Multi-layer high-k gate dielectric structure

1. A device, comprising:

a substrate;

an interfacial layer disposed over and in direct contact with the substrate in a vertical direction;

a first gate dielectric layer disposed over and in direct contact with the interfacial layer, wherein the first gate dielectric layer has a first material composition; and

a second gate dielectric layer disposed over and in direct contact with an upper surface of the first gate dielectric layer, the upper surface facing upwardly in the vertical direction, wherein the second gate dielectric layer has a second material composition;

a gate electrode disposed over the second gate dielectric layer;

wherein:

the first material composition has a lower dielectric constant than the second material composition;

the first material composition and the second material composition each have greater dielectric constants than a dielectric constant of silicon oxide;

a bottom surface of the gate electrode is in direct contact with an upper surface of the second gate dielectric layer;

a concentration level of the first material composition varies as a function of depth within the first gate dielectric layer and reaches a first peak at about a midpoint of the first gate dielectric layer;

a concentration level of the second material composition varies as a function of depth within the second gate dielectric layer and reaches a second peak at about a midpoint of the second gate dielectric layer; and

the first peak is greater than the second peak.

2. The device of claim 1 , wherein the second material composition has fewer traps than the first material composition.

3. The device of claim 1 , wherein:

the first material composition comprises hafnium oxide; and

the second material composition comprises titanium oxide, or lanthanum oxide.

4. The device of claim 1 , wherein the first material composition corresponds to a single type of material.

5. The device of claim 1 , wherein a ratio between the first peak and the second peak is in a range between about 6:1 and about 22:1.

6. The device of claim 1 , wherein:

the first gate dielectric layer has a first thickness;

the second gate dielectric layer has a second thickness; and

the first thickness is greater than the second thickness.

7. The device of claim 6 , wherein a ratio of the first thickness and the second thickness is in a range between about 1.3:1 and about 5.6:1.

8. The device of claim 7 , wherein the ratio of the first thickness and the second thickness is in a range between about 2:1 and about 3.6:1.

9. A device, comprising:

a source region and a drain region disposed in a substrate;

a channel region disposed between the source region and the drain region; and

a gate structure disposed over the channel region in a vertical direction, wherein the gate structure includes: an interfacial layer that contains silicon oxide, a gate dielectric component, and a metal-containing gate electrode component;

wherein:

the gate dielectric component includes a plurality of different dielectric layers each having a greater dielectric constant than a dielectric constant of silicon oxide;

the different dielectric layers have different dielectric constants from one another;

a topmost one of the dielectric layers has a greater dielectric constant than a bottommost one of the dielectric layers;

a bottom surface of bottommost one of the dielectric layers is in physical contact with an upwardly-facing upper surface of the interfacial layer;

a side surface of the bottommost one of the dielectric layers is in physical contact with a side surface of the interfacial layer;

an upwardly-facing upper surface of the bottommost one of the dielectric layers is in physical contact in the vertical direction with another one of the dielectric layers disposed thereover;

an upper surface of the topmost one of the dielectric layers is in physical contact with a bottom surface of the metal-containing gate electrode; and

the bottommost one of the dielectric layers includes a first dielectric layer, and the another one of the dielectric layers includes a second dielectric layer disposed over the first dielectric layer;

the first dielectric layer is thicker than the second dielectric layer; and

the second dielectric layer has a greater dielectric constant than the first dielectric layer.

10. The device of claim 9 , wherein:

the first dielectric layer includes hafnium oxide; and

the second dielectric layer includes zirconium oxide.

11. The device of claim 9 , wherein the different dielectric layers have different levels of traps within.

12. The device of claim 9 , wherein:

the bottommost one of the dielectric layers has a first peak associated with a first material composition;

the topmost one of the dielectric layers has a second peak associated with a second material composition; and

a ratio between the first peak and the second peak is in a range between about 6:1 and about 22:1.

13. The device of claim 12 , wherein:

the first peak occurs at about a midpoint depth level of the bottommost one of the dielectric layers; and

the second peak occurs at about a midpoint depth level of the topmost one of the dielectric layers.

14. A device, comprising:

a substrate;

an interfacial layer disposed over and in physical contact with the substrate in a vertical direction;

a first gate dielectric layer disposed over and in physical contact with the interfacial layer, wherein the first gate dielectric layer contains hafnium oxide and has a first thickness;

a second gate dielectric layer disposed over and in physical contact with an upwardly-facing surface of the first gate dielectric layer, wherein the upwardly-facing surface of the first gate dielectric layer faces upwards in the vertical direction, wherein the second gate dielectric layer contains zirconium oxide, titanium oxide, or lanthanum oxide and has a second thickness, wherein a ratio of the first thickness and the second thickness is in a range between about 2:1 and about 3.6:1; and

a gate electrode disposed over, and in direct contact with, the second gate dielectric layer.

15. The device of claim 14 , wherein the second gate dielectric layer has fewer traps than the first gate dielectric layer.

16. The device of claim 14 , wherein: the interfacial layer contains silicon oxide and hafnium oxide.

17. The device of claim 14 , wherein the gate electrode further includes a capping layer that prevents diffusion or reaction between the second gate dielectric layer and a rest of the gate electrode.

18. The device of claim 14 , wherein a peak concentration level of the hafnium oxide within the first gate dielectric layer is greater than a peak concentration level of the zirconium oxide, the titanium oxide, or the lanthanum oxide within the second gate dielectric layer.

19. The device of claim 18 , wherein a ratio of the peak concentration level of the hafnium oxide within the first gate dielectric layer and the peak concentration level of the zirconium oxide, the titanium oxide, or the lanthanum oxide within the second gate dielectric layer is in a range between about 6:1 and about 22:1.