Laterally-diffused metal-oxide-semiconductor devices for electrostatic discharge protection applications
Structures for a laterally-diffused metal-oxide-semiconductor device and methods of forming a structure for a laterally-diffused metal-oxide-semiconductor device. First and second source/drain regions are formed in a substrate, a gate electrode is formed over the substrate, an interconnect structure over the substrate, and a doped region is arranged in the substrate beneath the first source/drain region. The gate electrode is laterally positioned between the first and second source/drain regions, and the interconnect structure includes a contact connected to the first source/drain region. The doped region has a side edge that is laterally spaced from the contact by a distance.
1. A structure for a laterally-diffused metal-oxide-semiconductor device, the structure comprising:
a substrate;
a first source/drain region and a second source/drain region in the substrate;
a gate electrode over the substrate, the gate electrode laterally positioned between the first source/drain region and the second source/drain region;
an interconnect structure over the substrate, the interconnect structure including a contact connected to the first source/drain region; and
a doped region arranged in the substrate beneath the first source/drain region, the doped region having a side edge that is laterally spaced from the contact by a distance, and the doped region fully positioned in a lateral direction between the gate electrode and the contact.
2. The structure of claim 1 wherein the first source/drain region and the second source/drain region have a first conductivity type, and the doped region has a second conductivity type of opposite polarity to the first conductivity type.
3. The structure of claim 1 wherein the first source/drain region and the second source/drain region have n-type conductivity, and the doped region has p-type conductivity.
4. The structure of claim 1 further comprising:
a first well in the substrate; and
a second well in the substrate, the second well positioned between the first source/drain region and the first well,
wherein the doped region is positioned in the second well.
5. The structure of claim 4 wherein the first well and the doped region have a first conductivity type, and the second well has a second conductivity type of opposite polarity to the first conductivity type.
6. A structure for a laterally-diffused metal-oxide-semiconductor device, the structure comprising:
a substrate;
a first source/drain region and a second source/drain region in the substrate;
a gate electrode over the substrate, the gate electrode laterally positioned between the first source/drain region and the second source/drain region;
a first well in the substrate;
a second well in the substrate, the second well positioned between the first source/drain region and the first well;
an interconnect structure over the substrate, the interconnect structure including a contact connected to the first source/drain region; and
a doped region arranged in the substrate beneath the first source/drain region, the doped region is positioned in the second well, and the doped region having a side edge that is laterally spaced from the contact by a distance,
wherein the first well includes a first portion laterally adjacent to the second well and a second portion beneath the second well, the first well and the second well define a junction, the junction has a first segment between the first portion of the first well and the second well, and the junction has a second segment between the second portion of the first well and the second well.
7. The structure of claim 6 wherein the second portion of the first well extends fully beneath the second well.
8. The structure of claim 6 wherein the second portion of the first well extends partially beneath the second well.
9. The structure of claim 1 further comprising:
a well in the substrate,
wherein the doped region is positioned in the well, the first source/drain region is positioned over the doped region in the well, and the first source/drain region and the well fully surround the doped region.
10. The structure of claim 9 wherein the first source/drain region and the well have a first conductivity type, and the doped region has a second conductivity type of opposite polarity to the first conductivity type.
11. The structure of claim 1 further comprising:
a trench isolation region in the substrate, the trench isolation region positioned in the substrate adjacent to the first source/drain region,
wherein the gate electrode includes a first portion positioned over the trench isolation region.
12. The structure of claim 11 further comprising:
a first well in the substrate; and
a second well in the substrate, the second well positioned between the first source/drain region and the first well,
wherein the doped region and the trench isolation region are positioned in the second well, and the gate electrode includes a second portion positioned over the first well and a third portion positioned over the second well.
13. The structure of claim 11 further comprising:
a conformal dielectric layer positioned over the substrate, the conformal dielectric layer arranged to overlap in part with the gate electrode and to overlap in part with the trench isolation region.
14. A method of forming a structure for a laterally-diffused metal-oxide-semiconductor device, the method comprising:
forming a first source/drain region and a second source/drain region in a substrate;
forming a gate electrode over the substrate that is laterally positioned between the first source/drain region and the second source/drain region;
forming an interconnect structure over the substrate; and
forming a doped region arranged in the substrate beneath the first source/drain region,
wherein the interconnect structure includes a contact connected to the first source/drain region, the doped region has a side edge that is laterally spaced from the contact by a distance, and the doped region is fully positioned in a lateral direction between the gate electrode and the contact.
15. The method of claim 14 further comprising:
forming a first well in the substrate; and
forming a second well in the substrate,
wherein the second well is positioned between the first source/drain region and the first well, the doped region is positioned in the second well, and the first well and the doped region have p-type conductivity, and the second well has n-type conductivity.
16. The method of claim 15 wherein the first well includes a first portion laterally adjacent to the second well and a second portion beneath the second well, the first well and the second well define a junction, the junction has a first segment between the first portion of the first well and the second well, and the junction has a second segment between the second portion of the first well and the second well.
17. The method of claim 14 further comprising:
forming a well in the substrate,
wherein the doped region is positioned in the well, the first source/drain region is positioned over the doped region in the well, the first source/drain region and the well fully surround the doped region, the first source/drain region and the well have a first conductivity type, and the doped region has a second conductivity type of opposite polarity to the first conductivity type.
18. The structure of claim 4 wherein the first well includes a first portion laterally adjacent to the second well and a second portion beneath the second well, the first well and the second well define a junction, the junction has a first segment between the first portion of the first well and the second well, and the junction has a second segment between the second portion of the first well and the second well.
19. The structure of claim 18 wherein the second portion of the first well extends fully beneath the second well.
20. The structure of claim 18 wherein the second portion of the first well extends partially beneath the second well.