IP Library Granted Patent US 11,424,100
Granted Patent B2
US 11,424,100 · App. 17/027,312 · Granted Aug 23, 2022

Charged particle beam irradiation apparatus and control method

Inventors: Takuma Aso (Tokyo, JP); Xin Man (Tokyo, JP); Makoto Sato (Tokyo, JP); Tatsuya Asahata (Tokyo, JP)
Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
H01J37/265G01N23/2206G01N23/2251G01N23/2258H01J37/244H01J37/28G01N2223/072G01N2223/0816G01N2223/40G01N2223/507
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Quick Facts
Patent No.
US 11,424,100
App. No.
17/027,312
Granted
Aug 23, 2022
Kind
B2
Abstract

The charged particle beam irradiation apparatus includes: a focused ion beam column; an electron beam column; an electron detector; an image forming unit configured to form an observation image based on a signal output from the electron detector; and a control unit configured to repeatedly perform exposure control in which the focused ion beam column is controlled to expose a cross section of a multilayered sample toward a stacking direction with the focused ion beam, the control unit being configured to perform, every time exposure of an observation target layer at a cross section of the multilayered sample is detected in a process of repeatedly performing the exposure control, observation control in which the electron beam column is controlled to radiate the electron beam, and the image forming unit is controlled to form an observation image of the cross section of the multilayered sample.

Claims (55)

1. A charged particle beam irradiation apparatus, comprising:

a focused ion beam column configured to irradiate, with a focused ion beam, a multilayered sample in which a plurality of layers having one of different substances and different structures from one another are stacked in a predetermined stacking direction as observation target layers to be observed;

an electron beam column configured to irradiate the multilayered sample with an electron beam;

an electron detector configured to detect one of secondary electrons and reflection electrons generated from the multilayered sample;

and

a control unit configured to repeatedly perform exposure control in which the focused ion beam column is controlled to expose a cross section of the multilayered sample toward the predetermined stacking direction with the focused ion beam,

the control unit being configured to perform, every time exposure of one of the observation target layers at a cross section of the multilayered sample is detected in a process of repeatedly performing the exposure control, observation control in which the electron beam column is controlled to radiate the electron beam, and observation image of the cross section of the multilayered sample is formed.

2. The charged particle beam irradiation apparatus according to claim 1 , further comprising a storage unit having stored therein design data of the multilayered sample,

wherein the control unit is configured to:

determine, based on the design data stored in the storage unit, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

perform the observation control when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

3. The charged particle beam irradiation apparatus according to claim 2 , wherein the control unit is configured to:

determine, based on the design data stored in the storage unit, and on a received error range, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

repeat sequentially performing the exposure control and the observation control a predetermined number of times when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

4. The charged particle beam irradiation apparatus according to claim 3 , wherein the control unit is configured to set a first working pitch in the exposure control that is repeated the predetermined number of times to be smaller than a second working pitch in the exposure control that is different from the exposure control that is repeated the predetermined number of times.

5. The charged particle beam irradiation apparatus according to claim 2 , wherein the control unit is configured to:

control the focused ion beam column to radiate the focused ion beam;

determine, based on a progress observation image which indicates progress of working the multilayered sample with the focused ion beam and is formed every time the exposure control is performed in the process, and on the design data stored in the storage unit, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

perform the observation control when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

6. The charged particle beam irradiation apparatus according to claim 1 , wherein the control unit is configured to:

control the focused ion beam column and the electron beam column to perform the exposure control and the observation control in parallel with each other;

determine, based on the observation image of a cross section of the multilayered sample, which is formed every time the observation control is performed in parallel with the exposure control, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

perform the observation control when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

7. The charged particle beam irradiation apparatus according to claim 6 , wherein the control unit is configured to:

determine, based on the observation image of the cross section of the multilayered sample, which is formed every time the observation control is performed in parallel with the exposure control, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

perform the observation control when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

8. The charged particle beam irradiation apparatus according to claim 6 , wherein the control unit is configured to:

determine, based on the observation image of the cross section of the multilayered sample, which is formed every time the observation control is performed in parallel with the exposure control, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

perform the observation control when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

9. A control method for a charged particle beam irradiation apparatus, the control method comprising:

repeatedly performing exposure control in which a focused ion beam column is controlled to expose a cross section of a multilayered sample in which a plurality of layers having one of different substances and different structures from one another are stacked in a predetermined stacking direction as observation target layers to be observed, toward the predetermined stacking direction with a focused ion beam; and

performing, every time exposure of one of the observation target layers at a cross section of the multilayered sample is detected in a process of repeatedly performing the exposure control, observation control in which an electron beam column is controlled to radiate an electron beam, and an observation image of the cross section of the multilayered sample is formed based on a signal output from an electron detector configured to detect one of secondary electrons and reflection electrons generated from the multilayered sample.

10. The control method according to claim 9 ,

wherein the charged particle beam irradiation apparatus further includes a storage unit having stored therein design data of the multilayered sample, and

wherein the control method further comprises:

determining, based on the design data stored in the storage unit, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

performing the observation control when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

11. The control method according to claim 10 , further comprising:

determining, based on the design data stored in the storage unit, and on a received error range, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

repeating sequentially performing the exposure control and the observation control a predetermined number of times when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

12. The control method according to claim 11 , further comprising setting a first working pitch in the exposure control that is repeated the predetermined number of times to be smaller than a second working pitch in the exposure control that is different from the exposure control that is repeated the predetermined number of times.

13. The control method according to claim 10 , further comprising:

controlling the focused ion beam column to radiate the focused ion beam;

determining, based on a progress observation image which indicates progress of working the multilayered sample with the focused ion beam and is formed every time the exposure control is performed in the process, and on the design data stored in the storage unit, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

performing the observation control when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

14. The control method according to claim 9 , further comprising:

controlling the focused ion beam column and the electron beam column to perform the exposure control and the observation control in parallel with each other;

determining, based on the observation image of a cross section of the multilayered sample, which is formed every time the observation control is performed in parallel with the exposure control, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

performing the observation control when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

15. The control method according to claim 14 , further comprising:

determining, based on the observation image of the cross section of the multilayered sample, which is formed every time the observation control is performed in parallel with the exposure control, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

performing the observation control when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

16. The control method according to claim 14 , further comprising:

determining, based on the observation image of the cross section of the multilayered sample, which is formed every time the observation control is performed in parallel with the exposure control, whether exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process; and

performing the observation control when determining that exposure of one of the observation target layers at a cross section of the multilayered sample is detected in the process.

Assignments (3)
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072903/0593 →
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072913/0104 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2022
From: ASO, TAKUMA; MAN, XIN; SATO, MAKOTO; ASAHATA, TATSUYA
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 060479/0503 →
Priority Claims (1)
JP JP2019-173369 · Sep 24, 2019 · national
Continuity (1)
Related Publication 20210090855A1 · Mar 25, 2021