Magnetic sensor component and assembly

1. A sensor, comprising:

a housing;

a lead frame comprising at least three elongated leads having an exterior portion extending from the housing;

at least one magnetic sensor circuit disposed in the housing, and connected to the lead frame;

the housing comprising at least two lateral recesses arranged on two opposite sides of the housing and/or at least two lateral protrusions arranged on two opposite sides of the housing, for allowing the sensor to be mounted by heat-stacking,

wherein the sensor comprises a first lateral side, and a second lateral side opposite the first lateral side; and

wherein the sensor comprises at least three lateral recesses, including a first, a second and a third lateral recess; and

wherein the sensor comprises at least three lateral protrusions, including a first, a second and a third lateral protrusion; and

wherein the first lateral recess and the first lateral protrusion are arranged substantially in the middle of the first lateral side; and

wherein the second lateral recess and the second lateral protrusion are arranged near a first end of the second lateral side; and

wherein the third lateral recess and the third lateral protrusion are arranged near a second end of the second lateral side, opposite the first end.

2. The sensor of claim 1 ,

wherein the sensor comprises the at least two lateral recesses and an equal amount of lateral protrusions, each one of said lateral protrusions being aligned with a corresponding one of said recesses.

3. A sensor, comprising:

a housing;

a lead frame comprising at least three elongated leads having an exterior portion extending from the housing;

at least one magnetic sensor circuit disposed in the housing, and connected to the lead frame;

the housing comprising at least two lateral recesses arranged on two opposite sides of the housing and/or at least two lateral protrusions arranged on two opposite sides of the housing, for allowing the sensor to be mounted by heat-stacking,

wherein the sensor further comprises a second magnetic sensor circuit; and

wherein the sensor comprises at least four elongated leads having an exterior portion extending from the housing; and

wherein the first magnetic sensor circuit is electrically connected to a first subset of said at least four elongated leads, and wherein the second magnetic sensor circuit is electrically connected to a second subset of said at least four elongated leads, the second subset being different from the first subset.

4. The sensor of claim 3 , wherein the first magnetic sensor circuit comprises a first magnetic sensor, and the second magnetic sensor circuit comprises a second magnetic sensor; and

wherein the second magnetic sensor circuit is arranged above or on top of the first magnetic sensor circuit, and is rotated with respect to the first magnetic sensor circuit such that a position of the first magnetic sensor substantially coincides with a position of the second magnetic sensor circuit.

5. A sensor, comprising:

a housing;

a lead frame comprising at least three elongated leads having an exterior portion extending from the housing;

at least one magnetic sensor circuit disposed in the housing, and connected to the lead frame;

the housing comprising at least two lateral recesses arranged on two opposite sides of the housing and/or at least two lateral protrusions arranged on two opposite sides of the housing, for allowing the sensor to be mounted by heat-stacking,

wherein the lead frame contains a first portion supporting the magnetic sensor circuit; and

wherein one of said at least three elongated leads is integrally formed with the first portion of the lead frame; and

wherein the lead frame is shaped such that the exterior portion of this one lead is connected to the first portion of the lead frame by means of an interconnection portion having a width smaller than a width of the exterior portion of this one lead.

6. The sensor of claim 5 , wherein the interconnection portion and an internal portion of said one lead form an L-shape or a T-shape.

7. The sensor of claim 5 , wherein the other elongated leads of the at least three elongated leads are each connected to said first portion of the lead frame by means of at least one discrete passive component.

8. A component assembly, comprising:

a sensor that includes

a housing,

a lead frame comprising at least three elongated leads having an exterior portion extending from the housing,

at least one magnetic sensor circuit disposed in the housing, and connected to the lead frame,

the housing comprising at least two lateral recesses arranged on two opposite sides of the housing and/or at least two lateral protrusions arranged on two opposite sides of the housing, for allowing the sensor to be mounted by heat-stacking;

the component assembly further comprising a support having a receiving zone, and a plurality of at least two first posts, and a plurality of electrical contacts; and

wherein the sensor is disposed on or over the support within the receiving zone such that at least one of the elongated leads is arranged adjacent one or more of the first posts; and

wherein the elongated leads are electrically connected to the electrical connections of the support.

9. The component assembly of claim 8 , wherein at least one of the second posts has a U-shaped cross-section for accommodating at least one of the lateral protrusions.

10. The component assembly of claim 8 , wherein at least one of the plurality of first posts is deformed so as to clamp at least one of the elongated leads and/or at least one of the tabs of the sensor to the support.

11. The component assembly of claim 8 , wherein at least one of the plurality of second posts is deformed so as to clamp the sensor to the support by means of at least one of its lateral recesses and/or by means of at least one of its lateral protrusions.

12. A method of producing the component assembly of claim 8 , the method comprising the steps of:

a) providing the sensor;

b) providing a support comprising a receiving zone, and a plurality of first posts, and a plurality of electrical contacts;

c) disposing the sensor on the support with at least one of its elongated leads adjacent at least one of the first posts;

d) electrically connecting the elongated leads of the sensor and the electrical contacts of the support.

13. The method of claim 12 , wherein step b) comprises: providing a support comprising a receiving zone, and a plurality of first posts, and a plurality of second posts, and a plurality of electrical contacts; and

wherein step c) comprises: c) disposing the sensor on the support with at least one of its elongated leads adjacent at least one of the first posts, and with at least one of its lateral recesses and/or at least one of its lateral protrusions adjacent at least one of the second posts.

14. The method of claim 12 , further comprising the step of:

e) deforming at least one of the first posts and/or at least one of the second posts, e.g. by heat-staking.

15. A sensor, comprising:

a housing;

a lead frame comprising at least three elongated leads, each having a respective exterior portion extending from the housing;

a magnetic sensor circuit disposed in the housing, and connected to the lead frame;

wherein the lead frame contains a first portion supporting the magnetic sensor circuit; and

wherein one of said at least three elongated leads is integrally formed with the first portion of the lead frame;

wherein the lead frame is shaped such that the exterior portion of this one lead is connected to the first portion of the lead frame by means of an interconnection portion; and

wherein the other elongated leads of the at least three elongated leads are each connected to said first portion of the lead frame by means of at least one discrete passive component.

16. The sensor of claim 15 , wherein the interconnection portion and an internal portion of said one lead form an L-shape or a T-shape.

17. A sensor, comprising:

a housing;

a lead frame comprising at least three elongated leads, each having a respective exterior portion extending from the housing;

a magnetic sensor circuit disposed in the housing, and connected to the lead frame;

wherein the lead frame contains a first portion supporting the magnetic sensor circuit; and

wherein one of said at least three elongated leads is integrally formed with the first portion of the lead frame;

wherein the lead frame is shaped such that the exterior portion of this one lead is connected to the first portion of the lead frame by means of an interconnection portion;

wherein the sensor further comprises a second magnetic sensor circuit; and

wherein the sensor comprises at least four elongated leads having an exterior portion extending from the housing; and

wherein the first magnetic sensor circuit is electrically connected to a first subset of said at least four elongated leads, and wherein the second magnetic sensor circuit is electrically connected to a second subset of said at least four elongated leads, the second subset being different from the first subset.

18. The sensor of claim 17 , wherein the first magnetic sensor circuit comprises a first magnetic sensor, and the second magnetic sensor circuit comprises a second magnetic sensor; and

wherein the second magnetic sensor circuit is arranged above or on top of the first magnetic sensor circuit, and is rotated with respect to the first magnetic sensor circuit such that a position of the first magnetic sensor substantially coincides with a position of the second magnetic sensor circuit.