Substrate having dual edge connection line and method for manufacturing the same, display panel, and display apparatus

1. A substrate, comprising:

a driving backplane, having a display area and at least one peripheral region located on a periphery of the display area, the driving backplane including:

a base substrate, including a first surface and a second surface opposite to the first surface; and

at least one first lead group disposed on the first surface of the base substrate, each first lead group including a plurality of first leads; and

at least one second lead group disposed on the second surface of the base substrate, a first lead group and a corresponding second lead group being disposed in a peripheral region; and each second lead group including a plurality of second leads;

a plurality of first connecting lines insulated from each other, the plurality of first connecting lines being disposed on at least one side face of the driving backplane adjacent to at least one peripheral region where the at least one first lead group and the at least one second lead group are disposed, each first connecting line being electrically connected to at least one first lead; and

a plurality of second connecting lines insulated from each other, the plurality of second connecting lines being disposed on the at least one side face of the driving backplane, and each second connecting line being electrically connected to at least one second lead, and being in contact with a corresponding first connecting line, wherein an interface between the first connecting line and the corresponding second connecting line is a region where an end face of the first connecting line and an end face of the corresponding second connecting line meet; and

the interface between the first connecting line and the corresponding second connecting line is substantially located at a position at half a thickness of the base substrate.

2. The substrate according to claim 1 , wherein the first connecting line extends to the first surface of the base substrate and is in lap joint with the at least one first lead; and the second connecting line extends to the second surface of the base substrate and is in lap joint with the at least one second lead.

3. The substrate according to claim 1 , further comprising a protective layer disposed on the at least one side face, the protective layer covering the plurality of first connecting lines and the plurality of second connecting lines.

4. The substrate according to claim 3 , wherein the protective layer includes a resin material.

5. The substrate according to claim 1 , wherein the plurality of first connecting lines and the plurality of second connecting lines are made of a same metal material or different metal materials.

6. The substrate according to claim 1 , further comprising a plurality of micro light-emitting diodes (Micro-LEDs) disposed on the first surface of the base substrate.

7. A display panel, comprising the substrate according to claim 1 .

8. A display apparatus, comprising at least one display panel according to claim 7 .

9. The display apparatus according to claim 8 , wherein the at least one display panel includes a plurality of display panels that are spliced together.

10. A method for manufacturing the substrate according to claim 1 , the method comprising:

forming at least one first strip-shaped groove corresponding to each driving backplane to be cut in a third surface of a driving backplane motherboard which includes at least one driving backplane to be cut, wherein the driving backplane to be cut has a display area and at least one peripheral region located on a periphery of the display area; and each first lead group and a corresponding second lead group of the driving backplane to be cut are disposed in one peripheral region; and each first strip-shaped groove is in contact with a corresponding peripheral region where a first lead group and a second lead group are disposed;

forming a plurality of first connecting lines insulated from each other in a region in which the first strip-shaped groove is located, wherein each first connecting line extends to a surface of at least one first lead and is in contact with the at least one first lead;

forming at least one second strip-shaped hole in a fourth surface of the driving backplane motherboard that is opposite to the third surface, each second strip-shaped hole being connected to a corresponding first strip-shaped groove;

forming a plurality of second connecting lines insulated from each other in a region in which the second strip-shaped hole is located, wherein each second connecting line is in contact with a corresponding first connecting line, and the second connecting line extends to a surface of at least one second lead and is in contact with the at least one second lead; and

cutting the driving backplane motherboard to obtain at least one driving backplane, and the plurality of first connecting lines and the plurality of second connecting lines that are formed on at least one side face of each driving backplane.

11. The method according to claim 10 , wherein each second strip-shaped hole and a corresponding first strip-shaped groove are both in contact with an edge of a corresponding peripheral region away from the display area and extend along the edge of the corresponding peripheral region.

12. The method according to claim 10 , wherein a base motherboard of the driving backplane motherboard is a glass motherboard;

forming the at least one first strip-shaped groove corresponding to each driving backplane to be cut in the third surface of the driving backplane motherboard includes:

forming the at least one first strip-shaped groove corresponding to each driving backplane to be cut in the third surface of the driving backplane motherboard by using a laser cutting method; and

forming the at least one second strip-shaped hole in the fourth surface of the driving backplane motherboard includes:

forming the at least one second strip-shaped hole in the fourth surface of the driving backplane motherboard by using the laser cutting method.

13. The method according to claim 10 , wherein a base motherboard of the driving backplane motherboard is a flexible resin motherboard;

forming the at least one first strip-shaped groove corresponding to each driving backplane to be cut in the third surface of the driving backplane motherboard includes:

forming the at least one first strip-shaped groove corresponding to each driving backplane to be cut in the third surface of the driving backplane motherboard by using an etching process; and

forming the at least one second strip-shaped hole in the fourth surface of the driving backplane motherboard includes:

forming the at least one second strip-shaped hole in the fourth surface of the driving backplane motherboard by using the etching process.

14. The method according to claim 10 , wherein forming the at least one first strip-shaped groove corresponding to each driving backplane to be cut includes:

forming a single first strip-shaped groove corresponding to the driving backplane to be cut, or

forming two first strip-shaped grooves parallel to each other and located at two opposite edges of the driving backplane to be cut, respectively.

15. The method according to claim 10 , wherein

forming the plurality of first connecting lines insulated from each other includes:

forming a first metal layer on the third surface of the driving backplane motherboard by using a sputtering process, the first metal layer including a portion filling the first strip-shaped groove;

forming a first photoresist layer on the first metal layer;

exposing and developing the first photoresist layer; and

etching the first metal layer to form the plurality of first connecting lines insulated from each other in the region in which the first strip-shaped groove is located;

and/or

forming the plurality of second connecting lines insulated from each other includes:

forming a second metal layer on the fourth surface of the driving backplane motherboard by using the sputtering process, the second metal layer including a portion filling the second strip-shaped hole;

forming a second photoresist layer on the second metal layer;

exposing and developing the second photoresist layer; and

etching the second metal layer to form the plurality of second connecting lines insulated from each other in the region in which the second strip-shaped hole is located.

16. The method according to claim 10 , wherein

forming the plurality of first connecting lines insulated from each other includes:

forming the plurality of first connecting lines insulated from each other through an evaporation process by using a first mask;

and/or

forming the plurality of second connecting lines insulated from each other includes:

forming the plurality of second connecting lines insulated from each other through the evaporation process by using a second mask.

17. The method according to claim 10 , after the plurality of first connecting lines are formed, the method further comprises:

turning the driving backplane motherboard 180 degrees;

placing the turned driving backplane motherboard on a temporary substrate; and

bonding the third surface of the driving backplane motherboard to the temporary substrate by a temporary bonding adhesive; and

after the plurality of second connecting lines are formed, the method further comprises:

separating the temporary substrate from the driving backplane motherboard.

18. The method according to claim 10 , wherein cutting the driving backplane motherboard includes:

cutting the driving backplane motherboard by using a laser cutting method.