HEAT-RESISTANT THERMALLY CONDUCTIVE COMPOSITION AND HEAT-RESISTANT THERMALLY CONDUCTIVE SHEET
A heat-resistant thermally conductive composition contains a matrix resin and thermally conductive particles, and contains a benzimidazolone compound as a heat resistance improver. Preferably, the benzimidazolone compound is a benzimidazolone pigment and is added in an amount of 0.001 to 5 parts by mass with respect to 100 parts by mass of the heat-resistant thermally conductive composition. Preferably, the matrix resin component is a silicone polymer. Preferably, the heat-resistant thermally conductive composition has an Asker C hardness of 70 or less after curing. With these, provided are a heat-resistant thermally conductive composition and a heat-resistant thermally conductive sheet that use the heat resistance improver containing no metal atom and that are less likely to become hard at high temperature.
1 . A heat-resistant thermally conductive composition comprising:
a matrix resin; and
thermally conductive particles,
wherein the heat-resistant thermally conductive composition contains a benzimidazolone compound as a heat resistance improver, and
considering an amount of the matrix resin to be 100 parts by mass, the thermally conductive particles are present in an amount of 100 to 4000 parts by mass.
2 . The heat-resistant thermally conductive composition according to claim 1 , wherein the benzimidazolone compound is added in an amount of 0.001 to 5 parts by mass with respect to 100 parts by mass of the heat-resistant thermally conductive composition.
3 . The heat-resistant thermally conductive composition according to claim 1 , wherein the matrix resin is a silicone polymer.
4 . The heat-resistant thermally conductive composition according to claim 1 , wherein the benzimidazolone compound is a benzimidazolone pigment.
5 . (canceled)
6 . The heat-resistant thermally conductive composition according to claim 1 , further comprising a curing catalyst,
wherein the matrix resin is an addition-curable silicone polymer.
7 . The heat-resistant thermally conductive composition according to claim 1 , wherein the heat-resistant thermally conductive composition has an Asker C hardness of 70 or less after curing.
8 . The heat-resistant thermally conductive composition according to claim 1 , wherein the thermally conductive particles are at least one selected from alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, aluminum hydroxide, and silica.
9 . A heat-resistant thermally conductive sheet comprising a heat-resistant thermally conductive composition in the form of a sheet, the heat-resistant thermally conductive composition comprising:
a matrix resin;
thermally conductive particles; and
a benzimidazolone compound as a heat resistance improver,
wherein, considering an amount of the matrix resin to be 100 parts by mass, the thermally conductive particles are present in an amount of 100 to 4000 parts by mass.
10 . The heat-resistant thermally conductive sheet according to claim 9 , wherein the heat-resistant thermally conductive sheet has a thermal conductivity of 0.8 W/m·K or more.
11 . The heat-resistant thermally conductive sheet according to claim 9 , wherein part or all of the thermally conductive particles are surface treated with a silane coupling agent.
12 . The heat-resistant thermally conductive sheet according to claim 11 , wherein the silane coupling agent is added in an amount of 0.01 to 10 parts by mass with respect to 100 parts by mass of the thermally conductive particles.
13 . The heat-resistant thermally conductive sheet according to claim 9 , wherein the heat-resistant thermally conductive composition comprises the following components (A) to (E), and is cured:
(A) a base polymer component: an organopolysiloxane having an average of two or more silicon atoms bonded to alkenyl groups per molecule;
(B) a crosslinking component: an organopolysiloxane having an average of two or more silicon atoms bonded to hydrogen atoms per molecule, in which an amount of the organopolysiloxane is 0.01 to 3 mol with respect to 1 mol of the alkenyl groups bonded to the silicon atoms in the component A;
(C) a catalyst component: a platinum group metal catalyst, in which an amount of the platinum group metal catalyst is 0.01 to 1000 ppm in terms of a weight unit of metal atoms with respect to a total amount of the component A and the platinum group metal catalyst;
(D) thermally conductive particles: 100 to 4000 parts by mass with respect to 100 parts by mass of an addition-curable silicone polymer component (the component A+the component B); and
(E) a benzimidazolone compound: 0.001 to 5 parts by mass with respect to 100 parts by mass of the heat-resistant thermally conductive composition.
14 . The heat-resistant thermally conductive sheet according to claim 9 , wherein the heat-resistant thermally conductive sheet has a thickness of 0.2 to 10 mm.
15 . The heat-resistant thermally conductive sheet according to claim 9 , wherein the benzimidazolone compound is added in an amount of 0.001 to 5 parts by mass with respect to 100 parts by mass of the heat-resistant thermally conductive composition.
16 . The heat-resistant thermally conductive sheet according to claim 9 , wherein the benzimidazolone compound is a benzimidazolone pigment.
17 . The heat-resistant thermally conductive sheet according to claim 9 , wherein the heat-resistant thermally conductive composition has an Asker C hardness of 70 or less after curing.
18 . The heat-resistant thermally conductive sheet according to claim 9 , wherein the thermally conductive particles are at least one selected from alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, aluminum hydroxide, and silica.
19 . The heat-resistant thermally conductive sheet according to claim 9 , wherein the heat resistance improver contains no metal atom.
20 . The heat-resistant thermally conductive composition according to claim 1 , wherein the heat resistance improver contains no metal atom.