Thermal test head for an integrated circuit device

1. A thermal test head for an integrated circuit device including a die mounted on a substrate, the thermal test head comprising:

a heat exchanger assembly configured to circulate a fluid therethrough, the heat exchanger assembly including

a manifold defining a cavity,

a cold plate including micro-fins on a first surface of the cold plate, and

a channel body defining fluid-flow channels, wherein the micro-fins and the channel body are disposed in the cavity of the manifold;

a die-contact member configured to contact the die; and

a thermal control assembly disposed between the heat exchanger assembly and the die-contact member, the thermal control assembly including

a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the die-contact member, and

a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the die-contact member.

2. The thermal test head of claim 1 , wherein the spacer is disposed at least partially around the Peltier device.

3. The thermal test head of claim 1 , wherein the cold plate includes thermally conductive metal, the manifold includes plastic material, and the channel body includes one of metal or plastic material.

4. The thermal test head of claim 1 , wherein the spacer has an annular shape defining a central opening, and wherein the Peltier device is disposed in the central opening of the spacer.

5. The thermal test head of claim 1 , further including

a first layer of thermal interface material disposed between the Peltier device and the die-contact member, and

a second layer of thermal interface material disposed between the Peltier device and the heat exchanger assembly,

wherein a height of the spacer is substantially equal to a sum of a height of the Peltier device, a height of the first layer of thermal interface material, and a height of the second layer of thermal interface material.

6. The thermal test head of claim 1 , further including an inclination-adjustment device coupled to a first surface of the heat exchanger assembly and disposed opposite the thermal control assembly, wherein the inclination-adjustment device includes

an alignment plate coupled to the first surface of the heat exchanger assembly,

a lock plate disposed above the alignment plate and configured to move towards and away from the alignment plate, and

multiple springs disposed between the lock plate and the alignment plate,

wherein the multiple springs bias the lock plate away from the alignment plate.

7. The thermal test head of claim 6 , wherein the alignment plate includes a substantially convex shaped projection extending towards the lock plate, and wherein the multiple springs of the inclination-adjustment device are disposed around the projection.

8. The thermal test head of claim 6 , wherein the inclination-adjustment device is configured to vary an angular alignment of a contact surface of the die-contact member, wherein the contact surface is configured to contact the die.

9. A thermal test head for an integrated circuit device including a die mounted on a substrate, the thermal test head comprising:

a heat exchanger assembly configured to circulate a fluid therethrough;

a die-contact member including a contact surface, the contact surface being configured to contact the die; and

a thermal control assembly disposed between the heat exchanger assembly and the die-contact member, the thermal control assembly including

a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the die-contact member, and

one or more spacers disposed at least partially around the Peltier device, the one or more spacers being in physical contact with the opposing surfaces of the heat exchanger assembly and the die-contact member; and

an inclination-adjustment device coupled to the heat exchanger assembly opposite the thermal control assembly, wherein the inclination-adjustment device is configured to change an angular alignment of the contact surface of the die-contact member when the contact surface contacts the die.

10. The thermal test head of claim 9 , further including

a first layer of thermal interface material disposed between the Peltier device and the die-contact member, and

a second layer of thermal interface material disposed between the Peltier device and the heat exchanger assembly,

wherein a height of the one or more spacers is substantially equal to a sum of a height of the Peltier device, a height of the first layer of thermal interface material, and a height of the second layer of thermal interface material.

11. The thermal test head of claim 9 , wherein the one or more spacers include plastic or ceramic material.

12. The thermal test head of claim 9 , wherein the inclination-adjustment device includes

an alignment plate coupled to a surface of the heat exchanger assembly,

a lock plate positioned above the alignment plate and configured to move towards and away from the alignment plate, and

multiple springs disposed between the lock plate and the alignment plate, wherein the multiple springs bias the lock plate away from the alignment plate.

13. The thermal test head of claim 12 , wherein

a first surface of the alignment plate that faces the lock plate includes a substantially convex shaped projection extending towards the lock plate, and

a second surface of the alignment plate opposite the first surface is directly attached to the surface of the heat exchanger assembly.

14. The thermal test head of claim 9 , wherein the heat exchanger assembly includes

a manifold defining a cavity,

a cold plate including micro-fins, and

a channel body defining fluid-flow channels,

the micro-fins and the channel body being disposed in the cavity of the manifold.

15. A thermal test head for an integrated circuit device including a die mounted on a substrate, the thermal test head comprising:

a heat exchanger assembly configured to circulate a fluid therethrough;

a thermally conductive die-contact member including a contact surface, the contact surface being configured to contact the die; and

a thermal control assembly disposed between a first surface of the die-contact member and a second surface of the heat exchanger assembly, wherein the thermal control assembly includes:

a Peltier device,

a first layer of thermal interface material disposed between, and in physical contact with, the Peltier device and the first surface of the die-contact member,

a second layer of thermal interface material disposed between, and in physical contact with, the Peltier device and the second surface of the heat exchanger assembly, and

one or more spacers disposed at least partially around the Peltier device and in physical contact with the first surface of the die-contact member and the second surface of the heat exchanger assembly, wherein a height of the one or more spacers is substantially equal to a sum of a height of the Peltier device, a height of the first layer of thermal interface material, and a height of the second layer of thermal interface material.

16. The thermal test head of claim 15 , further including an inclination-adjustment device coupled to a third surface of the heat exchanger assembly opposite the second surface, wherein the inclination-adjustment device is configured to change an angular alignment of the contact surface of the die-contact member when the contact surface contacts the die.

17. The thermal test head of claim 16 , wherein the inclination-adjustment device includes

an alignment plate coupled to the third surface of the heat exchanger assembly,

a lock plate disposed above the alignment plate and configured to move towards and away from the alignment plate, and

multiple springs disposed between the lock plate and the alignment plate, wherein the multiple springs bias the lock plate away from the alignment plate.

18. The thermal test head of claim 16 , wherein

a surface of the alignment plate that faces the lock plate includes a substantially convex shaped projection extending towards the lock plate, and

the multiple springs are disposed around the projection.