Electronic component and method for manufacturing the same
An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.
1. An electronic component comprising:
an electronic component main body including a body and an external electrode disposed on the body, the body including a dielectric layer and an internal electrode; and
a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on first portions of the coating layer,
wherein the coating layer includes second portions, arranged between adjacent first portions, which are devoid of the plurality of projections thereon.
2. The electronic component of claim 1 , wherein the coating portion has an average thickness of 5 to 30 nm.
3. The electronic component of claim 1 , wherein at least one of the plurality of projections has a height of 3 nm or more.
4. The electronic component of claim 1 , wherein centerline average roughness of a surface of the coating portion is 0.3 nm or more.
5. The electronic component of claim 1 , wherein a contact angle of the coating portion to water is 100 degrees or more.
6. The electronic component of claim 1 , wherein the coating portion includes at least one of a siloxane-based polymer or a fluorine-based polymer.
7. The electronic component of claim 1 , wherein the coating layer and the projection include the same material.
8. The electronic component of claim 1 , wherein the coating layer has one or more openings.
9. The electronic component of claim 8 , wherein an area of the one or more openings is greater than 0% and 10% or less of an overall area of the coating layer.
10. The electronic component of claim 1 , wherein the coating layer is in contact with an external surface of the external electrode and is in contact with a region of the external surface of the body on which the external electrode is not disposed.
11. The electronic component of claim 1 , wherein the external electrode includes an electrode layer, disposed on the body, and a plating layer disposed on the electrode layer.
12. The electronic component of claim 1 , wherein the plurality of projections extend outwardly from an external surface of the coating layer so as to have a thickness greater than a thickness of the coating layer.
13. A method for manufacturing an electronic component, the method comprising:
preparing an electronic component main body including a body and an external electrode disposed on the body, the body including a dielectric layer and an internal electrode; and
forming a coating portion, including a coating layer disposed on an external surface of the electronic component main body and a plurality of projections disposed on first portions of the coating layer, using vapor deposition,
wherein the coating layer includes second portions, arranged between adjacent first portions, which are devoid of the plurality of projections thereon.
14. The method of claim 13 , wherein the coating portion has an average thickness of 5 to 30 nm.
15. The method of claim 13 , wherein at least one of the plurality of projections has a height of 3 nm or more.
16. The method of claim 13 , wherein the external electrode includes an electrode layer, disposed on the body, and a plating layer disposed on the electrode layer.
17. The method of claim 13 , wherein the vapor deposition comprises an initiated chemical vapor deposition (iCVD).
18. An electronic component comprising:
an electronic component main body including a body and an external electrode disposed on the body, the body including a dielectric layer and an internal electrode; and
a plurality of projections comprising an organic material and disposed on an external surface of the electronic component main body,
wherein at least one of the plurality of projections is disposed on an outermost surface of the external electrode.
19. The electronic component of claim 18 , wherein the organic material includes a siloxane-based polymer or a fluorine-based polymer.
20. The electronic component of claim 18 , wherein at least one of the plurality of projections has a height of 3 nm or more.
21. The electronic component of claim 18 , wherein the organic material has an average thickness of 5 to 30 nm.