
4. The assembly as recited in claim 1 , further comprising a thin film thermal dissipative material placed in contact with a non-illuminated side of the photodiode and configured to conduct heat away from the photodiode during high intensity light exposure and to reduce potential for an electrical short.
5. The assembly as recited in claim 4 , wherein the film thermal dissipative material is an electrical insulator.
6. The assembly as recited in claim 1 , wherein the substrate layer has an etch pitch density configured to avoid scattering of the incoming light.
7. The assembly as recited in claim 1 , wherein the photodiode is formed from one or more of a lithography method, a crystal growth method, and an ion implantation method.
8. The assembly as recited in claim 1 , wherein the heterojunction buffer layer includes a non-uniform concentration of materials throughout and is configured to form a better lattice matched structure.
9. The assembly as recited in claim 1 , wherein the photodiode is an optical to electrical converter configured to be integrated into a compact device.
10. The assembly as recited in claim 9 , wherein the photodiode is mounted to a heat sink or heat spreader within the compact device.
11. The assembly as recited in claim 1 , wherein the electrical current is measurable at one or more of the anode back-contact and the cathode back-contact of each pie shaped section.
12. The assembly as recited in claim 11 , wherein the measured electrical current of each pie shaped section corresponds to a relative illumination intensity from incoming light on each pie shaped section.
13. The assembly as recited in claim 12 , wherein the measured electrical current of each pie shaped section is communicated to a source of the incoming light to refine a direction of the incoming light.
14. The assembly as recited in claim 1 , wherein the electrical current is configured to provide power to an energy storage device or other active components.