Electronic device including interposer
An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
1. An electronic device comprising:
a first printed circuit board (PCB) including a first conductive terminal;
a second PCB including a second conductive terminal; and
an interposer including a dielectric substrate and a multi-conductive member that passes though the dielectric substrate and electrically connects the first conductive terminal of the first PCB and the second conductive terminal of the second PCB,
wherein the multi-conductive member comprises:
an insulation member;
a first conductive member that is disposed inside the insulation member;
a second conductive member disposed inside the insulation member and separated from the first conductive member; and
a ground member disposed between the insulation member and the dielectric substrate, and
wherein the first conductive member and the second conductive member respectively transmit a designated signal or a designated power to the first PCB or the second PCB.
2. The electronic device of claim 1 , wherein the insulation member surrounds an entire side surface of the first conductive member inside the interposer.
3. The electronic device of claim 2 , wherein the ground member surrounds an entire side surface of the insulation member inside the interposer.
4. The electronic device of claim 1 , wherein the first conductive member comprises:
an upper conductive pad that is exposed through a first surface of the interposer that faces the second PCB;
a lower conductive pad that is exposed through a second surface of the interposer that faces the first PCB; and
a conductive via that passes through the interposer and electrically connects the upper conductive pad and the lower conductive pad.
5. The electronic device of claim 4 , wherein the insulation member comprises non-conductive filler that partitions between the conductive via and the ground member inside the interposer.
6. The electronic device of claim 1 , wherein a first signal is transmitted through the first conductive member and a second signal is transmitted through the second conductive member.
7. The electronic device of claim 6 , wherein the first signal and the second signal comprise two paired signals or a pair of differential signals.
8. The electronic device of claim 6 , wherein the ground member comprises a middle ground member formed between the first conductive member and the second conductive member.
9. The electronic device of claim 6 , wherein the first conductive member has the same structure as the second conductive member.
10. The electronic device of claim 9 , wherein the second conductive member comprises:
a second upper conductive pad that is exposed through a first surface of the interposer that faces the second PCB;
a second lower conductive pad that is exposed through a second surface of the interposer that faces the first PCB; and
a second conductive via that passes through the interposer and electrically connects the second upper conductive pad and the second lower conductive pad.
11. An interposer, comprising:
a dielectric substrate; and
a multi-conductive member that passes though the dielectric substrate and electrically connects a first conductive terminal of a first printed circuit board (PCB) and a second conductive terminal of a second PCB, the multi-conductive member including:
an insulation member;
a first conductive member that is disposed inside the insulation member;
a second conductive member disposed inside the insulation member and separated from the first conductive member; and
a ground member disposed between the insulation member and the dielectric substrate,
wherein the first conductive member and the second conductive member respectively transmit a designated signal or a designated power to the first PCB or the second PCB.
12. The interposer of claim 11 , wherein the insulation member surrounds an entire side surface of the first conductive member inside the interposer.
13. The interposer of claim 12 , wherein the ground member surrounds an entire side surface of the insulation member inside the interposer.
14. The interposer of claim 11 , wherein the first conductive member comprises:
an upper conductive pad that is exposed through a first surface of the interposer that faces the second PCB;
a lower conductive pad that is exposed through a second surface of the interposer that faces the first PCB; and
a conductive via that passes through the interposer and electrically connects the upper conductive pad and the lower conductive pad.
15. The interposer of claim 14 , wherein the insulation member comprises non-conductive filler that partitions between the conductive via and the ground member inside the interposer.
16. The interposer of claim 11 , wherein a first signal is transmitted through the first conductive member and a second signal is transmitted through the second conductive member.
17. The interposer of claim 16 , wherein the first signal and the second signal comprise two paired signals or a pair of differential signals.
18. The interposer of claim 16 , wherein the ground member comprises a middle ground member formed between the first conductive member and the second conductive member.
19. The interposer of claim 16 , wherein the first conductive member has the same structure as the second conductive member.
20. The interposer of claim 19 , wherein the second conductive member comprises:
a second upper conductive pad that is exposed through a first surface of the interposer that faces the second PCB;
a second lower conductive pad that is exposed through a second surface of the interposer that faces the first PCB; and
a second conductive via that passes through the interposer and electrically connects the second upper conductive pad and the second lower conductive pad.