Thermal-control system for a security camera and associated security camera
This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.
1. A thermal-control system for a security camera, the thermal-control system comprising:
a first thermal-control subsystem, the first thermal-control subsystem configured to transfer a first quantity of heat to a housing, the first thermal-control subsystem including:
a first thermal interface material, the first thermal interface material located between a system-on-chip integrated circuit device and a first heat sink, the system-on-chip integrated circuit device mounted to a first surface of a first printed circuit board;
a second thermal interface material, the second thermal interface material located between a memory integrated circuit device and the first heat sink, the memory integrated circuit device mounted to the first surface of the first printed circuit board; and
a third thermal interface material, the third thermal interface material located between a second surface of the first printed circuit board and a second heat sink, the second surface of the first printed circuit board opposite the first surface of the first printed circuit board; and
a second thermal-control subsystem, the second thermal-control subsystem configured to transfer a second quantity of heat to the housing, the second thermal-control subsystem including:
a fourth thermal interface material, the fourth thermal interface material located between a second surface of a second printed circuit board and a heat spreader, the second surface of the second printed circuit board opposite a first surface of the second printed circuit board to which a passive infrared sensor integrated circuit device and an image sensor integrated circuit device are mounted.
2. The thermal-control system of claim 1 , wherein the first heat sink has a generally cylindrical shape, the second heat sink has a generally concave shape, and the heat spreader has a generally rectangular outline.
3. The thermal-control system of claim 1 , wherein the first thermal interface material includes a silicone-rubber material injected with nanoparticles.
4. The thermal-control system of claim 1 , wherein the first heat sink is a die-cast heatsink that includes an aluminum material.
5. The thermal-control system of claim 1 , wherein the first heat sink includes a cavity that supports a battery.
6. The thermal-control system of claim 5 , wherein an exterior surface of the first heat sink is in direct physical and thermal contact with an interior surface of the housing.
7. The thermal-control system of claim 1 , further comprising a thermal foam material located between the first heat sink and a battery.
8. The thermal-control system of claim 1 , wherein the third thermal interface material includes a thermal pad material.
9. The thermal-control system of claim 8 , wherein the thermal pad material includes a paraffin wax-based material.
10. The thermal-control system of claim 8 , wherein the thermal pad material includes a silicone material.
11. The thermal-control system of claim 1 , wherein the second heat sink is a stamped heat sink that includes an aluminum-alloy material.
12. The thermal-control system of claim 1 , wherein the fourth thermal interface material includes a gel material.
13. The thermal-control system of claim 12 , wherein the gel material includes a silicone-rubber material injected with nanoparticles.