Methods for optical dielectric waveguide structure
An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.
1. A method comprising
forming a substrate;
forming an interconnection layer disposed on the substrate,
wherein the interconnection layer comprises at least a first electrical interconnection line;
forming a waveguide on the interconnection layer,
wherein the waveguide comprises a waveguide core, wherein the waveguide core comprises one or more adjacent and discrete SiON layers;
forming a first device disposed on the interconnection layer,
wherein the at least a first electrical interconnection line is configured to electrically connect a first terminal of the first device to a second terminal of a second device,
wherein each layer of the one or more adjacent and discrete SiON layers is configured to have a stress or to provide the waveguide having a stress having a magnitude less than or equal to 20 MPa.
2. A method as in claim 1
wherein the first device is configured to optically communicate with the waveguide.
3. A method as in claim 1
wherein each layer of the adjacent and discrete SiON layers comprises a level of impurity, a level of homogeneity, or a level of uniformity to provide a waveguide having an optical loss less than or equal to 1 dB/cm.
4. A method comprising
forming a substrate;
forming a first device fabricated on the substrate;
forming an interconnection layer disposed on the substrate and on the device,
wherein the interconnection layer comprises at least a first electrical interconnection line,
wherein the first electrical interconnection line is coupled to a first terminal of the first device;
forming a waveguide on the interconnection layer,
wherein the waveguide comprises one or more adjacent and discrete SiON layers,
wherein each layer of the one or more adjacent and discrete SiON layers is configured to provide a waveguide having a stress having a magnitude less than or equal to 20 MPa.
5. A method as in claim 4 further comprising
forming a second device on the interconnection layer and comprising an optical element or an optoelectrical element aligned with the waveguide.
6. A method as in claim 4 further comprising
forming a second device on the interconnection layer and comprising an optical element aligned with the waveguide and an electrical element electrical connected with the first electrical interconnection line or a second electrical interconnection line in the interconnection layer.
7. A method as in claim 4 further comprising
forming a second device on the interconnection layer and electrical connected with a second electrical interconnection line in the interconnection layer.
8. A method as in claim 4 further comprising
forming a second device on the interconnection layer and electrical connected with the first electrical interconnection line for electrically communicate with the first device.
9. A method comprising
forming a substrate;
forming an interconnection layer disposed on the substrate, wherein the interconnection layer comprises at least a first electrical interconnection line;
forming a waveguide on the interconnection layer,
wherein the waveguide comprises a waveguide core, wherein the waveguide core comprises one or more adjacent and discrete SiON layers,
wherein each layer of the one or more adjacent and discrete SiON layers is configured to have a stress having a magnitude less than or equal to 20 MPa;
forming a first device disposed on the interconnection layer,
wherein the at least a first electrical interconnection line is configured to be electrically coupled to a first terminal of the first device.
10. A method as in claim 9
wherein the first device is configured to optically communicate with the waveguide.
11. A method comprising
forming a substrate;
forming an interconnection layer disposed on the substrate, wherein the interconnection layer comprises at least a first electrical interconnection line;
forming a waveguide on the interconnection layer,
wherein the waveguide comprises a waveguide core, wherein the waveguide core comprises one or more adjacent and discrete SiON layers,
wherein each layer of the one or more adjacent and discrete SiON layers is configured to provide a waveguide having a stress having a magnitude less than or equal to 20 MPa;
forming a first device disposed on the interconnection layer,
wherein the at least a first electrical interconnection line is configured to be electrically coupled to a first terminal of the first device.
12. A method as in claim 11
wherein the first device is configured to optically communicate with the waveguide.
13. A method comprising
forming a substrate;
forming an interconnection layer disposed on the substrate, wherein the interconnection layer comprises at least a first electrical interconnection line;
forming a waveguide on the interconnection layer,
wherein the waveguide comprises a waveguide core, wherein the waveguide core comprises one or more adjacent and discrete SiON layers,
wherein each layer of the adjacent and discrete SiON layers comprises a level of impurity, a level of homogeneity, or a level of uniformity to provide a waveguide having an optical loss less than or equal to 1 dB/cm;
forming a first device disposed on the interconnection layer,
wherein the at least a first electrical interconnection line is configured to be electrically coupled to a first terminal of the first device.
14. A method as in claim 13
wherein the first device is configured to optically communicate with the waveguide.
15. A method as in claim 13 further comprising at least one of
forming a second device on the interconnection layer and comprising an optical element or an optoelectrical element aligned with the waveguide,
forming a second device on the interconnection layer and comprising an optical element aligned with the waveguide and an electrical element electrical connected with the first electrical interconnection line or a second electrical interconnection line in the interconnection layer,
forming a second device on the interconnection layer and electrical connected with a second electrical interconnection line in the interconnection layer, or
forming a second device on the interconnection layer and electrical connected with the first electrical interconnection line for electrically communicate with the first device.
16. A method comprising
forming a substrate;
forming a first device fabricated on the substrate;
forming an interconnection layer disposed on the substrate and on the device,
wherein the interconnection layer comprises at least a first electrical interconnection line,
wherein the first electrical interconnection line is coupled to a first terminal of the first device;
forming a waveguide on the interconnection layer,
wherein the waveguide comprises one or more adjacent and discrete SiON layers,
wherein each layer of the one or more adjacent and discrete SiON layers is configured to have a stress having a magnitude less than or equal to 20 MPa.
17. A method comprising
forming a substrate;
forming an interconnection layer disposed on the substrate,
wherein the interconnection layer comprises at least a first electrical interconnection line;
forming a waveguide on the interconnection layer,
wherein the waveguide comprises a waveguide core, wherein the waveguide core comprises one or more adjacent and discrete SiON layers;
forming a first device disposed on the interconnection layer,
wherein the at least a first electrical interconnection line is configured to electrically connect a first terminal of the first device to a second terminal of a second device,
wherein each layer of the adjacent and discrete SiON layers comprises a level of impurity, a level of homogeneity, or a level of uniformity to provide a waveguide having an optical loss less than or equal to 1 dB/cm.