Heat dissipation for a photovoltaic junction box
An apparatus of a junction box component housed in a junction box and designed to be coupled to a power generator. The junction box component may include one or more bypass mechanisms configured to bypass one or more substrings of the power generator in a case of malfunction or mismatch between the substring and the remainder of the power generators. The one or more bypass mechanisms may generate heat which may be transferred out of the junction box. The junction box component may be designed to conduct the heat towards the base of the junction box and/or the cover of the junction box. A heat dissipation mechanism may be mounted on the base and/or the cover. A bypass mechanism may bypass the entire power generator.
1. A junction box comprising:
a base comprising a plurality of bus bars and at least one bypass mechanism coupled between two bus bars of the plurality of bus bars; and
a cover configured to be mounted over the base, the cover comprising at least one power converter configured to convert DC power having a first voltage generated by a power generator to AC power or DC power having a second voltage;
wherein a heat dissipation mechanism is mounted on the cover, and
wherein the heat dissipation mechanism is in thermal contact with the one or more bus bars when the cover is mounted over the base.
2. The junction box of claim 1 , wherein the one or more bus bars of the plurality of bus bars includes a first heat spreading part designed to conduct heat in a first direction and a second heat spreading part designed to conduct heat in a second direction.
3. The junction box of claim 1 , further comprising a plurality of connectors, each connector designed to be connected to a conductor carrying current from a photovoltaic generator, and each connector electrically coupled to a bus bar of the plurality of bus bars.
4. The junction box of claim 1 , wherein the at least one bypass mechanism includes diodes.
5. The junction box of claim 1 , wherein the at least one bypass mechanism comprises a plurality of bypass mechanisms, wherein the plurality of bypass mechanisms are serially coupled.
6. The junction box of claim 5 , further comprising an additional bypass mechanism disposed in parallel to two or more bypass mechanisms of the plurality of bypass mechanisms.
7. The junction box of claim 6 , wherein the additional bypass mechanism is electrically coupled between a first bus bar of the plurality of bus bars and a last bus bar of the plurality of bus bars.
8. The junction box of claim 6 , wherein the additional bypass mechanism includes a diode.
9. The junction box of claim 6 , wherein the additional bypass mechanism is a controlled switch.
10. The junction box of claim 6 , further comprising an additional bus bar, wherein the additional bypass mechanism is coupled between a bus bar of the plurality of bus bars and the additional bus bar.
11. The junction box of claim 6 , wherein the additional bypass mechanism is coupled between two bus bars of the plurality of bus bars via a conductive rod extending from the additional bypass mechanism to at least one of two bus bars of the plurality of bus bars.
12. The junction box of claim 1 , wherein the at least one bypass mechanism comprises a plurality of bypass mechanisms, further comprising an additional bypass mechanism mounted on the cover, wherein, when the cover is mounted over the base, the additional bypass mechanism is disposed in parallel to two or more bypass mechanisms of the plurality of bypass mechanisms.
13. The junction box of claim 1 , wherein the cover comprises a communication device communicatively coupled to one or more controllers configured to control at least one component in the junction box.
14. The junction box of claim 1 , wherein the heat dissipation mechanism comprises a fan.
15. The junction box of claim 1 , wherein the heat dissipation mechanism comprises a cooling agent.
16. The junction box of claim 1 , wherein the heat dissipation mechanism comprises a cryogenic cooler.
17. The junction box of claim 1 , wherein the heat dissipation mechanism comprises at least one of: thermal grease, thermal pads, thermal putty, thermal paste, or laminated Kapton® polyimide film.
18. The cover of claim 1 further comprising a section comprising a material which withstands heat dissipated from the at least one bypass mechanism.
19. A method comprising:
coupling a plurality of bypass mechanisms between two bus bars of a plurality of bus bars, the plurality of bus bars and a plurality of bypass mechanisms being comprised in a base of a junction box, the junction box further comprising walls which function as heat sinks; and
mounting a cover comprising a heat dissipation mechanism over the base,
wherein the heat dissipation mechanism is in contact with the one or more bus bars when the cover is mounted over the base; and
wherein the cover comprises one or more power converters configured to convert DC power having a first voltage generated by a power generator to AC power or DC power having a second voltage.