Assembly structure and electronic device having the same
The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and a connection component, configured to electrically connect the circuit board and the power converting module. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.
1. An assembly structure for providing power for a chip, comprising:
a circuit board, configured to provide a first electrical energy;
a chip;
a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and
a connection component, configured to electrically connect the circuit board and the power converting module;
wherein the power converting module and the chip are located on two opposite sides of the circuit board;
the connection component comprises a connector electrically connecting the circuit board and the power converting module, wherein the connector and the chip are disposed on two opposite sides of the circuit board; and
the connection component further comprises a back plate, wherein the back plate and the chip are disposed on two opposite sides of the circuit board.
2. The assembly structure for providing power for a chip according to claim 1 , wherein a connection point of the connector and the circuit board is outside a projection of the chip on the circuit board.
3. The assembly structure for providing power for a chip according to claim 1 , wherein the power converting module is partly buried in the back plate, and a surface of the power converting module is exposed from the back plate and directly contacts the connector.
4. The assembly structure for providing power for a chip according to claim 3 , wherein the connector extends along an outer surface of the back plate, to electrically connect the circuit board and the power converting module.
5. The assembly structure for providing power for a chip according to claim 4 , wherein the connector extends along a lateral surface of the back plate and a surface of the back plate away from the circuit board.
6. The assembly structure for providing power for a chip according to claim 3 , wherein a part of the connector is located between the back plate and the circuit board, to electrically connect the circuit board and the power converting module.
7. The assembly structure for providing power for a chip according to claim 1 , wherein connection points of the connector and the circuit board are on one side or more sides of a projection of the power converting module on the circuit board.
8. The assembly structure for providing power for a chip according to claim 1 , wherein the connector is configured to transmit input power of the power converting module from the circuit board to the power converting module.
9. The assembly structure for providing power for a chip according to claim 1 , wherein the connector is configured to transmit output power of the power converting module from the power converting module to the circuit board.
10. The assembly structure for providing power for a chip according to claim 1 , wherein the connector is formed of heat conductive material.
11. The assembly structure for providing power for a chip according to claim 1 , further comprising:
a heat sink, disposed on the connector.
12. An assembly structure for providing power for a chip, comprising:
a circuit board, configured to provide a first electrical energy;
a chip;
a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and
a connection component, configured to electrically connect the circuit board and the power converting module;
wherein the power converting module and the chip are located on two opposite sides of the circuit board;
the connection component comprises a connector electrically connecting the circuit board and the power converting module, wherein the connector and the chip are disposed on two opposite sides of the circuit board; and
a surface of the connector is formed with a wing shaped structure.
13. An assembly structure for providing power for a chip, comprising:
a circuit board, configured to provide a first electrical energy;
a chip;
a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and
a connection component, configured to electrically connect the circuit board and the power converting module;
wherein the power converting module and the chip are located on two opposite sides of the circuit board; and
the connection component comprises:
a back plate, electrically connecting the circuit board and the power converting module, wherein the back plate and the chip are disposed on two opposite sides of the circuit board.