Display assembly and manufacturing method thereof and display device

1. A display assembly, comprising:

a display panel, comprising: a screen portion, a chip providing portion, a bendable portion between the screen portion and the chip providing portion, and a spacer portion between the bendable portion and the screen portion;

a blocking layer on the screen portion;

a cured adhesive layer outside an area of the screen portion and comprising: a first portion covering the bendable portion and a second portion covering the spacer portion, the first portion and the second portion each having a thickness less than that of the blocking layer, wherein the second portion is in contact with the blocking layer, and a surface of the second portion distal to the spacer portion is substantially flat;

wherein the cured adhesive layer further comprises a third portion on the chip providing portion, and a thickness of the third portion is gradually reduced along a direction far away from the bendable portion;

the cured adhesive layer further comprises a fourth portion on the chip providing portion, the fourth portion is connected between the first portion and the third portion, and a surface of the fourth portion distal to the chip providing portion is substantially flat; and

the first portion, the third portion and the fourth portion therebetween are formed as a single piece;

surfaces of the first portion, the third portion and the fourth portion facing to the chip providing portion are formed as a single flat surface, and a distance between a surface of the third portion away from the chip providing chip and the single flat surface is gradually reduced along a direction far away from the bendable portion.

2. The display assembly of claim 1 , wherein a surface of the third portion distal to the spacer portion is a bevel.

3. The display assembly of claim 1 , wherein the bendable portion is in a bent state, and the chip providing portion is on a backlight side of the screen portion.

4. The display assembly of claim 3 , wherein the blocking layer is on a surface of the screen portion distal to the chip providing portion, a first back membrane is provided on a surface of the screen portion proximal to the chip providing portion, and the second portion of the cured adhesive layer at least partially overlaps the first back membrane in a thickness direction of the screen portion.

5. The display assembly of claim 4 , wherein a boundary of the first portion of the cured adhesive layer close to the bendable portion is flush with a boundary of the first back membrane close to the bendable portion.

6. The display assembly of claim 3 , wherein the chip providing portion has a first surface distal to the screen portion and a second surface proximal to the screen portion, a part of the cured adhesive layer is on the first surface of the chip providing portion, a second back membrane is on the second surface of the chip providing portion, and the part of the cured adhesive layer on the first surface of the chip providing portion at least partially overlaps the second back membrane in a thickness direction of the chip providing portion.

7. The display assembly of claim 1 , wherein a thickness of the first portion of the cured adhesive layer is in a range of 60 μm to 120 μm.

8. The display assembly of claim 1 , wherein the second portion of the cured adhesive layer has a thickness in a range of 60 μm to 90 μm.

9. The display assembly of claim 1 , wherein the blocking layer is a protection film.

10. The display assembly of claim 1 , wherein the blocking layer is a polarizer.

11. A display device comprising the display assembly of claim 1 .

12. A manufacturing method of a display assembly, comprising:

preparing a display panel, the display panel comprising: a screen portion, a chip providing portion, a bendable portion located between the screen portion and the chip providing portion, and a spacer portion connected between the bendable portion and the screen portion;

forming a blocking layer on the screen portion;

forming an adhesive layer on the display panel;

curing the adhesive layer, wherein the cured adhesive layer is located outside an area of the screen portion, and the cured adhesive layer comprises: a first portion covering the bendable portion and a second portion covering the spacer portion, the first portion and the second portion each having a thickness less than that of the blocking layer, wherein the second portion is in contact with the blocking layer, and a surface of the second portion distal to the spacer portion is substantially flat;

wherein the forming an adhesive layer on the display panel comprises: coating adhesive along a direction from the screen portion to the chip providing portion, starting from a position adjacent to the blocking layer, to form the adhesive layer;

wherein the coating adhesive along a direction from the screen portion to the chip providing portion comprises coating adhesive starting from the position adjacent to the blocking layer to an end position located on the chip providing portion such that the cured adhesive layer further comprises a third portion on the chip providing portion, and a thickness of the third portion is gradually reduced along a direction far away from the bendable portion; and

wherein the cured adhesive layer further comprises a fourth portion provided on the chip providing portion, the fourth portion is connected between the first portion and the third portion, a surface of the fourth portion distal to the chip providing portion is substantially flat; and

the first portion, the third portion and the fourth portion therebetween are formed as a single piece;

surfaces of the first portion, the third portion and the fourth portion facing to the chip providing portion are formed as a single flat surface, and a distance between a surface of the third portion away from the chip providing chip and the single flat surface is gradually reduced along a direction far away from the bendable portion.

13. The manufacturing method of claim 12 , wherein the curing the adhesive layer further comprises:

bending the display panel along the bendable portion such that the chip providing portion is located on a backlight side of the screen portion, and the bendable portion is in a bent state.

14. The manufacturing method of claim 13 , wherein before the bending the display panel along the bendable portion, the method further comprises:

forming a first back membrane on a surface of the screen portion distal to the blocking layer, wherein the second portion of the cured adhesive layer at least partially overlaps the first back membrane in a thickness direction of the screen portion.

15. The manufacturing method of claim 13 , wherein a part of the cured adhesive layer is located on a first surface of the chip providing portion,

before the bending the display panel along the bendable portion, the method further comprises: forming a second back membrane on a second surface of the chip providing portion, wherein the cured adhesive layer on the first surface of the chip providing portion at least partially overlaps the second back membrane in a thickness direction of the chip providing portion;

the bending the display panel along the bendable portion comprises bending the display panel along the bendable portion such that the first surface of the chip providing portion is distal to the screen portion, and the second surface of the chip providing portion is proximal to the screen portion.

16. A display assembly, comprising:

a display panel, comprising: a screen portion, a chip providing portion, a bendable portion between the screen portion and the chip providing portion, and a spacer portion between the bendable portion and the screen portion;

a blocking layer on the screen portion; and

a cured adhesive layer outside an area of the screen portion and comprising: a first portion covering the bendable portion and a second portion covering the spacer portion, the first portion and the second portion each having a thickness less than that of the blocking layer, wherein the second portion is in contact with the blocking layer, and a surface of the second portion distal to the spacer portion is substantially flat;

wherein a thickness of the first portion of the cured adhesive layer is in a range of 60 μm to 120 μm, and the second portion of the cured adhesive layer has a thickness in a range of 60 μm to 90 μm.

17. The display assembly of claim 16 , wherein the cured adhesive layer further comprises a third portion on the chip providing portion, and a thickness of the third portion is gradually reduced along a direction far away from the bendable portion;

the cured adhesive layer further comprises a fourth portion on the chip providing portion, the fourth portion is connected between the first portion and the third portion, and a surface of the fourth portion distal to the chip providing portion is substantially flat;

the first portion, the third portion and the fourth portion therebetween are formed as a single piece; and

surfaces of the first portion, the third portion and the fourth portion facing to the chip providing portion are formed as a single flat surface, and a distance between a surface of the third portion away from the chip providing chip and the single flat surface is gradually reduced along a direction far away from the bendable portion.

18. The display assembly of claim 16 , wherein a surface of the third portion distal to the spacer portion is a bevel.

19. The display assembly of claim 16 , wherein the bendable portion is in a bent state, and the chip providing portion is on a backlight side of the screen portion.

20. The display assembly of claim 19 , wherein the blocking layer is on a surface of the screen portion distal to the chip providing portion, a first back membrane is provided on a surface of the screen portion proximal to the chip providing portion, and the second portion of the cured adhesive layer at least partially overlaps the first back membrane in a thickness direction of the screen portion.