Electrostatic discharge device
The present disclosure relates to semiconductor structures and, more particularly, to an electrostatic discharge (ESD) device and methods of manufacture. The structure (ESD device) includes: a trigger collector region having fin structures of a first dopant type, a collector region having fin structures in a well of a second dopant type and further including a lateral ballasting resistance; an emitter region having a well of the second dopant type and fin structures of the first dopant type; and a base region having a well and fin structures of the second dopant type.
1. A structure comprising:
a trigger collector region comprising fin structures of a first dopant type;
a collector region comprising fin structures in a well of the first dopant type;
a lateral ballasting resistance at the trigger collector region which comprises the collector region and the well of the first dopant type;
an emitter region comprising a well of a second dopant type and fin structures of the first dopant type; and
a base region comprising a well and fin structures of the second dopant type.
2. The structure of claim 1 , wherein the lateral ballasting resistance is provided in a directly adjacent and contacting the collector region and comprises the well of the first dopant type.
3. The structure of claim 2 , wherein the well of the first dopant type of the lateral ballasting resistance comprises a N-well and remaining portions of the trigger collector region comprise a P-well.
4. The structure of claim 3 , wherein the fins of the first dopant type over the N-well comprise collector fin structures.
5. The structure of claim 4 , wherein the fin structures of the first dopant type comprise n+ dopant.
6. The structure of claim 5 , wherein the emitter region and the base region are provided in P-well regions, the fin structures in the emitter region are n+ doped fins and the fin structures in the base region are p+ doped fins.
7. The structure of claim 1 , further comprising shallow trench isolation regions which separate the emitter region from the collector region and the emitter region from the base region.
8. The structure of claim 1 , wherein the first dopant type is p+ dopant and the second dopant type is n+ dopant type.
9. The structure of claim 1 , further comprising shallow trench isolation regions which separate the emitter region from the collector region and the emitter region from the base region.
10. A structure comprising a fin based bipolar electrostatic discharge (ESD) device comprising a trigger collector region having a first well of a first dopant type, and a collector region having a second well of a second dopant type, and with fins of the second dopant type over the first well and the second well.
11. The structure of claim 10 , wherein the first dopant type is a p-dopant type and the second dopant type is an n-dopant type.
12. The structure of claim 11 , wherein the first well of the p-dopant type and the second well of the n-dopant type are directly contacting.
13. The structure of claim 11 , further comprising shallow trench isolation structures separating a base region from an emitter region and the collector region from the emitter region.
14. The structure of claim 10 , wherein the first dopant type is a n-dopant type and the second dopant type is p-dopant type.
15. The structure of claim 10 , wherein the second well of the second dopant type and the fins of the second dopant type are a ballast resistance region.
16. The structure of claim 15 , wherein ballast resistance region is a lateral ballast resistance region.
17. A structure comprising:
a trigger collector region comprising a P-well with n-type fin structures over the P-well;
a collector region directly adjacent to the trigger collector region, the collector region comprising a N-well with n-type fin structures over the N-well;
an emitter region comprising the P-well with n-type fin structures over the P-well;
a base region comprising the P-well with n-type fin structures over the P-well; and
shallow trench isolation regions separating the collector region from the emitter region and the base region from the emitter region.
18. The structure of claim 17 , wherein the N-well with the n-type fin structures of the collector region are a lateral ballasting resistance region.
19. The structure of claim 17 , wherein the P-well of the trigger collector region and the N-well of the collector region are in direct contact.
20. The structure of claim 17 , wherein the collector region is between the trigger collector region and the emitter region.