Heat dissipation sheet, heat dissipation member, and semiconductor device
A heat dissipation sheet 10 includes cohesive inorganic filler particles 1 having a breaking strength of 20 MPa or lower and a modulus of elasticity of 48 MPa or higher and a matrix resin 2 . Half or more of the cohesive inorganic filler particles 1 in the heat dissipation sheet 10 satisfy the following conditions A and B, and the cohesive inorganic filler particles satisfying the following conditions A and B satisfy the following condition C or D Condition A: cohesive inorganic filler particles are in surface contact with each other Condition B: an aspect ratio is within a range of a number larger than 1 and less than or equal to 2 Condition C: in triangles formed to have one side which is a straight line constituted by a contact interface between cohesive inorganic filler particles and an apex which is a center of a virtual circle of the cohesive inorganic filler, a sum S t of areas of triangles in which an angle θ 1 formed by connecting both ends of the straight line to the apex becomes 30 degrees or larger is 20% or more with respect to a sum S h of cross-sectional areas of the cohesive inorganic filler particles Condition D: the sum S h is 90% or less with respect to a sum S v of areas of virtual circles of the cohesive inorganic filler particles.
1. A heat dissipation sheet, comprising:
cohesive inorganic filler particles; and
a resin,
wherein a breaking strength of the cohesive inorganic filler particles is 20 MPa or lower, and a modulus of elasticity of the cohesive inorganic filler particles is 48 MPa or higher, and
wherein half or more of the cohesive inorganic filler particles included in the heat dissipation sheet satisfy the following conditions A and B, and the cohesive inorganic filler particles satisfying the following conditions A and B satisfy the following condition C
Condition A: cohesive inorganic filler particles are in surface contact with each other
Condition B: an aspect ratio expressed by a ratio of a major diameter to a minor diameter (major diameter/minor diameter) is within a range of a number larger than 1 and less than or equal to 2
Condition C: in an observation of a cross section of the heat dissipation sheet in a thickness direction, in triangles formed to have one side which is a straight line constituted by a contact interface between cohesive inorganic filler particles and an apex which is a center of a virtual circle having a largest diameter of the cohesive inorganic filler particle as a diameter, a sum S t of areas of triangles in which an angle θ 1 formed by connecting both ends of the straight line to the apex becomes 30 degrees or larger is 20% or more with respect to a sum S h of cross-sectional areas of the cohesive inorganic filler particles.
2. A heat dissipation sheet, comprising:
cohesive inorganic filler particles;
and a resin,
wherein a breaking strength of the cohesive inorganic filler particles is 20 MPa or lower, and a modulus of elasticity of the cohesive inorganic filler particles is 48 MPa or higher, and
wherein half or more of the cohesive inorganic filler particles included in the heat dissipation sheet satisfy the following conditions A and B, and the cohesive inorganic filler particles satisfying the following conditions A and B satisfy the following condition D
Condition A: cohesive inorganic filler particles are in surface contact with each other
Condition B: an aspect ratio expressed by a ratio of a major diameter to a minor diameter (major diameter/minor diameter) is within a range of a number larger than 1 and less than or equal to 2
Condition D: in an observation of a cross section of the heat dissipation sheet in a thickness direction, a sum S h of cross-sectional areas of the cohesive inorganic filler particles is 90% or less with respect to a sum S v of areas of virtual circles having a largest diameter of the cohesive inorganic filler particle as a diameter.
3. The heat dissipation sheet according to claim 1 or 2 ,
wherein the cohesive inorganic filler particles are boron nitride cohesive particles having a house-of-cards structure.
4. A heat dissipation member, comprising:
a heat dissipation sheet which includes cohesive inorganic filler particles and a resin; and
a metal substrate to which the heat dissipation sheet adheres,
wherein a breaking strength of the cohesive inorganic filler particles is 20 MPa or lower, and a modulus of elasticity of the cohesive inorganic filler particles is 48 MPa or higher, and
wherein a proportion of the number of cohesive inorganic filler particles, of the cohesive inorganic filler particles which are included in the heat dissipation sheet and are present at an interface between the heat dissipation sheet and the metal substrate, satisfying the following conditions E and F is 60% or more with respect to a total number of the cohesive inorganic filler particles present at the interface between the heat dissipation sheet and the metal substrate
Condition E: an aspect ratio expressed by a ratio of a major diameter to a minor diameter (major diameter/minor diameter) is within a range of a number larger than 1 and less than or equal to 2
Condition F: in an observation of a cross section of the heat dissipation sheet in a thickness direction, in triangles formed to have one side which is a straight line constituted by a contact interface between the metal substrate and a cohesive inorganic filler particle and an apex which is a center of a virtual circle having a largest diameter of the cohesive inorganic filler particle as a diameter, an angle θ 2 formed by connecting both ends of the straight line to the apex becomes 30 degrees or larger.
5. The heat dissipation member according to claim 4 ,
wherein the cohesive inorganic filler particles are boron nitride cohesive particles having a house-of-cards structure.
6. A semiconductor device, comprising:
the heat dissipation sheet according to any one of claims 1 to 3 ; or
the heat dissipation member according to claim 4 or 5 .