CONNECTING ARTICLE AND METHOD FOR MANUFACTURING THE SAME, AND LASER DEVICE
A connecting article includes a non-metallic body and a bonding layer. The non-metallic body includes a non-metal. The bonding layer is bonded to the non-metallic body. The bonding layer includes the non-metal, a first alloy, and a second alloy. The present disclosure further provides a method for manufacturing the connecting article, and a laser device.
1 . A connecting article, comprising:
a non-metallic body comprising a non-metal; and
a bonding layer, being bonded to the non-metallic body and comprising the non-metal, a first alloy, and a second alloy.
2 . The connecting article of claim 1 , further comprising an oxide layer, formed on the second alloy.
3 . The connecting article of claim 2 , wherein the second alloy and the oxide layer constitute a composite layer, and a thickness of the composite layer is 40 μm to 80 μm.
4 . The connecting article of claim 2 , wherein a thickness of the oxide layer is 2 μm to 10 μm.
5 . A laser device, configured to connect a first alloy to a non-metallic body, the non-metallic body comprising a surface, a composite layer disposed on the surface, the laser device comprising:
a laser source; and
a controller, coupled to the laser source and configured to control the laser source to emit laser beams toward the first alloy, causing the first alloy, at least a portion of the composite layer and at least a portion of the non-metallic body to be melted to form a bonding layer, and the bonding layer and the non-metallic body constituting a connecting article.
6 . The laser device of claim 5 , wherein the composite layer comprises a second alloy and an oxide layer, the oxide layer is formed on the second alloy.
7 . The laser device of claim 6 , wherein a thickness of the composite layer is 40 μm to 80 μm.
8 . The laser device of claim 7 , wherein a thickness of the oxide layer is 2 μm to 10 μm.
9 . The laser device of claim 5 , wherein the first alloy is sphericity or quasi-sphericity, and a particle size of the first alloy is 5 μm to 100 μm.
10 . The laser device of claim 9 , wherein the first alloy is sphericity or quasi-sphericity, and a particle size of the first alloy is 15 μm to 53 μm.
11 . The laser device of claim 5 , wherein the controller is configured to control the laser source to emit laser beam along at least a light emission path in a set of light emission paths.
12 . The laser device of claim 11 , wherein the set of light emission paths comprises a first light emission path and a second light emission path, and an angle between the second light emission path and the first light emission path is 40 degrees to 80 degrees.
13 . A method for manufacturing a connecting article, the connecting article comprising a non-metallic body, the non-metallic body comprising a surface; the method comprising:
disposing a composite layer on the surface;
disposing a first alloy on the composite layer; and
emitting laser beam toward the first alloy, causing the first alloy, at least a portion of the composite layer, and at least a portion of the non-metallic body to be melted to form a bonding layer, and the bonding layer and the non-metallic body constituting the connecting article.
14 . The method of claim 13 , further comprising:
disposing a second alloy on the surface; and
oxidizing at least a portion of the second alloy to form the oxide layer, and the second alloy and the oxide layer constituting the composite layer.
15 . The method of claim 14 , wherein a thickness of the composite layer is 40 μm to 80 μm.
16 . The method of claim 15 , wherein a thickness of the oxide layer is 2 μm to 10 μm.
17 . The method of claim 13 , wherein the first alloy is sphericity or quasi-sphericity, and a particle size of the first alloy is 5 μm to 100 μm.
18 . The method of claim 17 , wherein the first alloy is sphericity or quasi-sphericity, and a particle size of the first alloy is 15 μm to 53 μm.
19 . The method of claim 13 , wherein the emitting comprises:
emitting laser beams along at least a light emission path in a set of light emission paths toward the first alloy, causing the first alloy, at least a portion of the composite layer, and at least a portion of the non-metallic body to be melt to form a bonding layer.
20 . The method of claim 19 , wherein the at least one light emission path comprises a first light emission path and a second light emission path, and an angle between the second light emission path and the first light emission path is 40 degrees to 80 degrees.