Polyamic acid, polyamic acid solution, polyimide, polyimide film, laminate and flexible device, and method for producing polyimide film
A polyamic acid that is a polyaddition reaction product of a diamine and a tetracarboxylic dianhydrides, according to one or more embodiments of the present invention. The polyamic acid contains 2′-bistrifluoromethylbenzidine as a diamine component in addition to 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride as tetracarboxylic dianhydride components. The polyamic acid may include 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride in an amount ranging from 0.5 mol % or more to 10 mol % or less based on total amount of the tetracarboxylic anhydride.
1. A polyamic acid which is a polyaddition reaction product of a diamine and a tetracarboxylic dianhydride,
wherein:
the diamine comprises 2,2′-bistrifluoromethylbenzidine,
the tetracarboxylic dianhydride comprises 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride,
the 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride is comprised in an amount of 0.5 mol % or more and 10 mol % or less based on a total amount of the tetracarboxylic anhydride, and
an amount of the 2,2′-bistrifluoromethylbenzidine based on a total amount of the diamine is 90 mol % or more.
2. A polyamic acid which is a polyaddition reaction product of a diamine and a tetracarboxylic dianhydride,
wherein:
the diamine comprises 2,2′-bistrifluoromethylbenzidine,
the tetracarboxylic dianhydride comprises 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride,
the 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride is comprised in an amount of 0.5 mol % or more and 10 mol % or less based on a total amount of the tetracarboxylic anhydride,
the tetracarboxylic dianhydride further comprises pyromellitic anhydride, and
the pyromellitic anhydride is comprised in an amount of 10 mol % or more and 50 mol % or less based on the total amount of the tetracarboxylic anhydrides.
3. A polyamic acid solution comprising:
the polyamic acid according to claim 2 ; and
an organic solvent.
4. The polyamic acid solution according to claim 3 , further comprising an imidazole compound.
5. The polyamic acid solution according to claim 4 ,
wherein a content of the imidazole compound is 0.10 mole or less based on 1 mole of an amide group of the polyamic acid.
6. A polyimide which is a polycondensation reaction product of a diamine and tetracarboxylic dianhydride,
wherein:
the diamine comprises 2,2′-bistrifluoromethylbenzidine,
the tetracarboxylic dianhydride comprises 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride,
the 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride is comprised in an amount of 0.5 mol % or more and 10 mol % or less based on a total amount of the tetracarboxylic anhydrides, and
an amount of the 2,2′-bistrifluoromethylbenzidine based on a total amount of the diamine is 90 mol % or more.
7. A polyimide which is a polycondensation reaction product of a diamine and tetracarboxylic dianhydride,
wherein:
the diamine comprises 2,2′-bistrifluoromethylbenzidine,
the tetracarboxylic dianhydride comprises 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride,
the 9,9′-(3,4′-dicarboxyphenyl)fluorenic dianhydride is comprised in an amount of 0.5 mol % or more and 10 mol % or less based on a total amount of the tetracarboxylic anhydrides,
the tetracarboxylic dianhydride further comprises pyromellitic anhydride, and
the pyromellitic anhydride is comprised in an amount of 10 mol % or more and 50 mol % or less based on the total amount of the tetracarboxylic anhydrides.
8. A polyimide film comprising the polyimide according to claim 7 .
9. The polyimide film according to claim 8 ,
wherein the polyimide film has a glass transition temperature of 380° C. or higher, and
wherein the polyimide film has a coefficient of thermal expansion during heating from 100° C. to 400° C. of 100 ppm/K or less.
10. The polyimide film according to claim 8 ,
wherein the polyimide film has a light transmittance at a wavelength of 450 nm of 75% or more, and
wherein the polyimide film has a haze of 1.2% or less.
11. A laminate comprising:
a base substrate, wherein the polyimide film according to claim 8 is disposed on the base substrate.
12. A flexible device comprising:
the polyimide film according to claim 8 ; and
an electronic element disposed on the polyimide film.
13. A method for producing a polyimide film comprising:
coating a base substrate with the polyamic acid solution according to claim 3 to form a laminate in which a film-shaped polyamic acid is disposed on the base substrate; and
heating the laminate to imidize the polyamic acid.
14. The method for producing the polyimide film according to claim 13 ,
wherein the laminate is heated at a temperature in a range of 380° C. or higher and 500° C. or lower for an amount of time ranging from 10 minutes or more to 60 minutes or less.
15. A method for producing a polyimide film comprising:
forming the polyimide film by the method according to claim 13 ; and
peeling the base substrate and the polyimide film from each other.
16. The method for producing the polyimide film according to claim 15 ,
wherein the base substrate and the polyimide film are peeled from each other by laser irradiation.