Radio-frequency module and communication apparatus
A radio-frequency module including a mounting substrate that has mounting faces opposed to each other; a PA that is mounted on the mounting face, that is a radio-frequency component, and that has an emitter terminal; a through electrode that is connected to the emitter terminal of the PA and that passes through the mounting faces of the mounting substrate; and a ground terminal connected to the through electrode.
1. A radio-frequency module comprising:
a mounting substrate having a first face and a second face, which is opposed to the first face;
a transmission power amplifier mounted on the first face, the transmission power amplifier including an emitter terminal;
an electrode connected to the emitter terminal of the transmission power amplifier, wherein the electrode passes through the mounting substrate between the first face and the second face;
a ground terminal connected to the electrode;
a low noise reception amplifier mounted on the second face;
a transmission filter mounted on the first face; and
a reception filter mounted on the first face, wherein
in a plan view of the radio-frequency module in a direction vertical to the first face and the second face, the transmission filter is arranged between the transmission power amplifier and the reception filter.
2. The radio-frequency module of claim 1 , wherein
the radio-frequency module is connected to an external substrate, and
the ground terminal is connected to the external substrate.
3. The radio-frequency module of claim 1 , further comprising:
first resin formed on the first face that covers at least part of the transmission power amplifier.
4. The radio-frequency module of claim 3 , further comprising:
second resin formed on the second face that covers at least part of the low noise reception amplifier.
5. The radio-frequency module of claim 4 , wherein
the ground terminal is arranged on the second resin.
6. The radio-frequency module of claim 5 , further comprising:
a ground electrode layer formed of a planar wiring pattern in the mounting substrate; and
a first shield electrode layer formed to cover a top face and side faces of the first resin and connected to the ground electrode layer at side faces of the mounting substrate.
7. The radio-frequency module of claim 5 , further comprising:
a second shield electrode layer formed on side faces of the second resin and connected to the ground electrode layer at the side faces of the mounting substrate.
8. The radio-frequency module of claim 1 , wherein
in a plan view of the radio-frequency module in a direction vertical to the first face and the second face, a footprint of the electrode at least partially overlaps with a footprint of the ground terminal.
9. The radio-frequency module of claim 1 , wherein
in a plan view of the radio-frequency module in a direction vertical to the first face and the second face, a footprint of the transmission power amplifier does not overlap with a footprint of the low noise reception amplifier.
10. The radio-frequency module of claim 1 ,
wherein
in a plan view of the radio-frequency module in a direction vertical to the first face and the second face, a footprint of the low noise reception amplifier at least partially overlaps with a footprint of the reception filter.
11. The radio-frequency module of claim 1 , wherein
in a plan view of the radio-frequency module in a direction vertical to the first face and the second face, a footprint of the low noise reception amplifier mounted on the second face at least partially overlaps with a footprint of the reception filter.
12. A radio-frequency module comprising:
a mounting substrate including a first face and a second face, which opposes the first face;
a transmission power amplifier arranged on the first face;
an electrode connected to the transmission power amplifier and that passes through the mounting substrate between the first face and the second face; and
an external connection terminal arranged on the second face and connected to the electrode;
a low noise reception amplifier mounted on the second face;
a transmission filter mounted on the first face; and
a reception filter mounted on the first face, wherein
in a plan view of the radio-frequency module in a direction vertical to the first face and the second face, the transmission filter is arranged between the transmission power amplifier and the reception filter.
13. The radio-frequency module of claim 12 , wherein
the radio-frequency module is connected to an external substrate, and
the external connection terminal is connected to the external substrate.
14. The radio-frequency module of claim 12 , wherein
in a plan view of the radio-frequency module in a direction vertical to the first face and the second face, a footprint of the electrode at least partially overlaps with a footprint of the external connection terminal.
15. A communication apparatus comprising:
an external substrate; and
a radio-frequency module comprising
a mounting substrate having a first face and a second face, which is opposed to the first face;
a transmission power amplifier mounted on the first face, the transmission power amplifier including an emitter terminal;
an electrode connected to the emitter terminal of the transmission power amplifier, wherein the electrode passes through the mounting substrate between the first face and the second face; and
a ground terminal connected to the electrode;
a low noise reception amplifier mounted on the second face;
a transmission filter mounted on the first face; and
a reception filter mounted on the first face, wherein
in a plan view of the radio-frequency module in a direction vertical to the first face and the second face, the transmission filter is arranged between the transmission power amplifier and the reception filter.
16. The communication apparatus of claim 15 , wherein
in a plan view of the communication apparatus from a direction vertical to the first face and the second face, a footprint of the external ground electrode at least partially overlaps with a footprint of the electrode.
17. The communication apparatus of claim 15 , wherein
the radio-frequency module is connected to an external substrate, and
the ground terminal is connected to the external substrate.
18. The communication apparatus of claim 15 , wherein
the radio-frequency module comprises a first resin formed on the first face that covers at least part of the transmission power amplifier.