Optical transceiver
An optical transceiver includes a housing, a heat dissipation module and an optical communication module. The heat dissipation module includes a first heat conductive component and a second heat conductive component accommodated in the housing. The first heat conductive component and the second heat conductive component are two independent components, and the first heat conductive component thermally contacts the second heat conductive component. The optical communication module is accommodated in the housing and thermally contacts the heat dissipation module.
1. An optical transceiver, comprising:
a housing;
a heat dissipation module comprising a first heat conductive component and a second heat conductive component accommodated in the housing, the first heat conductive component and the second heat conductive component being two independent components, and the first heat conductive component thermally contacting the second heat conductive component;
an optical communication module accommodated in the housing and thermally contacting the heat dissipation module; and
wherein a protrusion of the first heat conductive component extends toward a protrusion of the second heat conductive component, the protrusion of the second heat conductive component extends toward the protrusion of the first heat conductive component, and the protrusion of the first heat conductive component thermally contacts the protrusion of the second heat conductive component.
2. The optical transceiver according to claim 1 , wherein the housing comprises an upper cover and a lower cover assembled together, the first heat conductive component is located between the second heat conductive component and part of the upper cover, the second heat conductive component is located between the first heat conductive component and part of the lower cover, and the second heat conductive component thermally contacts the lower cover.
3. The optical transceiver according to claim 2 , wherein the heat dissipation module further comprises an auxiliary dissipation component disposed on the housing, and the first heat conductive component thermally contacts the auxiliary dissipation component.
4. The optical transceiver according to claim 3 , wherein the auxiliary dissipation component is disposed in an opening of the upper cover of the housing.
5. The optical transceiver according to claim 3 , wherein an outer surface of the upper cover has a recess, and the auxiliary dissipation component is disposed in the recess.
6. The optical transceiver according to claim 1 , wherein the heat dissipation module further comprises a thermal conductive pad squeezed between the protrusion of the first heat conductive component and the protrusion of the second heat conductive component.
7. The optical transceiver according to claim 1 , wherein the optical communication module comprises a circuit board and an optical communication component disposed on the circuit board, and the circuit board thermally contacts the first heat conductive component and the second heat conductive component of the heat dissipation module.
8. The optical transceiver according to claim 7 , wherein the circuit board comprises a thermal via, the optical communication component thermally contacts the thermal via, and the thermal via thermally contacts the first heat conductive component and the second heat conductive component of the heat dissipation module.
9. The optical transceiver according to claim 1 , wherein each of the first heat conductive component and the second heat conductive component is made of a material selected from the group consisting of copper, aluminum, nickel and alloys thereof.