Non-volatile memory device
A non-volatile memory device comprises a memory cell region including a first metal pad, a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first metal pad and the second metal pad, a memory cell array in the memory cell region including a plurality of memory cells, each of the memory cells being connected to a plurality of word lines in the memory cell region and a plurality of bit lines in the memory cell region, and a control logic circuit in the peripheral circuit region configured to control voltages to be applied to the plurality of word lines and the plurality of bit lines.
1. A non-volatile memory device comprising:
a memory cell region including a first metal pad;
a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first metal pad and the second metal pad;
a memory cell array in the memory cell region including a plurality of memory cells, each of the memory cells being connected to a plurality of word lines in the memory cell region and a plurality of bit lines in the memory cell region; and
a control logic circuit in the peripheral circuit region configured to control voltages to be applied to the plurality of word lines and the plurality of bit lines,
wherein the control logic circuit is configured to:
apply a program word line voltage with a voltage level changed stepwise to a selected word line connected to the plurality of memory cells such that the plurality of memory cells are programmed while the program word line voltage is applied, the program word line voltage including a first voltage level during a first time interval and a second voltage level different from the first voltage level during a subsequent second time interval;
apply a program bit line voltage to a first bit line of the plurality of bit lines connected to a plurality of first memory cells, while the program word line voltage is applied to the selected word line;
when the program bit line voltage has a program inhibit voltage level, inhibit the plurality of first memory cells from programming; and
when the program bit line voltage has a program voltage level, program the plurality of first memory cells,
wherein the program bit line voltage has a third voltage level between the program inhibit voltage level and the program voltage level during the first time interval, and one of the program inhibit voltage level, the program voltage level, and a fourth voltage level between the program inhibit voltage level and the program voltage level during the subsequent second time interval, and
wherein the fourth voltage level is different from the third voltage level.
2. The non-volatile memory device of claim 1 , wherein the second voltage level is lower than the first voltage level.
3. The non-volatile memory device of claim 2 , wherein the program inhibit voltage level is a power supply voltage level,
wherein the program voltage level is a ground voltage level, and
wherein the third voltage level is a forcing voltage level which is applied to the first bit line to improve threshold voltage dispersion of the plurality of first memory cells connected to the first bit line.
4. The non-volatile memory device of claim 1 , wherein the program bit line voltage has the program inhibit voltage level during the subsequent second time interval.
5. The non-volatile memory device of claim 1 , wherein the program bit line voltage has the fourth voltage level lower than the third voltage level during the subsequent second time interval.
6. The non-volatile memory device of claim 1 , wherein the program bit line voltage has the fourth voltage level higher than the third voltage level during the subsequent second time interval.
7. The non-volatile memory device of claim 1 , wherein the program bit line voltage has the program voltage level during the subsequent second time interval.
8. The non-volatile memory device of claim 7 , wherein the plurality of first memory cells are programmed to a predetermined program state by applying the program word line voltage and the program bit line voltage.
9. A non-volatile memory device comprising:
a memory cell region including a first metal pad;
a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first metal pad and the second metal pad;
a memory cell array in the memory cell region including a plurality of memory cells, each of the memory cells being connected to a plurality of word lines in the memory cell region and a plurality of bit lines in the memory cell region; and
a control logic circuit in the peripheral circuit region configured to control voltages to be applied to the plurality of word lines and the plurality of bit lines,
wherein the control logic circuit is configured to:
apply a program word line voltage with a voltage level changed stepwise to a selected word line connected to the plurality of memory cells, such that the plurality of memory cells are programmed while the program word line voltage is applied, the program word line voltage including a first voltage level during a first time interval and a second voltage level different from the first voltage level during a subsequent second time interval;
apply a first program bit line voltage to a first bit line of the plurality of bit lines connected to a plurality of first memory cells, while the program word line voltage is applied to the selected word line;
when the first program bit line voltage has a program inhibit voltage level, inhibit the plurality of first memory cells from programming; and
when the first program bit line voltage has a program voltage level, program the plurality of first memory cells,
wherein the first program bit line voltage has the program inhibit voltage level during the first time interval, and one of a third voltage level and a fourth voltage level between the program inhibit voltage level and the program voltage level during the subsequent second time interval.
10. The non-volatile memory device of claim 9 , wherein the second voltage level is lower than the first voltage level, and
wherein the first program bit line voltage has the program inhibit voltage level during the first time interval, and the third voltage level during the subsequent second time interval.
11. The non-volatile memory device of claim 10 , wherein the program inhibit voltage level is a power supply voltage level,
wherein the program voltage level is a ground voltage level, and
wherein the third voltage level is a forcing voltage level which is applied to the first bit line to improve threshold voltage dispersion of the plurality of first memory cells connected to the first bit line.
12. The non-volatile memory device of claim 9 , wherein the second voltage level is lower than the first voltage level, and
wherein the first program bit line voltage has the program inhibit voltage level during the first time interval, and the fourth voltage level during the subsequent second time interval.
13. The non-volatile memory device of claim 12 , wherein the control logic circuit is further configured to:
while applying the first program bit line voltage to the first bit line, apply a second program bit line voltage to a second bit line of the plurality of bit lines connected to a plurality of second memory cells, the second program bit line voltage having the program inhibit voltage level during the first time interval, and the program voltage level during the subsequent second time interval.
14. The non-volatile memory device of claim 13 , wherein the first bit line and the second bit line are disposed adjacent to each other.
15. A non-volatile memory device comprising:
a memory cell region including a first metal pad;
a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first metal pad and the second metal pad;
a memory cell array in the memory cell region including a plurality of memory cells, each of the memory cells being connected to a plurality of word lines in the memory cell region and a plurality of bit lines in the memory cell region; and
a control logic circuit in the peripheral circuit region configured to control voltages to be applied to the plurality of word lines and the plurality of bit lines,
wherein the control logic circuit is configured to:
apply a program word line voltage with a voltage level changed stepwise to a selected word line connected to the plurality of memory cells, the program word line voltage including a first voltage level during a first time interval and a second voltage level different from the first voltage level during a subsequent second time interval;
apply a first program bit line voltage to a first bit line of the plurality of bit lines connected to a plurality of first memory cells, while the program word line voltage is applied to the selected word line;
when the first program bit line voltage has a program inhibit voltage level, inhibit the plurality of first memory cells from programming;
when the first program bit line voltage has a program voltage level, program the plurality of first memory cells; and
turn off a string selection transistor connected to the plurality of first memory cells before the first program bit line voltage transitions to the program voltage level.
16. The non-volatile memory device of claim 15 , wherein the control logic circuit is further configured to apply a second program bit line voltage to a second bit line of the plurality of bit lines connected to a plurality of second memory cells, while the program word line voltage is applied to the selected word line,
wherein when the first program bit line voltage transitions from the program inhibit voltage level to the program voltage level, the second program bit line voltage transitions from the program inhibit voltage level to a third voltage level having a level higher than the program inhibit voltage level, and
wherein the first bit line and the second bit line are disposed adjacent to each other.
17. The non-volatile memory device of claim 16 , wherein the string selection transistor is turned off, before the second program bit line voltage transitions from the program inhibit voltage level to the third voltage level.
18. The non-volatile memory device of claim 16 , wherein the control logic circuit is further configured to apply a third program bit line voltage to a third bit line of the plurality of bit lines connected to a plurality of third memory cells, while the program word line voltage is applied to the selected word line, and
wherein when the first program bit line voltage transitions from the program inhibit voltage level to the program voltage level, the third program bit line voltage transitions from the program inhibit voltage level to a fourth voltage level lower than the program inhibit voltage level and higher than the program voltage level.
19. The non-volatile memory device of claim 16 , wherein the string selection transistor is turned on while applying the first program bit line voltage having the program voltage level to the first bit line and after transitioning the second program bit line voltage from the third voltage level to the program inhibit voltage level.
20. The non-volatile memory device of claim 15 , wherein the control logic circuit is further configured to apply a second program bit line voltage to a second bit line of the plurality of bit lines connected to a plurality of second memory cells, while the program word line voltage is applied to the selected word line, and
wherein when the first program bit line voltage transitions from the program inhibit voltage level to the program voltage level, the second program bit line voltage transitions from the program inhibit voltage level to a third voltage level lower than the program inhibit voltage level and higher than the program voltage level.