Memory device and operating method thereof
A memory device includes a cell array and a page buffer circuit. The cell array includes a first to fourth cell strings respectively connected to a first to fourth bit lines. The page buffer circuit is configured to apply an erase voltage to the first and third bit lines based on a first control signal during an erase operation for memory cells of the first to fourth cell strings. The page buffer circuit is configured to place the second and fourth bit lines in a floating state based on a second control signal during the erase operation.
1. A memory device, comprising:
a cell array including a first to fourth cell strings respectively connected to a first to fourth bit lines; and
a page buffer circuit configured to:
apply an erase voltage to the first and third bit lines based on a first control signal during an erase operation for memory cells of the first to fourth cell strings; and
place the second and fourth bit lines in a floating state based on a second control signal during the erase operation.
2. The memory device of claim 1 , wherein the page buffer circuit is further configured to:
apply a first precharge voltage to the second bit line before the erase operation, and
apply a second precharge voltage to the fourth bit line before the erase operation.
3. The memory device of claim 2 , wherein the erase voltage is greater than the first precharge voltage and the erase voltage is greater than the second precharge voltage.
4. The memory device of claim 2 , wherein the first precharge voltage is greater than a ground voltage and the second precharge voltage is greater than the ground voltage.
5. The memory device of claim 2 , wherein the second precharge voltage is different from the first precharge voltage.
6. The memory device of claim 1 , wherein the cell array further includes a fifth cell string connected to a fifth bit line adjacent to the second bit line.
7. The memory device of claim 6 , wherein the page buffer circuit is further configured to apply the erase voltage to the fifth bit line based on the first control signal during the erase operation.
8. The memory device of claim 6 , wherein the page buffer circuit is further configured to place the fifth bit line in the floating state based on the second control signal during the erase operation.
9. The memory device of claim 6 , wherein the page buffer circuit is further configured to:
apply a first precharge voltage to the second bit line before the erase operation, and
apply a second precharge voltage to the fourth bit line before the erase operation, the second precharge voltage being different from the first precharge voltage.
10. The memory device of claim 1 , wherein the first to fourth cell strings are connected to a common source line, and
the page buffer circuit is further configured to apply the erase voltage to the common source line during the erase operation.
11. The memory device of claim 1 , wherein the cell array has a multi-stack structure or a center bit line structure.
12. A memory device, comprising:
a peripheral circuit region including at least one first metal pad and a page buffer circuit; and
a memory cell region vertically connected to the peripheral circuit region, and including a cell array and at least one second metal pad directly connected to the at least one first metal pad, respectively,
wherein the cell array including a first to fourth cell strings respectively connected to a first to fourth bit lines, and
wherein the page buffer circuit configured to:
apply an erase voltage to the first and third bit lines based on a first control signal during an erase operation for memory cells of the first to fourth cell strings; and
place the second and fourth bit lines in a floating state based on a second control signal during the erase operation.
13. The memory device of claim 12 , wherein the page buffer circuit is further configured to:
apply a first precharge voltage to the second bit line before the erase operation, and
apply a second precharge voltage to the fourth bit line before the erase operation.
14. The memory device of claim 12 , wherein the page buffer circuit is connected to the at least one first metal pad, and
the first to fourth bit lines are connected to the at least one second metal pad via a first to fourth bit line contacts of the memory cell region.
15. The memory device of claim 14 , wherein a common source line included in the cell array is connected to the first to fourth cell strings and is connected to a common source line contact plug connected to the at least one second metal pad,
the page buffer circuit is further configured to apply the erase voltage to the common source line during the erase operation.
16. The memory device of claim 12 , wherein the cell array further includes a first and second memory structures stacked in a direction perpendicular to a substrate of the memory cell region, and
wherein the first and second memory structures include a plurality of memory cells corresponding to one of the first to fourth cell strings.
17. The memory device of claim 12 , wherein the cell array further includes a first and second memory structures stacked in a direction perpendicular to a substrate of the memory cell region,
wherein one of the first to fourth bit lines is provided between the first and second memory structures, the first memory structure is provided on the substrate of the memory cell region, and a common source line is provided on the second memory structure, and
wherein one of the first and second structures include a plurality of memory cells corresponding to cell string connected to the one of the first to fourth bit lines.
18. A method of operating a memory device including a controller that provides a first and second control signals to a page buffer circuit, and including a first to fourth cell strings respectively connected to a first to fourth bit lines, the method comprising:
receiving, by the controller, an erase command for an erase operation of memory cells included in the first to fourth cell string and providing the first and second control signals responsive to the erase command;
applying an erase voltage from the page buffer circuit during the erase operation to the first and third bit lines in response to the first control signal; and
placing, by the page buffer circuit, the second and fourth bit lines in a floating state during the erase operation in response to the second control signal.
19. The method of claim 18 , further comprising:
applying a first precharge voltage from the page buffer circuit to the second bit line, before applying the erase voltage from the page buffer circuit; and
applying a second precharge voltage from the page buffer circuit to the fourth bit line, before applying the erase voltage from the page buffer circuit.
20. The method of claim 19 , wherein the erase voltage is greater than the first precharge voltage and the erase voltage is greater than the second precharge voltage.