Method of manufacturing semiconductor device having a plurality of channel layers
A semiconductor device includes a first semiconductor layer having first and second regions, a plurality of first channel layers spaced apart from each other in a vertical direction on the first region of the first semiconductor layer, a first gate electrode surrounding the plurality of first channel layers, a plurality of second channel layers spaced apart from one another in the vertical direction on the second region of the first semiconductor layer, and a second gate electrode surrounding the plurality of second channel layers, wherein each of the plurality of first channel layers has a first crystallographic orientation, and each of the plurality of second channel layers has a second crystallographic orientation different from the first crystallographic orientation, and wherein a thickness of each of the plurality of first channel layers is different from a thickness of each of the plurality of second channel layers.
1. A method of manufacturing a semiconductor device, the method comprising:
providing a first semiconductor layer having a first region and a second region, a buried insulating layer on the first semiconductor layer, and a second semiconductor layer on the buried insulating layer;
forming a first stack in which a plurality of first sacrificial layers and a plurality of first channel layers are alternately stacked on the second semiconductor layer;
removing the buried insulating layer, the second semiconductor layer, and a portion of the first stack on the second region using a mask pattern to expose the first semiconductor layer;
forming a base layer on an exposed second region and a second stack in which a plurality of second sacrificial layers and a plurality of second channel layers are alternately stacked on the base layer; and
patterning the first stack and the second stack in a fin shape,
wherein each of the plurality of first channel layers has a first crystallographic orientation, and each of the plurality of second channel layers has a second crystallographic orientation different from the first crystallographic orientation.
2. The method as claimed in claim 1 , wherein:
the first semiconductor layer has the second crystallographic orientation; and
the second semiconductor layer has the first crystallographic orientation.
3. The method as claimed in claim 1 , wherein:
the plurality of first channel layers and the plurality of second channel layers include silicon;
the first crystallographic orientation is a (110) orientation; and
the second crystallographic orientation is a (100) orientation.
4. The method as claimed in claim 1 , wherein:
the plurality of first channel layers and the plurality of second channel layers include silicon;
the first crystallographic orientation is a (100) orientation; and
the second crystallographic orientation is a (110) orientation.
5. The method as claimed in claim 1 , further comprising, after removing the portion of the first stack to expose the first semiconductor layer, forming a liner on a side surface of the first stack.
6. The method as claimed in claim 1 , wherein a thickness of each of the plurality of second channel layers is smaller than a thickness of each of the plurality of first channel layers.
7. The method as claimed in claim 1 , wherein a thickness of each of the plurality of second sacrificial layers is greater than a thickness of each of the plurality of first sacrificial layers.