Cooling device and process for cooling double-sided SiP devices during sputtering

1. A method of making a semiconductor device, comprising:

providing a cooling pad including a plurality of movable pins, wherein the cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway with each of the plurality of springs disposed under a respective movable pin;

providing a substrate including an electrical component disposed over a surface of the substrate;

disposing the substrate over the cooling pad with the electrical component oriented toward the cooling pad;

applying a force to the substrate to compress the springs, wherein at least one of the movable pins contacts the substrate; and

disposing a cooling fluid through the fluid pathway.

2. The method of claim 1 , further including sputtering a conductive layer over the substrate while the substrate is disposed over the cooling pad.

3. The method of claim 1 , further including disposing the cooling fluid through a heat exchanger.

4. The method of claim 1 , further including forming a coating over the plurality of movable pins.

5. The method of claim 4 , wherein a first movable pin of the plurality of movable pins contacts a second movable pin of the plurality of movable pins.

6. The method of claim 1 , wherein each of the plurality of movable pins includes a flange disposed in the fluid pathway.

7. A method of making a semiconductor device, comprising:

providing a cooling pad including a plurality of movable pins;

providing a substrate including a component disposed over a surface of the substrate; and

disposing the substrate over the cooling pad with a first movable pin contacting the component and a second movable pin contacting the substrate.

8. The method of claim 7 , further including disposing a first spring in the cooling pad under the first movable pin and a second spring in the cooling pad under the second movable pin.

9. The method of claim 7 , further including disposing a cooling fluid in the cooling pad.

10. The method of claim 9 , further including transferring the cooling fluid from the cooling pad to a heat exchanger.

11. The method of claim 7 , further including sputtering a conductive layer over the substrate.

12. The method of claim 7 , further including forming a coating on top surfaces of the plurality of movable pins.

13. The method of claim 7 , further including forming a coating on side surfaces of the plurality of movable pins.

14. A method of making a semiconductor device, comprising:

providing a cooling pad including a movable pin;

providing a substrate including a component disposed over a surface of the substrate; and

disposing the substrate over the cooling pad with the movable pin contacting the component.

15. The method of claim 14 , further including sputtering a conductive layer over the substrate while the substrate is disposed over the cooling pad.

16. The method of claim 14 , further including coupling the cooling pad to a heat exchanger.

17. The method of claim 14 , further including forming a coating over the movable pin.

18. The method of claim 14 , wherein the movable pin includes a flange disposed in the cooling pad.

19. A method of making a semiconductor device, comprising:

providing a cooling pad including a fluid pathway and a cooling fluid disposed in the cooling pathway;

disposing a pin in the fluid pathway; and

disposing a substrate over the cooling pad with the pin contacting the substrate or a component mounted to the substrate.

20. The method of claim 19 , further including disposing a spring in the cooling pad under the pin.

21. The method of claim 19 , further including transferring the cooling fluid from the cooling pad to a heat exchanger.

22. The method of claim 19 , further including sputtering a conductive layer over the substrate.

23. The method of claim 19 , further including forming a coating on a top surface of the pin.

24. The method of claim 19 , further including forming a coating on a side surface of the pin.