IP Library › Granted Patent US 12,091,772
Granted Patent B2
US 12,091,772 · App. 16/971,814 · Granted Sep 17, 2024

Silicon carbide substrate

Inventors: Kyoko Okita (Osaka, JP); Tsubasa Honke (Osaka, JP)
Assignee: Sumitomo Electric Industries, Ltd.
C30B29/36C30B23/025H01L21/02378H01L21/30625H01L29/1608
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Quick Facts
Patent No.
US 12,091,772
App. No.
16/971,814
Granted
Sep 17, 2024
Kind
B2
Abstract

A silicon carbide substrate according to the present disclosure is a silicon carbide substrate that includes a first main surface and a second main surface opposite to the first main surface, and is made of silicon carbide having a polytype of 4H. The first main surface has a maximum diameter of more than or equal to 140 mm. The first main surface is a {0001} plane or a plane inclined at an off angle of more than 0° and less than or equal to 8° relative to the {0001} plane. Half-widths of a peak corresponding to a folded mode of a longitudinal optical branch of a Raman spectrum of the silicon carbide substrate within a plane of the first main surface have an average value of less than 2.5 cm −1 , and a standard deviation of less than or equal to 0.06 cm −1 .

Claims (7)

1. A silicon carbide substrate comprising:

a first main surface and a second main surface opposite to the first main surface, the silicon carbide substrate being made of silicon carbide having a polytype of 4H,

the first main surface having a maximum diameter of more than or equal to 140 mm,

the first main surface being a {0001} plane or a plane inclined at an off angle of more than 0° and less than or equal to 8° relative to the {0001} plane,

half-widths of a peak corresponding to a folded mode of a longitudinal optical branch of a Raman spectrum of the silicon carbide substrate within a plane of the first main surface having an average value of less than 2.5 cm −1 , and a standard deviation of less than or equal to 0.06 cm −1 ,

wherein the first main surface and the second main surface each exhibit hydrophilicity.

2. The silicon carbide substrate according to claim 1 , wherein the silicon carbide substrate has a thickness of more than or equal to 300 μm and less than or equal to 600 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2020
From: OKITA, KYOKO; HONKE, TSUBASA
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 053579/0622 →
Priority Claims (1)
JP 2018-036553 · Mar 1, 2018 · national
Continuity (1)
Related Publication 20200385887A1 · Dec 10, 2020