Light-emitting device and method of manufacturing the light-emitting device

1. A method of manufacturing a light-emitting device, the method comprising:

providing a substrate comprising a plurality of packages, each package defining a recess;

in each recess, mounting a light-emitting element on a surface that defines a bottom of the recess;

into each recess, supplying an uncured sealing member, the uncured sealing member containing a light-transmissive resin and a filler in the light-transmissive resin, the filler having an average particle diameter of 200 nm or more and 500 nm or less; and

applying a centrifugal force to the substrate in a direction perpendicular to the surface that defines the bottom of each recess to sediment the filler toward the bottom of each recess and thereby form a filler-containing layer, which contains the filler, and a light-transmissive layer that are layered in an order from a bottom side of each recess, wherein:

in the step of applying the centrifugal force, the centrifugal force is 150×g or more and 300×g or less.

2. The method of manufacturing the light-emitting device according to claim 1 , wherein:

the sealing member further contains a phosphor, and

in the step of applying the centrifugal force, a phosphor layer, which contains the phosphor, is formed at a location closer to the bottom of each recess than the filler-containing layer.

3. A light-emitting device comprising:

a package defining a recess;

a light-emitting element mounted on a surface that defines a bottom of the recess; and

a sealing member disposed in the recess so as to cover the light-emitting element and made of a light-transmissive resin that contains a filler with an average particle diameter of 200 nm or more and 500 nm or less, wherein:

the sealing member comprises a filler-containing layer, which contains the filler, and a light-transmissive layer that are layered in an order from a bottom side of the recess,

the filler-containing layer has a thickness of equal to or larger than a height of the light-emitting element,

the recess is further defined by a lateral surface having a stepped portion between the bottom of the recess and an opening of the recess, the stepped portion being formed to increase an opening area of the recess, and

the light-transmissive layer covers the stepped portion.

4. The light-emitting device according to claim 3 , wherein:

the filler-containing layer has a thickness of twice or more of the height of the light-emitting element.

5. The light-emitting device according to claim 3 , wherein:

the light-emitting element is electrically connected to wiring disposed on the surface that defines the bottom of the recess via wires, and

the filler-containing layer is formed up to a height to cover a top portion of the wires.

6. The light-emitting device according to claim 3 , wherein:

the light-transmissive resin contains 2 to 10 mass % of the filler.

7. The light-emitting device according to claim 3 , wherein:

the filler is titanium oxide.

8. The light-emitting device according to claim 3 , wherein:

the sealing member further contains a phosphor, and

the filler-containing layer is disposed between a phosphor layer, which contains the phosphor, and the light-transmissive layer, the phosphor layer disposed on the surface that defines the bottom of the recess and a top surface of the light-emitting element.

9. The light-emitting device according to claim 8 , wherein:

the phosphor layer has a thickness of equal to or less than half the height of the light-emitting element.