IP Library › Granted Patent US 11,129,279
Granted Patent B2
US 11,129,279 · App. 17/010,722 · Granted Sep 21, 2021

Optical subassembly and optical module

Inventors: Daisuke Noguchi (Tachikawa, JP); Hiroshi Yamamoto (Inagi, JP)
Assignee: CIG PHOTONICS JAPAN LIMITED
H05K1/181H05K1/0306H05K1/09H05K1/115H05K1/14H04B10/40H04B10/501H04B10/60
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,129,279
App. No.
17/010,722
Granted
Sep 21, 2021
Kind
B2
Abstract

An optical subassembly includes: a support block made of ceramic in front of the first surface, the support block having a substrate mounting surface, the support block having a first side opposite to a surface in front of the first surface; an element-mounted substrate on the substrate mounting surface, the element-mounted substrate having a first conductor pattern; a pedestal made of metal and configured to be the same potential as the eyelet, the pedestal situated in front of the first surface; and a lead pin in the through-hole and for transmitting the electric signal. The support block has a metallization pattern that is electrically connected to the pedestal and is continuous from at least a part of the substrate mounting surface to at least a part of the first side.

Claims (28)

1. An optical subassembly comprising:

an eyelet having a first surface, the eyelet having a second surface opposite to the first surface, the eyelet having a through-hole penetrating from the second surface to the first surface;

a support block made of ceramic in front of the first surface, the support block having a substrate mounting surface, the support block having a first side opposite to a surface in front of the first surface;

an element-mounted substrate on the substrate mounting surface, the element-mounted substrate having a first conductor pattern;

an optical element for converting an optical signal and an electric signal at least from one to another, the optical element mounted on the element-mounted substrate, the optical element being electrically connected to the first conductor pattern;

a pedestal made of metal and configured to be the same potential as the eyelet, the pedestal situated in front of the first surface;

a lead pin in the through-hole and for transmitting the electric signal; and

a relay board on the pedestal, the relay board having a second conductor pattern for transmitting the electric signal between the lead pin and the first conductor pattern,

wherein the support block has a metallization pattern that is electrically connected to the pedestal and is continuous from at least a part of the substrate mounting surface to at least a part of the first side.

2. The optical subassembly according to claim 1 , further comprising a first bonding wire connecting the pedestal and the metallization pattern, which is disposed on at least the part of the first side.

3. The optical subassembly according to claim 2 , wherein the first bonding wire includes two or more bonding wires.

4. The optical subassembly according to claim 1 , wherein the metallization pattern is not on a surface opposite to the substrate mounting surface.

5. The optical subassembly according to claim 1 , wherein the metallization pattern is not on the surface opposite to the first side.

6. The optical subassembly according to claim 1 , wherein

the element-mounted substrate has a ground pattern, and

the metallization pattern is electrically connected to the ground pattern.

7. The optical subassembly according to claim 1 , further comprising a second bonding wire connecting the first conductor pattern and the second conductor pattern.

8. The optical subassembly according to claim 1 , wherein the eyelet, the support block, and the element-mounted substrate are separated.

9. The optical subassembly according to claim 1 , wherein the eyelet and the pedestal are integrated.

10. The optical subassembly according to claim 1 , further comprising a castellation on a side of the element-mounted substrate.

11. The optical subassembly according to claim 10 , wherein the side of the element-mounted substrate is opposite to a surface, of the element-mounted substrate, facing the first surface of the eyelet.

12. The optical subassembly according to claim 11 , wherein the castellation is situated at a position equal to, or closer to the pedestal than, a position where the optical element is mounted, in a direction parallel to the first surface of the eyelet and parallel to the surface of the element-mounted substrate.

13. The optical subassembly according to claim 1 , wherein the pedestal and the support block are spaced.

14. The optical subassembly according to claim 1 , further comprising a temperature controller between the first surface of the eyelet and the support block.

15. An optical module comprising:

the optical subassembly according to claim 1 ;

a printed circuit board; and

a flexible printed circuit board electrically connected to the printed circuit board and the optical subassembly.

Assignments (2)
CHANGE OF ADDRESS Recorded Jul 19, 2024
From: CIG PHOTONICS JAPAN LIMITED
To: CIG PHOTONICS JAPAN LIMITED
Reel/Frame 068436/0287 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2020
From: NOGUCHI, DAISUKE; YAMAMOTO, HIROSHI
To: CIG PHOTONICS JAPAN LIMITED
Reel/Frame 053678/0724 →
Priority Claims (1)
JP JP2019-164155 · Sep 10, 2019 · national
Continuity (1)
Related Publication 20210076500A1 · Mar 11, 2021