IP Library › Granted Patent US 11,322,308
Granted Patent B2
US 11,322,308 · App. 16/997,996 · Granted May 3, 2022

Capacitor

Inventors: Mitsuo Sano (Kamakura, JP); Susumu Obata (Yokohama, JP); Kazuhito Higuchi (Yokohama, JP); Kazuo Shimokawa (Yokohama, JP)
Assignee: KABUSHIKI KAISHA TOSHIBA
H01G4/33H01G4/01H01G4/012H01G4/306H01L28/90
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Quick Facts
Patent No.
US 11,322,308
App. No.
16/997,996
Granted
May 3, 2022
Kind
B2
Abstract

According to an embodiment, a capacitor includes a conductive substrate, a conductive layer and a dielectric layer. The conductive substrate has a first main surface and a second main surface. The first main surface includes sub-regions. Each sub-region is provided with recesses or projections each having a shape extending in one direction and arranged in a width direction thereof. One or more of the sub-regions and another one or more of the sub-regions are different from each other in a length direction of the recesses or protrusions. The conductive layer covers sidewalls and bottom surfaces of the recesses or sidewalls and top surfaces of the projections. The dielectric layer is interposed between the conductive substrate and the conductive layer.

Claims (20)

1. A capacitor comprising:

a conductive substrate having a first main surface and a second main surface, the first main surface including a plurality of first sub-regions, each of the first sub-regions being provided with a plurality of first recesses or first protrusions each having a shape extending in one direction and arranged in a width direction thereof, one or more of the first sub-regions and another one or more of the first sub-regions being different from each other in a length direction of the first recesses or first protrusions, and the length direction of the first recesses or first protrusions being inclined with respect to a boundary between the first sub-regions;

a conductive layer covering sidewalls and bottom surfaces of the first recesses or sidewalls and top surfaces of the first protrusions; and

a dielectric layer interposed between the conductive substrate and the conductive layer.

2. The capacitor according to claim 1 , wherein the one or more of the first sub-regions and the another one or more of the first sub-regions are arranged in a checkered pattern.

3. The capacitor according to claim 1 , wherein one or more of the first sub-regions are provided with a plurality of trenches as the first recesses.

4. The capacitor according to claim 1 , wherein a plurality of wall parts are provided as the first protrusions in one or more of the first sub-regions.

5. A capacitor comprising:

a conductive substrate having a first main surface and a second main surface, the first main surface including a plurality of first sub-regions, each of the first sub-regions being provided with a plurality of first recesses or first protrusions each having a shape extending in one direction and arranged in a width direction thereof, and one or more of the first sub-regions and another one or more of the first sub-regions being different from each other in a length direction of the first recesses or first protrusions;

a conductive layer covering sidewalls and bottom surfaces of the first recesses or sidewalls and top surfaces of the first protrusions; and

a dielectric layer interposed between the conductive substrate and the conductive layer, wherein

one or more of the first sub-regions are provided with a plurality of trenches as the first recesses, the trenches forming a plurality of rows arranged in a width direction and each constituted by two or more trenches arranged in the length direction in each of the one or more of the first sub-regions provided with the trenches, or

one or more of the first sub-regions are provided with a plurality of wall parts as the first protrusions, the wall parts adjacent in a width direction thereof being connected to each other in each of the one or more of the first sub-regions provided with the wall parts.

6. A capacitor comprising:

a conductive substrate having a first main surface and a second main surface, the first main surface including a plurality of first sub-regions, each of the first sub-regions being provided with a plurality of first recesses or first protrusions each having a shape extending in one direction and arranged in a width direction thereof, and one or more of the first sub-regions and another one or more of the first sub-regions being different from each other in a length direction of the first recesses or first protrusions;

a conductive layer covering sidewalls and bottom surfaces of the first recesses or sidewalls and top surfaces of the first protrusions; and

a dielectric layer interposed between the conductive substrate and the conductive layer, wherein

the second main surface comprises a plurality of second sub-regions, each of the second sub-regions is provided with a plurality of second recesses or second projections each having a shape extending in one direction and arranged in a width direction thereof, one or snore of the second sub-regions and another one or more of the second sub-regions are different from each other in a length direction of the second recesses or second projections, and the conductive layer further covers sidewalls and bottom surfaces of the second recesses or sidewalls and top surfaces of the second projections, and

wherein the length direction of the first recesses or first protrusions in each of the first sub-regions is orthogonal to the length direction of the second recesses or first protrusions in the second sub-regions disposed at a position corresponding to the first sub-region.

7. The capacitor according to claim 6 , wherein the one or more of the second sub-regions and the another one or more of the second sub-regions are arranged in a checkered pattern.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2020
From: SANO, MITSUO; OBATA, SUSUMU; HIGUCHI, KAZUHITO; SHIMOKAWA, KAZUO
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 053548/0106 →
Priority Claims (1)
JP JP2019-171151 · Sep 20, 2019 · national
Continuity (1)
Related Publication 20210090814A1 · Mar 25, 2021