Semiconductor devices and related methods
In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
1. A semiconductor device, comprising:
a substrate comprising:
a first substrate side,
a second substrate side opposite the first substrate side,
a substrate outer sidewall between the first substrate side and the second substrate side, and
a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side;
a device stack in the cavity and comprising:
a first electronic device; and
a second electronic device stacked on the first electronic device;
a first internal interconnect coupled to the substrate and the device stack;
an encapsulant that covers the substrate inner sidewall and the device stack and fills the cavity; wherein a bottom side of the encapsulant in the cavity is exposed from the second substrate side, and the device stack is exposed from the exposed bottom side of the encapsulant; and
a stack cap comprising a non-electrically functional semiconductor material on a top side of the device stack, wherein the stack cap is exposed at a top side of the encapsulant.
2. The semiconductor device of claim 1 , wherein:
the substrate comprises a substrate shelf adjacent a first edge of the substrate;
the substrate shelf comprises an internal terminal at the first substrate side; and
the encapsulant covers the first substrate side but leaves the substrate shelf and the internal terminal exposed.
3. The semiconductor device of claim 2 , wherein:
the encapsulant comprises a recessed sidewall at an interface with the substrate shelf; and
the recessed sidewall is slanted at an acute angle with the first substrate side.
4. The semiconductor device of claim 1 , further comprising:
a vertical interconnect coupled to a first internal terminal on the first substrate side;
wherein the vertical interconnect extends through the encapsulant and is exposed at a top side of the encapsulant.
5. The semiconductor device of claim 1 , wherein:
at least one side of the device stack is unbounded by the substrate.
6. The semiconductor device of claim 1 ,
wherein:
the stack cap comprises a cap thermal expansion coefficient;
the device stack comprises a device thermal expansion coefficient;
the encapsulant comprises an encapsulant thermal expansion coefficient; and
the cap thermal expansion coefficient is closer to the device thermal expansion coefficient than to the encapsulant thermal expansion coefficient.
7. The semiconductor device of claim 6 , wherein:
the cap thermal expansion coefficient is substantially the same as the device thermal expansion coefficient.
8. The semiconductor device of claim 1 , comprising:
a first external interconnect; and
a second external interconnect;
wherein:
the substrate comprises a substrate first shelf adjacent a first edge of the substrate, and a first external terminal at the second substrate side under the first shelf;
the substrate comprises a substrate second shelf adjacent a second edge of the substrate, and a second external terminal at the second substrate side under the second shelf;
the encapsulant covers the first substrate side but leaves the substrate first shelf and the substrate second shelf exposed;
the first external interconnect is coupled to the first external terminal under the first shelf, outside a footprint of the encapsulant; and
the second external interconnect is coupled to the second external terminal under the second shelf, outside the footprint of the encapsulant.
9. A method, comprising:
receiving a substrate comprising:
a first substrate side,
a second substrate side opposite the first substrate side,
a substrate outer sidewall between the first substrate side and the second substrate side, and
a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side;
providing a device stack in the cavity and comprising:
a first electronic device; and
a second electronic device stacked on the first electronic device;
providing a first internal interconnect coupled to the substrate and the device stack;
providing an encapsulant that covers the substrate inner sidewall and the device stack and fills the cavity;
wherein a bottom side of the encapsulant in the cavity is exposed from the second substrate side, and the device stack is exposed from the exposed bottom side of the encapsulant; and
a stack cap comprising a non-electrically functional semiconductor material on a top side of the device stack, wherein the stack cap is exposed at a top side of the encapsulant.
10. The method of claim 9 , further comprising:
providing a vertical interconnect coupled to a first internal terminal on the first substrate side prior to providing the encapsulant;
wherein the vertical interconnect extends through the encapsulant and is exposed at a top side of the encapsulant.
11. The method of claim 9 , further comprising:
providing a stack cap on a top side of the device stack.
12. The method of claim 9 , wherein:
the substrate comprises a substrate first shelf adjacent a first edge of the substrate, and a first external terminal at the second substrate side under the first shelf;
the substrate comprises a substrate second shelf adjacent a second edge of the substrate, and a second external terminal at the second substrate side under the second shelf; and
the encapsulant covers the first substrate side but leaves the substrate first shelf and the substrate second shelf exposed;
the method further comprising:
providing a first external interconnect a coupled to the first external terminal under the first shelf, outside a footprint of the encapsulant; and
providing a second external interconnect coupled to the second external terminal under the second shelf, outside the footprint of the encapsulant.
13. A semiconductor device, comprising:
a base substrate having a first side and an internal base terminal on the first side;
a first module over the base substrate, the first module comprising:
a substrate comprising:
a first substrate side,
a second substrate side opposite the first substrate side,
a substrate outer sidewall between the first substrate side and the second substrate side, and
a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side;
a device stack in the cavity and comprising:
a first electronic device; and
a second electronic device stacked on the first electronic device;
a first internal interconnect coupled to the substrate and the device stack;
and
a first encapsulant that covers the substrate inner sidewall and the device stack and fills the cavity;
a second module over the first module;
a second encapsulant over the base substrate and contacting a lateral side of the first module and the second module; and
a module interconnect in the second encapsulant, coupled with the internal base terminal and the substrate of the first module, wherein:
the substrate of the first module comprises a substrate shelf adjacent a first edge of the substrate;
the substrate shelf comprises an internal terminal at the first substrate side;
the first encapsulant covers the first substrate side but leaves the substrate shelf and the internal terminal exposed; and
the module interconnect is coupled with the internal terminal.
14. The semiconductor device of claim 13 , wherein:
the first encapsulant comprises a recessed sidewall at an interface with the substrate shelf; and the recessed sidewall is slanted at an acute angle with the first substrate side.
15. The semiconductor device of claim 13 , wherein:
the first module comprises a stack cap on a top side of the device stack.
16. The semiconductor device of claim 13 , further comprising:
an external interconnect in the second encapsulant contacting a top side of the base substrate and a bottom side of the substrate of the first module.
17. A semiconductor device, comprising:
a base substrate having a first side and an internal base terminal on the first side;
a first module over the base substrate, the first module comprising:
a substrate comprising:
a first substrate side,
a second substrate side opposite the first substrate side,
a substrate outer sidewall between the first substrate side and the second substrate side, and
a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side;
a device stack in the cavity and comprising:
a first electronic device; and
a second electronic device stacked on the first electronic device;
a first internal interconnect coupled to the substrate and the device stack;
and
a first encapsulant that covers the substrate inner sidewall and the device stack and fills the cavity;
a second module over the first module;
a second encapsulant over the base substrate and contacting a lateral side of the first module and the second module; and
a module interconnect in the second encapsulant, coupled with the internal base terminal and the substrate of the first module, wherein:
the first module comprises a vertical interconnect coupled to a first internal terminal on the first substrate side;
the vertical interconnect extends through the first encapsulant and is exposed at a top side of the first encapsulant; and
the module interconnect is coupled with the substrate via the vertical interconnect.
18. The semiconductor device of claim 17 , wherein:
the first module comprises a stack cap on a top side of the device stack.
19. The semiconductor device of claim 17 , further comprising:
an external interconnect in the second encapsulant contacting a top side of the base substrate and a bottom side of the substrate of the first module.