Electronic device and method of manufacturing electronic device
The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting dies, a transparent material layer, a sealing material, and a second substrate. The plurality of light-emitting dies are disposed on the first substrate. The transparent material layer is disposed on the first substrate. The sealing material is disposed on the first substrate and surrounds the transparent material layer. The second substrate is adhered to the first substrate through the transparent material layer and the sealing material.
1. An electronic device comprising
a first substrate;
a plurality of light-emitting dies disposed on the first substrate;
a filler layer at least disposed between the plurality of light-emitting dies;
a transparent material layer disposed on the first substrate;
a sealing material disposed on the first substrate and surrounding the transparent material layer; and
a second substrate adhered to the first substrate through the transparent material layer and the sealing material,
wherein the sealing material is in contact with a surface of the filler layer away from the first substrate.
2. The electronic device according to claim 1 , wherein the transparent material layer is in contact with the sealing material.
3. The electronic device according to claim 2 , further comprising a display region and a non-display region surrounding the display region, wherein an interface between the transparent material layer and the sealing material is located in the non-display region.
4. The electronic device according to claim 2 , further comprising a display region and a non-display region surrounding the display region, wherein an interface between the transparent material layer and the sealing material is located in the display region.
5. The electronic device according to claim 1 , wherein a thickness of the transparent material layer is greater than or equal to 2 μm and less than or equal to 20 μm.
6. The electronic device according to claim 1 , wherein the transparent material is a waterproofing material.
7. The electronic device according to claim 1 , wherein the sealing material is disposed on at least one of the plurality of light-emitting dies.
8. The electronic device according to claim 1 , wherein a hardness of the transparent material layer is different from a hardness of the sealing material.
9. The electronic device according to claim 1 , wherein the first substrate comprises a first substrate body and a component layer, the component layer is disposed on the first substrate body, and the plurality of light-emitting dies are disposed on the component layer and electrically connected to the component layer.
10. The electronic device according to claim 1 , wherein a material of the filler layer includes an epoxy resin material, an acrylic material or a combination thereof.
11. The electronic device according to claim 1 , wherein the transparent material layer is disposed on the filler layer and the plurality of light-emitting dies.
12. The electronic device according to claim 1 , wherein the sealing material does not overlap the plurality of light-emitting dies.
13. The electronic device according to claim 1 , wherein a thickness of the sealing material is greater than or equal to 2 μm and less than or equal to 20 μm.
14. The electronic device according to claim 1 , wherein a width of the sealing material is greater than or equal to a width of a color filter structure of the electronic device.
15. The electronic device according to claim 1 , wherein the first substrate comprises a first substrate body and a component layer disposing on the first substrate body, and the sealing material and the transparent material layer is in contact with the component layer.
16. A method of manufacturing an electronic device, comprising:
providing a first substrate and a second substrate, wherein a plurality of light-emitting dies are disposed on the first substrate;
disposing a filler layer at least between the plurality of light-emitting dies,
disposing a transparent material layer and a sealing material on the first substrate or the second substrate, wherein the sealing material surrounds the transparent material layer; and
assembling the first substrate and the second substrate,
wherein the sealing material is in contact with a surface of the filler layer away from the first substrate.
17. The method of manufacturing an electronic device according to claim 16 , wherein after the step of assembling the first substrate and the second substrate, the method further comprises curing the sealing material.
18. The method of manufacturing an electronic device according to claim 16 , further comprising curing the transparent material layer.