Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods
Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip having a further main surface comprising a plurality of second contacts, a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is mounted and a second surface on which the contact chip is mounted. A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.
1. A method of manufacturing an ultrasonic transducer assembly, comprising:
providing a wafer including:
a first array of ultrasonic transducer chips, each having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements;
a second array of contact chips, each having a further main surface comprising a plurality of second contacts for contacting a signal processing assembly; and
a sacrificial region separating the first array from the second array;
forming a flexible interconnect extending over said sacrificial region from the first contacts to the second contacts, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact;
removing the sacrificial region to release the first array and the second array;
providing a backing material comprising ultrasound absorbing and/or scattering bodies;
providing the first array on a first surface of said backing material; and
providing the second array on a second surface of said backing material such that the flexible interconnect extends from the first array to the second array over said backing material.
2. The method of claim 1 , wherein the step of forming the flexible interconnect comprises:
forming a layer of a first flexible and electrically insulating material extending over said sacrificial region from the first contacts to the second contacts, patterning the layer to form a first plurality of openings exposing the first contacts and a second plurality of openings exposing the second contacts;
forming a plurality of conductive tracks on said patterned layer, each of said conductive tracks being conductively coupled to one of said first contacts and to one of said second contacts.
3. The method of claim 2 , wherein the step of forming the flexible interconnect comprises forming a further layer of a second flexible and electrically insulating material covering the first layer and the plurality of conductive tracks.
4. A method of manufacturing an ultrasound probe comprising:
providing an ultrasonic transducer assembly manufactured in accordance with the method of claim 1 ;
providing a signal processing assembly including a plurality of carriers each carrier comprising:
a main carrier surface for carrying at least one signal processing circuit for processing signals from said transducer elements; and
a further carrier surface adjoining the main carrier surface, the further carrier surface comprising a plurality of carrier contacts for connecting to said at least one signal processing circuit;
forming an assembly of ultrasound probes by coupling each of the second contacts to a respective carrier contact; and
singulating the ultrasound probes.