Semiconductor device with isolation structures
A method of fabricating a semiconductor device with superlattice structures on a substrate with an embedded isolation structure is disclosed. The method includes forming an etch stop layer on a substrate, forming a superlattice structure on the etch stop layer, depositing an isolation layer on the superlattice structure, depositing a semiconductor layer on the isolation layer, forming a bi-layer isolation structure on the semiconductor layer, removing the substrate and the etch stop layer, etching the superlattice structure, the isolation layer, the semiconductor layer, and the bi-layer isolation structure to form a fin structure, and forming a gate-all-around structure on the fin structure.
1. A method, comprising:
forming an etch stop layer on a substrate;
forming a superlattice structure on the etch stop layer;
depositing an isolation layer comprising a high-k dielectric layer on the superlattice structure;
depositing a semiconductor layer on the isolation layer;
forming a bi-layer isolation structure on the semiconductor layer;
removing the substrate and the etch stop layer;
etching the superlattice structure, the isolation layer, the semiconductor layer, and the bi-layer isolation structure to form a fin structure; and
forming a gate-all-around structure on the fin structure.
2. The method of claim 1 , wherein forming the etch stop layer comprises depositing a seed layer on the substrate.
3. The method of claim 1 , wherein forming the etch stop layer comprises depositing a doped semiconductor layer on the substrate.
4. The method of claim 1 , wherein forming the etch stop layer comprises depositing a boron-doped silicon germanium layer on the substrate.
5. The method of claim 1 , wherein forming the superlattice structure comprises depositing a seed layer on the etch stop layer.
6. The method of claim 1 , wherein forming the superlattice structure comprises forming a stack of first and second nanostructured layers in an alternating configuration on the etch stop layer.
7. The method of claim 1 , wherein forming the bi-layer isolation structure comprises:
forming a first thermal oxide layer on the semiconductor layer;
forming a second thermal oxide layer on another substrate; and
bonding the first and second thermal oxide layers to each other.
8. The method of claim 1 , wherein forming the bi-layer isolation structure comprises:
forming a first chemical oxide layer on the semiconductor layer;
forming a second chemical oxide layer on another substrate; and
bonding the first and second chemical oxide layers to each other.
9. The method of claim 1 , further comprising forming a barrier layer on the etch stop layer, wherein the forming the barrier layer comprises:
depositing a silicon layer on the etch stop layer; and
depositing a carbide layer on the silicon layer.
10. The method of claim 1 , wherein depositing the isolation layer comprises depositing the high-k dielectric layer with a thickness of about 5 nm to about 30 nm on the superlattice structure.
11. A method, comprising:
forming a fin structure on a substrate, wherein the forming the fin structure comprises:
forming a superlattice structure with first and second nanostructured layers on a sacrificial substrate;
depositing an isolation layer comprising a high-k dielectric layer on the superlattice structure;
depositing a silicon layer on the isolation layer;
forming a bi-layer isolation structure on the silicon layer; and
removing the sacrificial substrate;
forming a polysilicon structure on the fin structure;
forming a source/drain region on the fin structure;
removing the polysilicon structure and the second nanostructured layers to form gate openings; and
forming a gate-all-around structure within the gate openings.
12. The method of claim 11 , wherein forming the source/drain region comprises:
etching a portion of the fin structure that is not covered by the polysilicon structure; and
etching a portion of the isolation layer that is exposed after etching the portion of the fin structure.
13. The method of claim 11 , wherein forming the source/drain region comprises epitaxially growing a doped semiconductor region on the silicon layer.
14. The method of claim 11 , further comprising depositing a boron-doped silicon germanium (SiGe) layer between the superlattice structure and the sacrificial substrate, wherein the boron-doped SiGe layer comprises a Ge concentration of about 15 atomic % to about 35 atomic % and a boron dopant concentration of about 5×10 19 cm −3 to about 5×10 21 cm −3 .
15. The method of claim 11 , further comprising depositing a carbide layer between the superlattice structure and the sacrificial substrate, wherein the carbide layer comprises a carbon concentration of about 0.5 atomic % to about 5 atomic %.
16. The method of claim 11 , further comprising forming inner spacers between the source/drain region and the gate-all-around structure.
17. A method, comprising:
forming a fin structure on a substrate; comprising:
forming a bi-layer isolation structure on the substrate,
forming a semiconductor layer on the bi-layer isolation structure, and
forming a channel isolation layer comprising a high-k dielectric layer on a first portion of the semiconductor layer;
forming a superlattice structure on the channel isolation layer;
forming a source/drain region on a second portion of the semiconductor layer; and
forming a polysilicon structure on the fin structure.
18. The method of claim 17 , wherein forming the bi-layer isolation structure comprises:
forming a first dielectric layer comprising an oxide of a material of the substrate; and
forming a second dielectric layer comprising an oxide of a material of the semiconductor layer.
19. The method of claim 17 , further comprising replacing the polysilicon structure and a portion of the fin structure with a gate-all-around structure.
20. The method of claim 17 , wherein forming the channel isolation layer comprises depositing the high-k dielectric layer with a thickness of about 5 nm to about 30 nm on the first portion of the semiconductor layer.