Method of fabricating conductive pattern, display device, and method of fabricating display device
A method of fabricating a conductive pattern includes forming a conductive metal material layer and a conductive capping material layer on a substrate, forming a photoresist pattern as an etching mask on the conductive capping material layer, forming a first conductive capping pattern by etching the conductive capping material layer with a first etchant, forming a conductive metal layer and a second conductive capping pattern by etching the conductive metal material layer and the first conductive capping pattern with a second etchant, and forming a conductive capping layer by etching the second conductive capping pattern with a third etchant. The second conductive capping pattern includes a first region overlapping the conductive metal layer and a second region not overlapping the conductive metal layer, and the forming of the conductive capping layer includes etching the second region of the second conductive capping pattern to form the conductive capping layer.
1. A method of fabricating a conductive pattern, comprising:
forming a conductive metal material layer and a conductive capping material layer on a substrate;
forming a photoresist pattern as an etching mask on the conductive capping material layer;
forming a first conductive capping pattern by etching the conductive capping material layer with a first etchant;
forming a conductive metal layer and a second conductive capping pattern by etching the conductive metal material layer and the first conductive capping pattern with a second etchant; and
forming a conductive capping layer by etching the second conductive capping pattern with a third etchant, wherein
the second conductive capping pattern includes a first region overlapping an upper surface of the conductive metal layer and a second region not overlapping the upper surface of the conductive metal layer, and
the forming of the conductive capping layer comprises:
etching the second region of the second conductive capping pattern to form the conductive capping layer.
2. The method of claim 1 , wherein the forming of the conductive metal layer includes:
forming a main metal layer below the conductive capping layer,
wherein the main metal layer is in contact with the conductive capping layer and includes copper (Cu).
3. The method of claim 2 , wherein the conductive capping layer includes at least one of an indium tin oxide (ITO) film, a titanium (Ti) film, an indium zinc oxide (IZO) film, and an indium tin zinc oxide (ITZO) film.
4. The method of claim 3 , wherein the forming of the conductive capping layer includes:
aligning sidewalls of the conductive capping layer with sidewalls of the main metal layer, or
disposing the sidewalls of the conductive capping layer inside of the sidewalls of the main metal layer.
5. The method of claim 2 , wherein the forming of the conductive metal layer includes:
forming a conductive base layer below the main metal layer,
wherein the conductive base layer is in contact with the main metal layer and includes titanium (Ti).
6. The method of claim 1 , wherein the forming of the first conductive capping pattern comprises:
over-etching the conductive capping material layer at an over-etch rate in a range of about 100% to about 200%, wherein
the over-etch rate of the conductive capping material layer is determined based on a thickness of the conductive capping material layer, and
an etching speed of the first etchant for the conductive capping material layer is higher than an etching speed of the first etchant for the conductive metal material layer; and
forming sidewalls of the first conductive capping pattern inside of sidewalls of the photoresist pattern by the over-etching of the conductive capping material layer.
7. The method of claim 6 , wherein
the forming of the conductive capping layer comprises over-etching the second conductive capping pattern at an over-etch rate of about 10% or lower, and
the over-etch rate of the second conductive capping pattern is determined based on a thickness of the second region of the second conductive capping pattern.
8. The method of claim 6 , wherein
the forming of the conductive metal layer comprises over-etching the conductive metal material layer at an over-etch rate of about 50% or lower, and
the over-etch rate of the conductive metal material layer is determined based on a thickness of the conductive metal material layer.
9. The method of claim 6 , wherein the forming of the first conductive capping pattern comprises:
exposing a region of the conductive metal material layer that does not overlap the photoresist pattern.
10. The method of claim 1 , wherein an etching speed of the second etchant for the conductive capping material layer is lower than an etching speed of the second etchant for the conductive metal material layer.
11. The method of claim 10 , wherein
the first etchant and the third etchant are a same etchant, and
an etching duration of the etching of the conductive capping material layer with the first etchant is longer than an etching duration of the etching of the second conductive capping pattern with the third etchant.
12. The method of claim 10 , wherein
the first etchant and the third etchant are different etchants, and
an etching speed of the third etchant for the conductive capping material layer is lower than an etching speed of the first etchant for the conductive capping material layer.
13. The method of claim 1 , further comprising:
removing the photoresist pattern after forming the conductive capping layer.
14. A method of fabricating a display device, comprising:
preparing a substrate including a display area and a pad area;
forming a data conductive layer including:
source and drain electrodes disposed in the display area and a wire pad disposed in the pad area;
a data conductive metal layer disposed on the substrate; and
a data capping layer disposed on the data conductive metal layer, wherein the forming of the data conductive layer comprises:
forming a material layer for the data conductive metal layer and a material layer for the data capping layer on the substrate;
forming a photoresist pattern as an etching mask on the material layer for the data capping layer;
forming a first data capping pattern layer by etching the material layer for the data capping layer with a first etchant;
forming the data conductive metal layer and a second data capping pattern layer on the data conductive metal layer, by etching the material layer for the data conductive metal layer and the first data capping pattern layer on the material layer for the data conductive metal layer with a second etchant; and
forming the data capping layer by etching the second data capping pattern layer with a third etchant, and
wherein the forming of the first data capping pattern layer includes exposing a part of the material layer for the data conductive metal layer that does not overlap the photoresist pattern.
15. The method of claim 14 , wherein the forming of the data conductive metal layer includes:
forming a data main metal layer below the data capping layer,
wherein the data main metal layer is in contact with the data capping layer and includes copper (Cu).
16. The method of claim 15 , wherein the data capping layer includes at least one of an indium tin oxide (ITO) film, a titanium (Ti) film, an indium zinc oxide (IZO) film, and an indium tin zinc oxide (ITZO) film.
17. The method of claim 15 , wherein an etching speed of the second etchant for the material layer for the data capping layer is lower than an etching speed of the second etchant for the material layer for the data conductive metal layer.
18. The method of claim 17 , wherein the etching of the material layer for the data conductive metal layer and the first data capping pattern layer with the second etchant includes forming in the second data capping pattern layer:
a first region that overlaps the data conductive metal layer; and
a second region that does not overlap the data conductive metal layer and overlaps the photoresist pattern.
19. The method of claim 14 , wherein the forming of the data capping layer comprises:
aligning sidewalls of the data capping layer with sidewalls of the data conductive metal layer, or
disposing the sidewalls of the data capping layer inside of the sidewalls of the data conductive metal layer.
20. The method of claim 14 , wherein the forming of the first data capping pattern layer comprises:
over-etching the material layer for the data capping layer at an over-etch rate in a range of about 100% to about 200%, wherein
the over-etch rate of the material layer for the data capping layer is determined based on a thickness of the material layer for the data capping layer, and
an etching speed of the first etchant for the material layer for the data capping layer is higher than an etching speed of the first etchant for the material layer for the data conductive metal layer; and
forming sidewalls of the first data capping pattern layer inside of sidewalls of the photoresist pattern by the over-etching of the material layer for the data capping layer.
21. The method of claim 20 , wherein
the forming of the data capping layer comprises over-etching the second data capping pattern layer at an over-etch rate of about 10% or lower,
the second data capping pattern layer includes a first region overlapping an upper surface of the data conductive metal layer, and a second region not overlapping the upper surface of the data conductive metal layer, and
the over-etch rate of the second data capping pattern layer is determined based on a thickness of the second region of the second data capping pattern layer.
22. The method of claim 20 , wherein
the forming of the data conductive metal layer comprises over-etching the material layer for the data conductive metal layer at an over-etch rate of about 50% or lower, and
the over-etch rate of the material layer for the data conductive metal layer is determined based on a thickness of the material layer for the data conductive metal layer.