Socket side thermal system

1. An integrated circuit device testing system comprising:

a socket configured to receive an integrated circuit device, the socket comprising:

a plurality of electrical contacts configured to contact electrical contacts of an integrated circuit device, and

a base member comprising a plurality of base member openings, each of the base member openings configured to facilitate electrical contact between one of the electrical contacts and one of the electrical contacts of the integrated circuit device; and

a thermal unit configured to heat and/or cool the integrated circuit device on a first, socket side of the integrated circuit device via the electrical contacts of the socket when the integrated circuit device is engaged with the socket.

2. The integrated circuit device testing system of claim 1 , further comprising:

a second thermal unit disposed adjacent to a second side of the integrated circuit device opposite the socket side while the integrated circuit device is engaged with the socket and further configured to heat and/or cool the integrated circuit device on the second side.

3. The integrated circuit device testing system of claim 1 , wherein the thermal unit is a heat sink.

4. The integrated circuit device testing system of claim 1 , further comprising a controller or active circuit;

wherein the socket comprises at least one conductive trace; and

wherein the controller is configured to determine a temperature at a surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.

5. The integrated circuit device testing system of claim 4 , wherein the socket is configured such that, when the integrated circuit device is engaged with the socket, the at least one conductive trace extends along the surface of the integrated circuit device.

6. The integrated circuit device testing system of claim 4 , wherein:

the socket comprises a flexible circuit board having a plurality of openings; and

the openings facilitate contact between the electrical contacts of the socket and the electrical contacts of the integrated circuit device.

7. The integrated circuit device testing system of claim 4 , wherein the at least one conductive trace extends along a path between a plurality of the openings.

8. The integrated circuit device testing system of claim 4 , wherein:

the base member comprises the electrical contacts;

the socket comprises a floating plate supported by the base member via at least one spring, the floating plate comprising a plurality of floating plate openings configured to allow the electrical contacts of the integrated circuit device to electrically engage with the electrical contacts of the socket through the floating plate openings; and

the at least one conductive trace is located in the floating plate.

9. An integrated circuit device testing system comprising:

a socket configured to receive an integrated circuit device, the socket comprising a plurality of electrical contacts configured to contact electrical contacts of the integrated circuit device;

a thermally conductive substrate including thin film circuitry electrically connected to the electrical contacts of the socket;

a load board electrically connected to the thermally conductive substrate via load board electrical contacts and configured to electrically connect the electrical contacts of the socket to a controller or active circuit; and

a thermal unit configured to heat and/or cool the integrated circuit device on a first, socket side of the integrated circuit device while the integrated circuit device is engaged with the socket, via the thermally conductive substrate;

wherein the load board is on a second side of the integrated circuit device while the integrated circuit device is engaged with the socket, via the thermally conductive substrate, the second side opposite the first, socket side.

10. The integrated circuit device testing system of claim 9 , further comprising:

a second thermal unit disposed adjacent to the second side of the integrated circuit device opposite the socket side while the integrated circuit device is engaged with the socket and further configured to heat and/or cool the integrated circuit device on the second side of the integrated circuit device.

11. The integrated circuit device testing system of claim 9 , wherein the thermal unit is a heat sink.

12. The integrated circuit device testing system of claim 9 , wherein:

the socket comprises at least one conductive trace; and

the controller is configured to determine a temperature at a surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.

13. The integrated circuit device testing system of claim 12 , wherein the socket is configured such that, when the integrated circuit device is engaged with the socket, the at least one conductive trace extends along the surface of the integrated circuit device.

14. The integrated circuit device testing system of claim 12 , wherein:

the socket comprises a flexible circuit board having a plurality of openings; and

the openings facilitate contact between the electrical contacts of the socket and the electrical contacts of the integrated circuit device.

15. The integrated circuit device testing system of claim 12 , wherein the at least one conductive trace extends along a path between a plurality of the openings.

16. The integrated circuit device testing system of claim 12 , wherein:

the socket comprises:

a base member comprising the plurality of electrical contacts of the socket, and

a floating plate supported by the base member via at least one spring, the floating plate comprising a plurality of floating plate openings configured to allow the electrical contacts of the integrated circuit device to electrically engage with the electrical contacts of the socket through the floating plate openings; and

the at least one conductive trace is located in the floating plate.

17. An integrated circuit device testing system comprising:

a socket configured to receive an integrated circuit device, the socket comprising a plurality of electrical contacts configured to contact electrical contacts of an integrated circuit device;

a thermal unit configured to heat and/or cool the integrated circuit device on a first, socket side of the integrated circuit device via the electrical contacts of the socket when the integrated circuit device is engaged with the socket; and

a controller or active circuit;

wherein the socket comprises at least one conductive trace;

wherein the controller is configured to determine a temperature at a surface of the integrated circuit device based on a measured resistance of the at least one conductive trace;

wherein the socket comprises: a base member comprising the plurality of electrical contacts of the socket, and a floating plate supported by the base member via at least one spring, the floating plate comprising a plurality of floating plate openings configured to allow the electrical contacts of the integrated circuit device to electrically engage with the electrical contacts of the socket through the floating plate openings; and

wherein the at least one conductive trace is located in the floating plate.