Polishing head, substrate processing apparatus including the same and processing method of substrate using the same
A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.
1. A substrate processing apparatus comprising:
a conveyor belt on which a substrate is seated;
a polishing head which is connected to a driver and configured to face the substrate; and
in order between the substrate and the polishing head which faces the substrate:
a polishing pad having a temperature; and
a polishing pad fixing member which fixes the polishing head and the polishing pad to each other, directly receives heat from the polishing pad and has a temperature, the polishing pad fixing member extended in a plane between the polishing head and the polishing pad;
and
a temperature sensor which is adjacent to and spaced apart from the polishing pad fixing member, in the plane, the temperature sensor sensing the temperature of the polishing pad fixing member,
wherein the temperature of the polishing pad is defined by the sensed temperature of the polishing pad fixing member.
2. The substrate processing apparatus of claim 1 , wherein
the polishing head includes a magnet, and
the polishing pad fixing member together with the polishing pad is removably attachable to the polishing head by the magnet.
3. The substrate processing apparatus of claim 2 , wherein the polishing pad fixing member includes metal.
4. The substrate processing apparatus of claim 1 , wherein the temperature sensor includes an optical temperature sensor.
5. The substrate processing apparatus of claim 1 , wherein the polishing pad attached to the polishing head is movable together with the polishing head, along the substrate.
6. The substrate processing apparatus of claim 1 , further comprising a roller unit along which the conveyor belt is rotatable,
wherein rotation of the roller unit rotates the conveyor belt along the roller unit to move the substrate to and from the polishing head.
7. The substrate processing apparatus of claim 6 , wherein the roller unit includes:
a first roller and a second roller spaced apart from each other, and
rotation of the first roller and the second roller rotates the conveyor belt along the roller unit to move the substrate to and from the polishing head.
8. The substrate processing apparatus of claim 1 , wherein the polishing pad attached to the polishing head by the polishing pad fixing member, has a smaller planar area than a planar area of the substrate.
9. The substrate processing apparatus of claim 1 , further comprising:
a substrate support facing the polishing head with the conveyor belt therebetween;
a retainer guard corresponding to the substrate support; and
a polishing zone corresponding to the substrate support,
wherein the substrate disposed at the polishing zone disposes the retainer guard surrounding an outer edge of the substrate.
10. The substrate processing apparatus of claim 1 , further comprising a cleaning unit which cleans the polishing pad.