Power module including lead frame unit connecting first substrate and second substrate
A power module is disclosed. A power module according to an embodiment of the present disclosure may include a first substrate and a second substrate spaced apart from each other, an electronic device unit provided on at least either one of the first and second substrates, and a lead frame unit provided between the first and second substrates. One side of the lead frame unit may be connected to an external circuit, and the other side thereof may be configured to electrically connect the first and second substrates. Accordingly, the lead frame unit may perform a function of electrically connecting the first and second substrates instead of a via spacer in the related art.
1. A power module, comprising:
a first substrate and a second substrate,
wherein the first substrate and the second substrate are configured with space between the substrates;
an electronic device unit provided on at least one of the first and second substrates; and
a lead frame unit, a first side of which is configured to connect to an external circuit, and a second side of which is provided between the first and second substrates to electrically connect the first and second substrates,
wherein the lead frame unit comprises:
a first portion, provided at the second side of the lead frame unit, having a first contact surface in contact with the surface of the first substrate facing the second substrate;
a second portion, provided at the second side of the lead frame unit, having a second contact surface in contact with the surface of the second substrate facing the first substrate;
a terminal portion provided at the first side of the lead frame unit and configured to be connected to the external circuit, and
inclined portions provided at the second side of the lead frame unit, and inclined towards the first and second substrates facing each other,
wherein the first portion and the second portion are spaced apart from each other by a predetermined interval defining a gap portion between the first and second portions, and
wherein the inclined portions comprise:
a first inclined surface inclined towards the surface of the first substrate facing the second substrate, the first inclined surface connecting the terminal portion and the first portion; and
a second inclined surface inclined towards the surface of the second substrate facing the first substrate, the second inclined surface connecting the terminal portion and the second portion,
wherein the power module further comprises:
a spacer provided between the electronic device unit and one of the first and second substrates,
wherein both sides of the spacer are respectively provided with a solder layer made of solder to electrically connect the electronic device unit and the first substrate or the second substrate and the spacer,
wherein the spacer is made of an electrically conductive material,
wherein the electronic device unit further comprises:
a first electronic device provided on the first substrate; and
a second electronic device provided on the second substrate, and
wherein the lead frame unit provides a transmission path for power and signals between the first and second electronic devices and the external circuit.
2. The power module of claim 1 , wherein the lead frame unit is provided in plurality, and includes a first lead frame and a second lead frame, respective first sides of which are configured to connect to different regions of the external circuit, and
at least one second side of the first or second lead frames is in contact with the first substrate to electrically connect the first and second substrates.
3. The power module of claim 2 , wherein each of the first and second lead frames provides a transmission path for at least one of power and signals through the external circuit.
4. The power module of claim 1 , wherein at least one of the first portion and the second portion is configured to deform towards the surface of the first substrate facing the second substrate or the surface of the second substrate facing the first substrate.
5. The power module of claim 1 , wherein the first inclined surface is configured to define a first slope with respect to the surface of the first substrate facing the second substrate, and the second inclined surface is configured to define a second slope with respect to the surface of the second substrate facing the first substrate,
wherein the first and second inclined surfaces are disposed such that the first and second slopes are different from each other.
6. The power module of claim 1 , wherein the first inclined surface is configured to define a first slope with respect to the surface of the first substrate facing the second substrate, and the second inclined surface is configured to define a second slope with respect to the surface of the second substrate facing the first substrate,
wherein the first and second inclined surfaces are disposed such that the first and second slopes are the same as each other.
7. The power module of claim 1 , wherein at least one of the first substrate and the second substrate comprises:
a dielectric layer portion made of a dielectric material; and
a first metal layer portion and a second metal layer portion made of metal, and respectively bonded onto opposite sides of the dielectric layer portion.
8. The power module of claim 7 , wherein at least one of the first metal layer portion and the second metal layer portion is made of copper.