IP Library Granted Patent US 11,398,489
Granted Patent B2
US 11,398,489 · App. 17/012,297 · Granted Jul 26, 2022

Memory array having connections going through control gates

Inventors: Toru Tanzawa (Tokyo, JP); Tamotsu Murakoshi (Kawasaki, JP); Deepak Thimmegowda (Boise, ID)
Assignee: Micron Technology, Inc.
H01L27/11556G11C16/0483H01L27/11521H01L27/11529H01L27/11548H01L27/11568H01L27/11573H01L27/11575H01L27/11582H01L29/66833H01L29/7926H01L27/1157H01L27/11517H01L27/11563H01L27/226H01L27/228
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Quick Facts
Patent No.
US 11,398,489
App. No.
17/012,297
Granted
Jul 26, 2022
Kind
B2
Abstract

Some embodiments include apparatuses and methods having a substrate, a memory cell string including a body, a select gate located in a level of the apparatus and along a portion of the body, and control gates located in other levels of the apparatus and along other respective portions of the body. At least one of such apparatuses includes a conductive connection coupling the select gate or one of the control gates to a component (e.g., transistor) in the substrate. The connection can include a portion going through a portion of at least one of the control gates.

Claims (56)

1. An apparatus comprising:

a first memory array including a first memory cell string over a substrate, and a first select gate and control gates located along a body of the first memory string and over the substrate;

a second memory array including a second memory cell string over the substrate, and a second select gate and control gates located along a body of the second memory string and over the substrate;

a first connection coupled to the first select gate and including a portion going through a portion of a first control gate among the control gates of the first memory array;

a second connection coupled to the second select gate and including a portion going through a portion of a second control gate among the control gates of the second memory array; and

a third connection coupling the first connection to the second connection.

2. The apparatus of claim 1 , wherein the third connection includes a segment parallel to substrate.

3. The apparatus of claim 2 , wherein the first connection includes a first segment perpendicular to the substrate, a second segment perpendicular to the substrate, and a third segment coupling the first segment to the second segment, the third segment being parallel to the substrate.

4. The apparatus of claim 3 , wherein the second connection includes a first segment perpendicular to the substrate, a second segment perpendicular to the substrate, and a third segment coupling the first segment of the second connection to the second segment of the second connection, the third segment of the second connection being parallel to the substrate.

5. The apparatus of claim 1 , further comprising a transistor coupled to the third connection.

6. The apparatus of claim 5 , wherein the transistor includes source and drain regions formed in an area of the substrate, the area of the substrate being under and between the first and second arrays.

7. The apparatus of claim 5 , wherein the transistor includes source and drain regions formed in an area of the substrate, the area of the substrate being under the first array.

8. An apparatus comprising:

a first memory array including a first memory cell string over a substrate, and first control gates located along a body of the first memory string and over the substrate;

a second memory array including a second memory cell string over the substrate, and second control gates located along a body of the second memory string and over the substrate;

a first connection coupled to a control gate of the first control gates, the first connection including a segment between the first and second memory arrays;

a second connection coupled to a control gate of the second control gates, the second connection including a segment between the first and second memory arrays; and

a third connection coupling the segment of the first connection to the segment of the second connection.

9. The apparatus of claim 8 , wherein:

the segment of the first connection is perpendicular to the substrate; and

the segment of the second connection is perpendicular to the substrate.

10. The apparatus of claim 8 , wherein:

the segment of the first connection is a first segment, and the first connection includes an additional segment parallel to the substrate and coupled to the first segment; and

the segment of the second connection is a second segment, and the second connection includes an additional segment parallel to the substrate and coupled to the second segment.

11. The apparatus of claim 10 , wherein:

first connection includes a third segment perpendicular to the substrate and coupled to the additional segment of the first connection; and

the second connection includes a fourth segment perpendicular to the substrate and coupled to the additional segment of the second connection.

12. The apparatus of claim 8 , further comprising a transistor coupled to the third connection.

13. The apparatus of claim 12 , wherein the transistor includes source and drain regions formed in an area of the substrate, the area of the substrate being under and between the first and second arrays.

14. An apparatus comprising:

a first memory array including a first memory cell string over a substrate, and a first select gate and first control gates located along a body of the first memory string and over the substrate;

a second memory array including a second memory cell string over the substrate, and a second select gate and second control gates located along a body of the second memory string and over the substrate;

a first connection coupled to the first select gate and including a portion going through a portion of the first control gates;

a first additional connection coupled to a control gate of the first control gates;

a second connection coupled to the second select gate and including a portion going through a portion of the second control gates;

a second additional connection coupled to a control gate of second control gates;

a third connection coupling the first connection to the second connection; and

a fourth connection coupling the first additional connection to the second additional connection.

15. The apparatus of claim 14 , wherein:

the first additional connection includes a segment between the first and second memory arrays; and

the second additional connection includes a segment between the first and second memory arrays.

16. The apparatus of claim 14 , wherein:

the third connection includes a segment parallel to substrate; and

the fourth connection includes a segment parallel to substrate.

17. The apparatus of claim 14 , wherein:

the first connection includes a first segment perpendicular to the substrate, a second segment perpendicular to the substrate, and a third segment third segment parallel to the substrate and coupling the first segment to the second segment; and

the first additional connection includes a first additional segment perpendicular to the substrate, a second additional segment perpendicular to the substrate, and a third additional segment parallel to the substrate and coupling the first additional segment to the second additional segment.

18. The apparatus of claim 17 , wherein

the second connection includes a first segment perpendicular to the substrate, a second segment perpendicular to the substrate, and a third segment third segment parallel to the substrate and coupling the first segment of the second connection to the second segment of the second connection; and

the second additional connection includes a first additional segment perpendicular to the substrate, a second additional segment perpendicular to the substrate, and a third additional segment parallel to the substrate and coupling the first additional segment of the second additional connection to the second additional segment of the second additional connection.

19. The apparatus of claim 14 , further comprising:

a first transistor coupled to the third connection; and

a second transistor coupled to the fourth connection.

20. The apparatus of claim 14 , wherein:

the first control gates include edges forming a first staircase; and

the second control gates include edges forming a second staircase.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2023
From: MICRON TECHNOLOGY, INC.
To: LODESTAR LICENSING GROUP, LLC
Reel/Frame 064988/0210 →
Continuity (3)
Division 15457473 · Mar 13, 2017
Division 13599793 · Aug 30, 2012
Related Publication 20210005624A1 · Jan 7, 2021
Cited By (1)
US 12,356,614